Method of manufacturing fine pattern and method of manufacturing display device using the same

US11718082B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11718082-B2
Application numberUS-201816757430-A
CountryUS
Kind codeB2
Filing dateOct 17, 2018
Priority dateOct 20, 2017
Publication dateAug 8, 2023
Grant dateAug 8, 2023

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method of manufacturing a fine pattern using the following steps of: (1) coating a resist composition containing a novolak resin having an alkali dissolution rate of 100 to 3,000 Å on a substrate to form a resist composition layer; (2) subjecting said resist composition layer to exposure; (3) developing said resist composition layer to form a resist pattern; (4) subjecting said resist pattern to flood exposure; (5) coating a fine pattern forming composition on the surface of said resist pattern to form a fine pattern forming composition layer; (6) heating said resist pattern and said fine pattern forming composition layer to cure the regions of said fine pattern forming composition layer in the vicinity of said resist pattern and to form an insolubilized layer; and (7) removing uncured regions of said fine pattern forming composition layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of manufacturing a fine pattern comprising the following steps of: (1) a step of coating a resist composition comprising a novolak resin having an alkali dissolution rate of 100 to 3,000 A on a substrate to form a resist composition layer; (2) a step of subjecting said resist composition layer to exposure; (3) a step of developing said resist composition layer to form a resist pattern; (4) a step of subjecting said resist pattern to flood exposure; (5) a step of coating a fine pattern forming composition on the surface of said resist pattern to form a fine pattern forming composition layer; (6) a step of heating said resist pattern and said fine pattern forming composition layer to cure the regions of said fine pattern forming composition layer in the vicinity of said resist pattern and to form an insolubilized layer; and (7) a step of removing uncured regions of said fine pattern forming composition layer and wherein the exposure in the step (2) is performed using a projector lens having a numerical aperture of 0.08-0.15 and wherein a resist pattern is formed and has a cross section shape of a hole or a line is observed, L 1 is the pattern width at a 10 percent portion (D 1 ) of the depth and L 2 is the pattern width at a 90 percent portion (D 2 ) of the depth and has a Taper index (L 2 /L 1 ) of the fine pattern is 1.05-18. 2. The method according to claim 1 , wherein the exposure in the step (2) is performed using an exposure apparatus having a resolution limit of 1.5-5.0 μm. 3. The method according to claim 1 , wherein the exposure amount in the step (2) is 15-80 mJ/cm 2 . 4. The method according to claim 1 , wherein the exposure in step (2) is preformed by a light irradiated at a wavelength of 300-450 nm. 5. The method according to claim 1 , wherein the mass average molecular weight of said novolak resin is 1,500-25,000. 6. The method according to claim 1 , further comprising step (3-1) which is a step of heating said resist pattern. 7. The method according to claim 1 , wherein said fine pattern forming composition comprises a cross-linking agent, a polymer, and a solvent. 8. The method according to claim 1 , wherein the viscosity of said fine pattern forming composition measured by a capillary viscometer at 25° C. is 1-120 cP. 9. The method according to claim 1 , wherein the shrink amount of said fine pattern is 0.05-1.00 μm. 10. The method according to claim 1 , wherein the temperature of the heating in the step (6) is 50-140° C. 11. The method according to claim 1 , wherein the uncured regions are removed by contacting said fine pattern forming composition layer and water, a liquid mixture of water and a water-soluble organic solvent, or an alkali aqueous solution in the step (7). 12. The method according to claim 1 , wherein the cross section shape of said resist pattern is a taper shape. 13. A method of manufacturing a display device comprising using a fine pattern made by the method according to claim 1 .

Assignees

Inventors

Classifications

  • H10P76/204Primary

    of organic photoresist masks · CPC title

  • Heat treatment (for heating or cooling of layers during lamination B32B37/06, B32B37/08) · CPC title

  • Variation across the thickness of the layer · CPC title

  • Coating curved surfaces · CPC title

  • Curved surfaces {(G03F7/70 takes precedence)} · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11718082B2 cover?
A method of manufacturing a fine pattern using the following steps of: (1) coating a resist composition containing a novolak resin having an alkali dissolution rate of 100 to 3,000 Å on a substrate to form a resist composition layer; (2) subjecting said resist composition layer to exposure; (3) developing said resist composition layer to form a resist pattern; (4) subjecting said res…
Who is the assignee on this patent?
Merck Patent Gmbh
What technology area does this patent fall under?
Primary CPC classification H10P76/204. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 08 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).