Low-profile magnetic antenna assemblies

US11715882B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11715882-B2
Application numberUS-202117471292-A
CountryUS
Kind codeB2
Filing dateSep 10, 2021
Priority dateJan 2, 2021
Publication dateAug 1, 2023
Grant dateAug 1, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An antenna assembly includes a first magnetic substrate having a first surface and a second surface opposite from the first surface. One or more antenna elements are disposed on the first surface of the first magnetic substrate. A microstrip feed line is disposed on the second surface of the first magnetic substrate. A second magnetic substrate is secured to the first magnetic substrate. The second magnetic substrate includes one or more cavities aligned with the one or more antenna elements and the microstrip feed line.

First claim

Opening claim text (preview).

What is claimed is: 1. An antenna assembly comprising: a first magnetic substrate having a first surface and a second surface opposite from the first surface; one or more antenna elements disposed on the first surface of the first magnetic substrate; a microstrip feed line disposed on the second surface of the first magnetic substrate; a second magnetic substrate secured to the first magnetic substrate, wherein the second magnetic substrate comprises one or more cavities aligned with the one or more antenna elements and the microstrip feed line; a ground plane connected to the second magnetic substrate, wherein the one or more cavities are disposed between the one or more antenna elements and the ground plane. 2. The antenna assembly of claim 1 , wherein the microstrip feed line is disposed between the one or more antenna elements and the one or more cavities. 3. The antenna assembly of claim 1 , further comprising a third magnetic substrate, and wherein the third magnetic substrate is secured to the second magnetic substrate. 4. The antenna assembly of claim 1 , wherein the antenna assembly is devoid of electrical vias. 5. The antenna assembly of claim 1 , wherein the second magnetic substrate is secured to the first magnetic substrate by a first laminate layer. 6. The antenna assembly of claim 1 , wherein the second magnetic substrate has a first surface and a second surface opposite from the first surface, wherein the one or more cavities extend through and between the first surface and the second surface of the second magnetic substrate. 7. The antenna assembly of claim 1 , wherein the one or more antenna elements are one or more rectangular patch antenna elements having inclusive slots. 8. The antenna assembly of claim 1 , wherein the one or more cavities extend below the one or more antenna elements and the microstrip feed line. 9. The antenna assembly of claim 1 , wherein the one more cavities define an axial envelope that contains the one or more antenna elements and the microstrip feed line. 10. The antenna assembly of claim 1 , wherein the first magnetic substrate and the second magnetic substrate have a magnetic permeability greater than 1. 11. The antenna assembly of claim 1 , wherein the first magnetic substrate and the second magnetic substrate have a magnetic permittivity of at least 6 and a magnetic permeability of at least 6. 12. A method of forming an antenna assembly, the method comprising: disposing one or more antenna elements on a first surface of a first magnetic substrate; disposing a microstrip feed line on a second surface of the first magnetic substrate, wherein the second surface is opposite from the first surface; forming one or more cavities in a second magnetic substrate; securing the second magnetic substrate to the first magnetic substrate, wherein said securing comprises aligning the one or more cavities with the one or more antenna elements and the microstrip feed line; and connecting a ground plane to the second magnetic substrate, wherein said connecting comprises disposing the one or more cavities between the one or more antenna elements and the ground plane. 13. The method of claim 12 , wherein the second magnetic substrate has a first surface and a second surface opposite from the first surface, wherein the one or more cavities extend through and between the first surface and the second surface of the second magnetic substrate. 14. The method of claim 13 , wherein said connecting further comprises disposing the microstrip feed line between the one or more antenna elements and the one or more cavities. 15. The method of claim 12 , wherein said securing comprises securing the second magnetic substrate to the first magnetic substrate by a first laminate layer. 16. The method of claim 12 , wherein said securing comprises containing one or more antenna elements and the microstrip feed line within an axial envelope defined by the one or more cavities. 17. An antenna assembly comprising: a first magnetic substrate having a first surface and a second surface opposite from the first surface; one or more antenna elements disposed on the first surface of the first magnetic substrate; a microstrip feed line disposed on the second surface of the first magnetic substrate; a second magnetic substrate secured to the first magnetic substrate by a first laminate layer, wherein the second magnetic substrate comprises one or more cavities aligned with the one or more antenna elements and the microstrip feed line, and wherein the one or more cavities define an axial envelope that contains the one or more antenna elements and the microstrip feed line; a third magnetic substrate secured to the second magnetic substrate by a second laminate layer; and a ground plane secured to the third magnetic substrate, wherein the one or more cavities are disposed between the one or more antenna elements and the ground plane, wherein the microstrip feed line is disposed between the one or more antenna elements and the one or more cavities. 18. The antenna assembly of claim 17 , wherein the first magnetic substrate and the second magnetic substrate have a magnetic permeability greater than 1. 19. The antenna assembly of claim 17 , wherein the first magnetic substrate and the second magnetic substrate have a magnetic permittivity of at least 6 and a magnetic permeability of at least 6. 20. An antenna assembly comprising: a first magnetic substrate having a first surface and a second surface opposite from the first surface; one or more antenna elements disposed on the first surface of the first magnetic substrate; a microstrip feed line disposed on the second surface of the first magnetic substrate; and a second magnetic substrate secured to the first magnetic substrate, wherein the second magnetic substrate comprises one or more cavities aligned with the one or more antenna elements and the microstrip feed line, wherein the second magnetic substrate has a first surface and a second surface opposite from the first surface, wherein the one or more cavities extend through and between the first surface and the second surface of the second magnetic substrate.

Assignees

Inventors

Classifications

  • H01Q15/004Primary

    using superconducting materials or magnetised substrates · CPC title

  • substantially flush mounted with the skin of the craft · CPC title

  • electromagnetically coupled to the feed line · CPC title

  • H01Q21/065Primary

    Patch antenna array · CPC title

  • Structural form of radiating elements, e.g. cone, spiral, umbrella; {Particular materials used therewith}(H01Q1/08, H01Q1/14 take precedence) · CPC title

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What does patent US11715882B2 cover?
An antenna assembly includes a first magnetic substrate having a first surface and a second surface opposite from the first surface. One or more antenna elements are disposed on the first surface of the first magnetic substrate. A microstrip feed line is disposed on the second surface of the first magnetic substrate. A second magnetic substrate is secured to the first magnetic substrate. The se…
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification H01Q15/004. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 01 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).