Display substrate, method for manufacturing the same and display device

Patent metadata

Field	Value
Publication number	US-11700688-B2
Application number	US-202117183909-A
Country	US
Kind code	B2
Filing date	Feb 24, 2021
Priority date	Feb 24, 2020
Publication date	Jul 11, 2023
Grant date	Jul 11, 2023

Abstract

The present disclosure provides a display substrate, a method for manufacturing the display substrate, and a display device. The display substrate includes a first conductive line extending in a first direction on a base substrate, a second conductive line extending in a second direction crossing the first direction on the base substrate, and an insulation layer arranged between the first conductive line and the second conductive line. The display substrate further includes a buffer layer arranged between the first conductive line and the base substrate, a groove extending in the first direction is formed in the buffer layer, the first conductive line is arranged in the groove, and a surface of the first conductive line away from the base substrate is flush with a surface of the buffer layer away from the base substrate.

First claim

What is claimed is:

1. A display substrate, comprising a first conductive line extending in a first direction on a base substrate, a second conductive line extending in a second direction crossing the first direction on the base substrate, and an insulation layer arranged between the first conductive line and the second conductive line, wherein the display substrate further comprises a buffer layer arranged between the insulation layer and the base substrate, a groove extending in the first direction is formed in the buffer layer, the first conductive line is arranged in the groove, and a surface of the first conductive line away from the base substrate is flush with a surface of the buffer layer away from the base substrate;
wherein a support pattern is further arranged in the groove and at a side of the first conductive line facing the base substrate, the support pattern is a conductive pattern, and an orthogonal projection of the support pattern onto the base substrate is located within an orthogonal projection of the first conductive line onto the base substrate.

2. The display substrate according to claim 1 , wherein the first conductive line crosses the second conductive line at a target region, the first conductive line comprises a first portion arranged at the target region and a second portion other than the first portion, and a surface of the first portion in contact with the insulation layer is parallel to the base substrate.

3. The display substrate according to claim 2 , wherein a surface of the insulation layer adjacent to the base substrate at the target region is parallel to the base substrate, and a surface of the insulation layer away from the base substrate at the target region is parallel to the base substrate.

4. The display substrate according to claim 1 , wherein the first conductive line comprises a third portion and a fourth portion, a surface of the third portion away from the base substrate is flush with a surface of the fourth portion away from the base substrate, and an orthogonal projection of the third portion onto the base substrate coincides with the orthogonal projection of the support pattern onto the base substrate.

5. A method for manufacturing a display substrate, comprising:
providing a base substrate;
forming a first conductive line extending in a first direction on the base substrate;
forming an insulation layer covering the first conductive line on the base substrate; and
forming a second conductive line extending in a second direction crossing the first direction on the insulation layer,
wherein prior to forming the first conductive line extending in the first direction on the base substrate, the method further comprises: forming a buffer material layer on the base substrate; and etching the buffer material layer to form a buffer layer comprising a groove extending in the first direction,
wherein the forming the first conductive line extending in the first direction on the base substrate comprises forming the first conductive line in the groove in such a manner that a surface of the first conductive line away from the base substrate is flush with a surface of the buffer layer away from the base substrate;
wherein prior to forming the buffer material layer on the base substrate, the method further comprises: forming a support material layer on the base substrate; and etching the support material layer to form a support pattern; wherein the support pattern is a conductive pattern;
wherein the etching the buffer material layer to form the buffer layer comprises: etching the buffer material layer to form the buffer layer in such a manner that an orthogonal projection of the support pattern onto the base substrate is located within an orthogonal projection of the groove onto the base substrate.

6. The method according to claim 5 , wherein the first conductive line crosses the second conductive line at a target region, the first conductive line comprises a first portion arranged at the target region and a second portion other than the first portion, and a surface of the first portion in contact with the insulation layer is parallel to the base substrate.

7. The method according to claim 6 , wherein a surface of the insulation layer adjacent to the base substrate at the target region is parallel to the base substrate, and a surface of the insulation layer away from the base substrate at the target region is parallel to the base substrate.

8. The method according to claim 5 , wherein the forming the first conductive line extending in the first direction on the base substrate comprises: forming a first conductive material layer covering the groove on the base substrate; and etching the first conductive material layer to form the first conductive line in such a manner that the orthogonal projection of the support pattern onto the base substrate is located within an orthogonal projection of the first conductive line onto the base substrate.

9. The method according to claim 8 , wherein portions of the first conductive line in the groove comprise a third portion and a fourth portion, a surface of the third portion away from the base substrate is flush with a surface of the fourth portion away from the base substrate, and an orthogonal projection of the third portion onto the base substrate coincides with the orthogonal projection of the support pattern onto the base substrate.

10. The method according to claim 8 , wherein the etching the first conductive material layer to form the first conductive line comprises etching the first conductive material layer using a half-tone mask plate to remove a portion of the first conductive material layer at a side of the buffer layer away from the base substrate.

11. A display device, comprising a display substrate, wherein the display substrate comprises a first conductive line extending in a first direction on a base substrate, a second conductive line extending in a second direction crossing the first direction on the base substrate, and an insulation layer arranged between the first conductive line and the second conductive line, wherein the display substrate further comprises a buffer layer arranged between the insulation layer and the base substrate, a groove extending in the first direction is formed in the buffer layer, the first conductive line is arranged in the groove, and a surface of the first conductive line away from the base substrate is flush with a surface of the buffer layer away from the base substrate;
wherein a support pattern is further arranged in the groove and at a side of the first conductive line facing the base substrate, the support pattern is a conductive pattern, and an orthogonal projection of the support pattern onto the base substrate is located within an orthogonal projection of the first conductive line onto the base substrate.

12. The display device according to claim 11 , wherein the first conductive line crosses the second conductive line at a target region, the first conductive line comprises a first portion arranged at the target region and a second portion other than the first portion, and a surface of the first portion in contact with the insulation layer is parallel to the base substrate.

13. The display device according to claim 12 , wherein a surface of the insulation layer adjacent to the base substrate at the target region is parallel to the base substrate, and a surface of the insulation layer away from the base substrate at the target region is parallel to the base substrate.

14. The display device according to claim 11 , wherein the first conductive line comprises a third portion and a fourth portion, a surface of the third port

Assignees

• Hefei Xinsheng Optoelectronics Technology Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Huang Yongchao
• Wang Qinghe
• Wang Haitao
• Liu Jun
• Cheng Jun
• Zhao Ce
• Yan Liangchen

Classifications

• H05K2201/10128

  Display · CPC title

• H05K1/09 Primary

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K3/04

  the conductive material being removed mechanically, e.g. by punching · CPC title

• H10D86/451

  characterised by the compositions or shapes of the interlayer dielectrics · CPC title

• H10D86/60

  wherein the TFTs are in active matrices · CPC title