Methods for printing solder paste and other viscous materials at high resolution

Patent metadata

Field	Value
Publication number	US-11697166-B2
Application number	US-202217818308-A
Country	US
Kind code	B2
Filing date	Aug 8, 2022
Priority date	Feb 3, 2020
Publication date	Jul 11, 2023
Grant date	Jul 11, 2023

Abstract

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

First claim

What is claimed is:

1. A method, comprising printing individual dots of a material onto an intermediate substrate by a first printing unit, and transferring the dots of material printed on the intermediate substrate to a final substrate by a second printing unit configured to receive the intermediate substrate having the dots of material printed thereon,
wherein the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, the first printing unit transfers the material as the individual dots from the donor substrate onto the intermediate substrate across a donor substrate-to-intermediate substrate gap between the donor substrate and the intermediate substrate, and the second printing unit transfers the dots of material printed on the intermediate substrate from the intermediate substrate onto the final substrate across an intermediate substrate-to-final substrate gap between the intermediate substrate and the final substrate, the intermediate substrate-to-final substrate gap being wider than the donor substrate-to-intermediate substrate gap, and
wherein the coating system includes a syringe of the material, the material is driven from the syringe onto the donor substrate, and the coating system transports the donor substrate with the material thereon towards and through a first gap between rollers or knifes to create the uniform layer of the material on the donor substrate, the uniform layer of the material having a thickness that is defined by the first gap.

2. The method of claim 1 , wherein the coating system applies more than one material onto the donor substrate in a plurality of printing procedures.

3. The method of claim 1 , wherein the first printing unit uses a laser to jet dots of material from the donor substrate to the intermediate substrate.

4. The method of claim 1 , wherein the second printing unit uses a laser to jet the dots of material from the intermediate substrate to the final substrate.

5. The method of claim 1 , wherein the dots of material printed on at least one of the intermediate substrate, or the final substrate after transfer of the dots of material thereto are at least one of (i) cured using ultra-violet (UV) lights and/or a heater, or (ii) imaged using one or more imaging systems.

6. The method of claim 1 , wherein the intermediate substrate is a flexible substrate.

7. The method of claim 1 , wherein the material is a metal paste.

8. The method of claim 1 , wherein the donor substrate-to-intermediate substrate gap is maintained using a fixed support below the intermediate substrate.

9. The method of claim 1 , wherein the donor substrate-to-intermediate substrate gap is maintained using a transparent solid substrate as the intermediate substrate.

10. The method of claim 1 , wherein a continuous transparent film substrate is used as the intermediate substrate.

11. The method of claim 1 , wherein a transparent film substrate coated by a metal layer or by a metal and a dielectric layer is used as the intermediate substrate.

12. The method of claim 1 , wherein a transparent solid substrate is used as the intermediate substrate.

13. The method of claim 1 , further comprising moving the intermediate substrate from the first printing unit to the second printing unit, and during said moving curing said dots of material printed on the intermediate substrate by ultra-violet (UV) light or by drying using a heater.

14. The method of claim 1 , further comprising moving the intermediate substrate from the first printing unit to the second printing unit, and during said moving imaging said dots of material printed on the intermediate substrate.

15. The method of claim 14 , wherein data gathered by said imaging is transferred to the second printing unit for use during the transfer of the dots of material onto the final substrate.

Assignees

• Io Tech Group Ltd

Inventors

• Zenou Michael
• Gilan Ziv
• Nesher Guy

Classifications

• H05K2203/0338

  Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component · CPC title

• H05K3/00

  Apparatus or processes for manufacturing printed circuits · CPC title

• B05D3/065

  After-treatment · CPC title

• B05D1/28

  performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers · CPC title

• H05K3/3478

  Application of solder preforms; Transferring prefabricated solder patterns · CPC title