Connection element for fastening a metal part to a printed circuit board
US-2018115094-A1 · Apr 26, 2018 · US
Electromagnetic shielding of heatsinks with spring press-fit pins
US11699884B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11699884-B2 |
| Application number | US-202016939135-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 27, 2020 |
| Priority date | Jul 27, 2020 |
| Publication date | Jul 11, 2023 |
| Grant date | Jul 11, 2023 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.
First claim
Opening claim text (preview).
What is claimed is: 1. An apparatus comprising: a printed circuit board, a logic chip, a heatsink, and a grounding member, wherein the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member; the logic chip electrically coupled to the printed circuit board; the heatsink disposed on a top surface of the logic chip; a thermal interface material disposed between the top surface of the logic chip and a bottom surface of the heatsink; the first terminal pin at the first end of the grounding member disposed in a plated-through hole of the printed circuit board, wherein the grounding member electrically couples the heatsink to the printed circuit board; and a load bar of the grounding member translates a load applied to the heatsink during an assembly process to the integrated spring and the first terminal pin; the integrated spring of the grounding member presses a second end of the grounding member against the bottom surface of the heatsink, wherein the second end of the grounding member electrically couples the heatsink to the grounding member. 2. The apparatus of claim 1 , further comprising: a second end of the grounding member electrically coupled to the heatsink utilizing at least one spot weld. 3. The apparatus of claim 1 , further comprising: a second end of the grounding member electrically coupled to the heatsink utilizing solder. 4. The apparatus of claim 1 , wherein the integrated spring is selected from a group consisting of: a pogo pin, a helical spring, a conical spring, a multiple bend spring, and a leaf spring.
Assignees
Inventors
Classifications
Contact or connector with insertion depth limiter · CPC title
Modifications to facilitate cooling, ventilating, or heating · CPC title
- H01R13/6595Primary
with separate members fixing the shield to the PCB · CPC title
Press fitting · CPC title
Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board · CPC title
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- What does patent US11699884B2 cover?
- An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface o…
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H01R13/6595. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 11 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).