Method of affixing a group of elastic filaments to an electronic component body

US9907185B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9907185-B2
Application numberUS-201414554226-A
CountryUS
Kind codeB2
Filing dateNov 26, 2014
Priority dateDec 13, 2012
Publication dateFeb 27, 2018
Grant dateFeb 27, 2018

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

According to embodiments of the invention, an electronic component assembly may be provided. The electronic component assembly may include an electronic component body. The electronic component assembly may also include one or more elastic members affixed to the electronic component body. The electronic component assembly may also include a catch mechanism affixed to each elastic member adapted to allow insertion of the elastic member and the catch mechanism through a hole of a circuit board in an extended position, and upon release from the extended position, hold the electronic component body in a fixed position by the tension of the elastic member and the catch mechanism grasping an edge of a surface of the circuit board opposite a surface upon which the electronic component body rests.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method comprising: providing an electronic component body; affixing a group of elastic filaments to the electronic component body, each filament of the group of elastic filaments extends away from the electronic component body in a direction parallel to the group of elastic filaments, each filament further deforms to a constricted position when a constrictive force is applied, and upon removal of the constrictive force, return to a natural position; placing a tube over the group of elastic filaments, the tube contains the group of filaments in the constricted position in order to allow insertion of the tube containing the group of elastic filaments into a hole of a circuit board; inserting the group of one or more elastic filaments contained by tube into a hole of the circuit board until the electronic component body contacts a surface of the circuit board; and removing the tube from the group of elastic filaments, wherein the group of elastic filaments is allowed to return to a natural position, wherein the group of elastic filaments grasps an edge of the hole of the circuit board, thereby holding, with a tensile force, the electronic component body in a fixed position against a surface of the circuit board.

Assignees

Inventors

Classifications

  • Arrangements for assisting the manual mounting of components, e.g. special tables or light spots indicating the place for mounting · CPC title

  • Electrical device making · CPC title

  • H05K7/12Primary

    Resilient or clamping means for holding component to structure · CPC title

  • by inserting component lead or terminal into base aperture · CPC title

  • H05K3/308Primary

    Adaptations of leads (connectors to printed circuits H01R12/00) · CPC title

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Frequently asked questions

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What does patent US9907185B2 cover?
According to embodiments of the invention, an electronic component assembly may be provided. The electronic component assembly may include an electronic component body. The electronic component assembly may also include one or more elastic members affixed to the electronic component body. The electronic component assembly may also include a catch mechanism affixed to each elastic member adapted…
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification H05K7/12. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 27 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).