Repair compound and methods of use

Patent metadata

Field	Value
Publication number	US-11713278-B2
Application number	US-202117143018-A
Country	US
Kind code	B2
Filing date	Jan 6, 2021
Priority date	Jun 20, 2014
Publication date	Aug 1, 2023
Grant date	Aug 1, 2023

Abstract

A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

First claim

What is claimed is:

1. A repair compound comprising:
a latex resin or resin binder;
a thickener;
hydrophobic fibrillated fibers and hydrophilic fibers; and
a filler material,
wherein the thickener is a hydrophilic alkali swellable emulsion present in an amount of no greater than about 1% by weight of the total repair compound,
wherein the hydrophobic fibrillated fibers include polyethylene fibers, the hydrophilic fibers include rayon fibers, or both,
and wherein the hydrophobic fibrillated fibers have a nominal length and the hydrophilic fibers have a nominal length, and the hydrophobic fibrillated fiber nominal length is less than the hydrophilic fiber nominal length, wherein the repair compound exhibits pseudoplastic behavior and has a density of not greater than 4.0 lbs/gal.

2. The repair compound of claim 1 , wherein the latex resin or resin binder is 100% acrylate.

3. The repair compound of claim 1 , wherein each of the hydrophobic fibrillated fibers and hydrophilic fibers are present in an amount of less than about 1 percent by weight of the total repair compound.

4. The repair compound of claim 1 , wherein the hydrophobic fibrillated fiber nominal length is at least 10 times less than the hydrophilic fiber nominal length.

5. The repair compound of claim 1 , wherein the filler material includes a synthetic inorganic filler.

6. The repair compound of claim 5 , wherein the synthetic inorganic filler comprises a bimodal particle size mixture of larger synthetic inorganic filler particles and smaller synthetic inorganic filler particles, the mixture having a particle size ratio of larger size synthetic inorganic filler particles to smaller size synthetic inorganic filler particles of at least about 5:1.

7. The repair compound of claim 5 , wherein the synthetic inorganic filler is comprised of substantially spherical particles.

8. The repair compound of claim 7 , wherein the synthetic inorganic filler is glass bubbles.

9. The repair compound of claim 1 , wherein the repair compound further comprises titanium dioxide and wherein the titanium dioxide is present in an amount of between about 5% by weight and about 20% by weight.

10. A kit including the repair compound of claim 1 , a tool for spreading the repair compound, and optionally a backing device for establishing a scaffolding structure.

11. A method for repairing a hole in a surface, the method comprising:
providing the repair compound of claim 1 ;
spreading a quantity of the repair compound into a hole; and
allowing the repair compound to harden.

12. The method of claim 11 , further comprising abrading the hardened compound.

13. The method of claim 11 , further comprising inserting a backing device for establishing a scaffolding structure into the hole.

14. The method of claim 11 , wherein spreading the quantity of repair compound into the hole further comprises spreading the quantity of the repair compound along a surface surrounding the hole.

15. The method of claim 11 , further comprising shaping the quantity of repair compound by hand.

Assignees

• 3M Innovative Properties Company

Inventors

• Gozum John E
• Wang Danli
• Schoenherr Dwight B

Classifications

• C04B26/06 Primary

  Acrylates · CPC title

• B29C73/02

  using liquid or paste-like material (B29C73/16 takes precedence) · CPC title

• C04B26/026

  Proteins or derivatives thereof · CPC title

• C04B26/04

  obtained by reactions only involving carbon-to-carbon unsaturated bonds · CPC title

• C04B26/28

  Polysaccharides or derivatives thereof · CPC title