Terahertz element and semiconductor device

Patent metadata

Field	Value
Publication number	US-11699846-B2
Application number	US-202117644225-A
Country	US
Kind code	B2
Filing date	Dec 14, 2021
Priority date	Jun 27, 2017
Publication date	Jul 11, 2023
Grant date	Jul 11, 2023

Abstract

A terahertz element of an aspect of the present disclosure includes a semiconductor substrate, first and second conductive layers, and an active element. The first and second conductive layers are on the substrate and mutually insulated. The active element is on the substrate and electrically connected to the first and second conductive layers. The first conductive layer includes a first antenna part extending along a first direction, a first capacitor part offset from the active element in a second direction as viewed in a thickness direction of the substrate, and a first conductive part connected to the first capacitor part. The second direction is perpendicular to the thickness direction and first direction. The second conductive layer includes a second capacitor part, stacked over and insulated from the first capacitor part. The substrate includes a part exposed from the first and second capacitor parts. The first conductive part has a portion spaced apart from the first antenna part in the second direction with the exposed part therebetween as viewed in the thickness direction.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a support;
a terahertz element disposed on the support and configured to radiate an electromagnetic wave with a frequency in a terahertz band; and
an insulating part disposed on the support,
wherein the insulating part is formed with an opening in which the terahertz element is housed,
the opening comprises a first side surface is inclined with respect to a thickness direction of the support.

2. The semiconductor device according to claim 1 , wherein the opening comprises a second side surface surrounding the terahertz element and disposed between the first side surface and the support in the thickness direction of the support,
the second side surface extends along the thickness direction of the support.

3. The semiconductor device according to claim 2 , wherein the second side surface is greater in size along the thickness direction of the support than the terahertz element.

4. The semiconductor device according to claim 2 , wherein the second side surface has a size of 0.8 to 1.0 mm along the thickness direction of the support.

5. The semiconductor device according to claim 1 , wherein the opening has an inner diameter of 1.7 to 2.3 mm.

6. The semiconductor device according to claim 1 , wherein the first side surface has a size of 0.6 to 1.4 mm along the thickness direction of the support.

7. The semiconductor device according to claim 1 , wherein the first side surface is inclined 20 degrees with respect to the thickness direction of the support.

8. The semiconductor device according to claim 1 , further comprising a metal layer formed on the first side surface.

9. The semiconductor device according to claim 1 , further comprising a wire bonded to the terahertz element and the support.

10. The semiconductor device according to claim 1 , wherein the support comprises a glass epoxy board.

11. The semiconductor device according to claim 1 , wherein the insulating part contains an epoxy resin.

12. The semiconductor device according to claim 1 , wherein the frequency of the electromagnetic wave radiated from the terahertz element is in a range of 300 to 330 GHz.

Assignees

• Rohm Co Ltd

Inventors

• Mukai Toshikazu
• Kim Jaeyoung
• Toyama Tomoichiro

Classifications

• H01L24/48

  Electricity · mapped topic

• H01L2224/48225

  Electricity · mapped topic

• H01L29/882

  Electricity · mapped topic

• H01L23/66

  Electricity · mapped topic

• H01Q9/16

  with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole (H01Q9/44 takes precedence) · CPC title