Substrate support and plasma processing apparatus

Patent metadata

Field	Value
Publication number	US-11705302-B2
Application number	US-202017023939-A
Country	US
Kind code	B2
Filing date	Sep 17, 2020
Priority date	Oct 1, 2019
Publication date	Jul 18, 2023
Grant date	Jul 18, 2023

Abstract

A disclosed substrate support includes a base and first and second supports. A refrigerant flow path is formed inside the base. The base has first to third regions. The first region has a circular upper surface. The second region surrounds the first region. The third region surrounds the second region. The upper surface of the first region, the upper surface of the second region, and the upper surface of the third region are flat and continuous. The first support is provided on the first region and is configured to support the substrate placed thereon. The second support is provided on the third region to surround the first support, is configured to support the edge ring placed thereon, and is separated from the first support.

First claim

What is claimed is:

1. A substrate support comprising:
a base with a refrigerant flow path formed therein, the base having a first region having a circular upper surface, a second region extending outward from the first region in a radial direction and surrounding the first region, and a third region extending outward from the second region in the radial direction and surrounding the second region, and the upper surface of the first region, an upper surface of the second region, and an upper surface of the third region being flat and continuous;
a first support provided on the first region and configured to support a substrate placed thereon; and
a second support provided on the third region to surround the first support, configured to support an edge ring placed thereon, and separated from the first support,
wherein the refrigerant flow path has a first flow path extending in the first region, a second flow path extending around a central axis of the first region to overlap the second region, and a third flow path, which is different from the second flow path, extending in the third region and around the central axis, and
a cross-sectional area of the third flow path is larger than a cross-sectional area of the first flow path and a cross-sectional area of the second flow path.

2. The substrate support according to claim 1 ,
wherein a part of the refrigerant flow path extends around a central axis of the first region to overlap the second region.

3. The substrate support of claim 1 ,
wherein the second flow path has an inner edge and an outer edge, the inner edge extends in the first region, and the outer edge extends in the third region.

4. The substrate support according to claim 1 ,
wherein the first flow path and the third flow path are separated from each other, and the first flow path does not communicate with the third flow path.

5. The substrate support according to claim 4 ,
wherein the second flow path is in communication with the first flow path.

6. The substrate support according to claim 1 , wherein the second support has a heater therein.

7. The substrate support according to claim 1 , wherein the first support and the second support are separated from each other to provide a gap between an outer peripheral surface of the first support and an inner peripheral surface of the second support to expose the upper surface of the second region.

8. The substrate support according to claim 7 , further comprising a seal that extends to cover the upper surface of the second region and is disposed between the first support and the second support.

9. The substrate support according to claim 1 , wherein the first support includes an electrostatic chuck.

10. The substrate support according to claim 1 , wherein the second support is formed of a dielectric material.

11. An apparatus for plasma processing comprising:
a chamber; and
a substrate support provided in the chamber,
wherein the substrate support includes:
a base with a refrigerant flow path formed therein, the base having a first region having a circular upper surface, a second region extending outward from the first region in a radial direction and surrounding the first region, and a third region extending outward from the second region in the radial direction and surrounding the second region, and the upper surface of the first region, an upper surface of the second region, and an upper surface of the third region being flat and continuous;
a first support provided on the first region and configured to support a substrate placed thereon; and
a second support provided on the third region to surround the first support, configured to support an edge ring placed thereon, and separated from the first support,

wherein the refrigerant flow path has a first flow path extending in the first region, a second flow path extending around a central axis of the first region to overlap the second region, and a third flow path, which is different from the second flow path, extending in the third region and around the central axis, and
a cross-sectional area of the third flow path is larger than a cross-sectional area of the first flow path and a cross-sectional area of the second flow path.

12. The apparatus for plasma processing according to claim 11 , wherein the first flow path and the third flow path are separated from each other, and the first flow path does not communicate with the third flow path.

Assignees

• Tokyo Electron Ltd

Inventors

• Kitagawa Dai

Classifications

• H01J37/20 Primary

  Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support · CPC title

• B23Q3/15

  Devices for holding work using magnetic or electric force acting directly on the work · CPC title

• H01J2237/002

  Cooling arrangements · CPC title

• H01J37/32715 Primary

  Workpiece holder · CPC title

• H01J37/32724

  Temperature · CPC title