Repair compound and methods of use

Patent metadata

Field	Value
Publication number	US-10273185-B2
Application number	US-201515312317-A
Country	US
Kind code	B2
Filing date	Jun 10, 2015
Priority date	Jun 20, 2014
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

First claim

What is claimed is:

1. A repair compound comprising:
a latex resin or resin binder;
a thickener;
hydrophobic fibrillated fibers and hydrophilic fibers, wherein the hydrophobic fibrillated fibers include polyethylene fibers, the hydrophilic fibers include rayon fibers, or both; and
a filler material;
wherein the repair compound exhibits pseudoplastic behavior and has a density of not greater than 4.0 lbs/gal.

2. The repair compound of claim 1 , wherein the latex resin or resin binder is one of a vinyl acrylic polymer or copolymer, an acrylic polymer or copolymer, an acrylate polymer or copolymer, a polyvinyl acetate polymer or copolymer, an ethylene vinyl acetate polymer or copolymer, a styrene-butadiene polymer or copolymer, a polyacrylamide polymer or copolymer, a natural rubber latex, a natural starch, a synthetic starch, and/or casein.

3. The repair compound of claim 1 , wherein the latex resin or resin binder is 100% acrylate.

4. The repair compound of claim 1 , wherein the latex resin or resin binder includes a resin blend.

5. The repair compound of claim 4 , wherein the resin blend includes one latex resin and one non-latex resin.

6. The repair compound of claim 1 , wherein the thickener includes at least one of polyethylene glycol, polyethylene oxide, polyethylene oxide/polypropylene oxide copolymers, polyvinyl alcohol, polymers or copolymers of ethylenically unsaturated carboxylic acids and their derivatives, guar gum, xanthan gum, alginates, tragacanth gum, pectin, amylopectin, dextran, polydextrose, and polysaccharides and derivatives thereof.

7. The repair compound of claim 6 , wherein the polymers or copolymers of ethylenically unsaturated carboxylic acids and their derivatives include acrylic acid and acrylamide.

8. The repair compound of claim 1 , wherein the thickener is a hydrophilic alkali swellable emulsion.

9. The repair compound of claim 6 , wherein the thickener includes at least one of methyl cellulose, hydroxypropyl cellulose, hydroxypropyl methyl cellulose, hydroxyethyl cellulose, hydroxyethyl methyl cellulose, hydroxyethyl hydroxypropyl cellulose, ethylhydroxyethyl cellulose, and sodium carboxymethyl cellulose.

10. The repair compound of claim 1 , wherein the thickener is present in an amount of about 1% by weight or less.

11. The repair compound of claim 1 , wherein each of the hydrophobic fibrillated fibers and hydrophilic fibers are present in an amount of less than about 1 percent by weight of the total compound.

12. The repair compound of claim 11 , wherein the hydrophobic fibrillated fibers have a nominal length and the hydrophilic fibers have a nominal length and the hydrophobic fibrillated fiber nominal length is less than the hydrophilic fiber nominal length.

13. The repair compound of claim 12 , wherein the hydrophobic fibrillated fiber nominal length is at least 10 times less than the hydrophilic fiber nominal length.

14. The repair compound of claim 1 , wherein the filler material includes a synthetic inorganic filler.

15. The repair compound of claim 14 , wherein the synthetic inorganic filler comprises a bimodal particle size mixture of larger synthetic inorganic filler particles and smaller synthetic inorganic filler particles.

16. The repair compound of claim 15 , having a particle size ratio of larger size synthetic inorganic filler particles to smaller size synthetic inorganic filler particles of at least about 5:1.

17. The repair compound of claim 14 , wherein the synthetic inorganic filler is comprised of substantially spherical particles.

18. The repair compound of claim 14 , wherein the synthetic inorganic filler includes glass bubbles.

19. The repair compound of claim 1 , further comprising an adhesion promoter, an activator, a pH control agent, a colorant, a primer, a smoothing agent, water, and/or a preservative.

20. The repair compound of claim 1 , further comprising titanium dioxide.

21. The repair compound of claim 20 , wherein the titanium dioxide is present in an amount of between about 5% by weight and about 20% by weight.

22. The repair compound of claim 1 , wherein the repair compound has a freeze/thaw stability of at least five cycles.

23. A repair compound comprising:
a latex resin or resin binder;
a thickener;
hydrophobic fibrillated fibers and hydrophilic fibers, wherein the hydrophobic fibrillated fibers include polyethylene fibers, the hydrophilic fibers include rayon fibers, or both;
and a filler material, wherein the repair compound has a density of not greater than 4.0 lbs/gal.

24. The repair compound of claim 23 , wherein the hydrophobic fibrillated fibers have a nominal length and the hydrophilic fibers have a nominal length and the hydrophobic fibrillated fiber nominal length is less than the hydrophilic fiber nominal length.

25. The repair compound of claim 23 , wherein the hydrophobic fibrillated fiber nominal length is at least 10 times less than the hydrophilic fiber nominal length.

26. The repair compound of claim 23 , wherein the latex resin or resin binder is one of a vinyl acrylic polymer or copolymer, an acrylic polymer or copolymer, an acrylate polymer or copolymer, a polyvinyl acetate polymer or copolymer, an ethylene vinyl acetate polymer or copolymer, a styrene-butadiene polymer or copolymer, a polyacrylamide polymer or copolymer, a natural rubber latex, a natural starch, a synthetic starch, and casein.

27. The repair compound of claim 23 , wherein the latex resin or resin binder is 100% acrylate.

28. The repair compound of claim 23 , wherein the latex resin or resin binder includes a resin blend.

29. The repair compound of claim 28 , wherein the resin blend includes one latex resin and one non-latex resin.

30. The repair compound of claim 1 , wherein the thickener includes at least one of polyethylene glycol, polyethylene oxide, polyethylene oxide/polypropylene oxide copolymers, polyvinyl alcohol, polymers or copolymers of ethylenically unsaturated carboxylic acids and their derivatives, guar gum, xanthan gum, alginates, tragacanth gum, pectin, amylopectin, dextran, polydextrose, and polysaccharides and derivatives thereof.

31. The repair compound of claim 30 , wherein the polymers or copolymers of ethylenically unsaturated carboxylic acids and their derivatives include acrylic acid and acrylamide.

32. The repair compound of claim 23 , wherein the thickener is a hydrophilic alkali swellable emulsion.

33. The repair compound of claim 23 , further comprising a pH control agent and an organic ether smoothing agent.

34. The repair compound of claim 23 , wherein the thickener is present in an amount of about 1% by weight or less.

35. The repair compound of claim 23 , wherein the filler material includes a synthetic inorganic filler.

36. The repair compound of claim 23 , wherein the filler material comprises a bimodal particle size mixture of larger synthetic inorganic filler particles and smaller synthetic inorganic filler particles.

37. The repair compound of claim 36 , wherein the bimodal mixture has a particle size ratio of larger size synthetic inorganic filler particles to smaller size synthetic inorganic filler particles of at least about 5:1.

38. The repair compound of

Assignees

• 3M Innovative Properties Co

Inventors

• Gozum John E
• Wang Danli
• Schoenherr Dwight B

Classifications

• E04G23/02

  Repairing, e.g. filling cracks; Restoring; Altering; Enlarging {(compositions of filling material C04B; strengthening, widening, repairing of bridges E01D22/00; drying damp layers by temporary mechanical ventilation E04B1/7092)} · CPC title

• C09D133/08

  Homopolymers or copolymers of acrylic acid esters · CPC title

• C08L33/08 Primary

  Homopolymers or copolymers of acrylic acid esters · CPC title

• C08K7/20

  Glass · CPC title

• C08K7/02

  Fibres or whiskers · CPC title