Substrate processing apparatus, storage medium and substrate processing method

Patent metadata

Field	Value
Publication number	US-11685998-B2
Application number	US-201816014320-A
Country	US
Kind code	B2
Filing date	Jun 21, 2018
Priority date	Jun 21, 2018
Publication date	Jun 27, 2023
Grant date	Jun 27, 2023

Abstract

Examples of a substrate processing apparatus includes a device for subjecting a substrate to processing, and a controller for modifying a control parameter predetermined to control the device with a first modification value and a second modification value that vary over time, thereby calculating a modified parameter, and controlling the device based on the modified parameter, wherein the first modification value has a shorter term for modifying the control parameter than the second modification value.

First claim

The invention claimed is:

1. A substrate processing apparatus comprising:
a device for subjecting a substrate to processing; and
a controller, the controller including a processor communicatively coupled to a computer-readable storage medium that
stores a plurality of first tables and at least one second table, each first table including aa plurality of first modification values, and the at least one second table including a plurality of second modification values, the first modification values and the second modification values each varying independently over time, and
has a program recorded therein, the program causing the processor to execute:
selecting one first table from among the plurality of first tables,
modifying a control parameter to control the device with the respective first modification values corresponding to the selected first table and the second modification values corresponding to the at least one second table, thereby calculating a modified parameter, and
controlling the device based on the modified parameter, wherein

each first modification value has a shorter term for modifying the control parameter than the second modification values,
each first modification value moderates variation occurring in a processing result of the substrate after restart of the processing of the substrate due to stop of the processing of the substrate by the device,
the plurality of first tables include at least a table including a first modification value to be used when the processing of the substrate has been stopped for a time shorter than a predetermined time, a table including a first modification value to be used when the processing of the substrate has been stopped for a time longer than the predetermined time, and a table including a first modification value to be used when a cleaning and pre-coat are performed just before the processing of the substrate is started, and
each first modification value is used for modifying the control parameter to suppress an increase of a film thickness over time based on the restart of the processing, and
each second modification value is used for modifying the control parameter in order to suppress a decrease of a film thickness over time in a case where the processing of the substrate is performed after the cleaning and pre-coat resets the decrease of the film thickness.

2. The substrate processing apparatus according to claim 1 , wherein
the control parameter is a cycle frequency of iterative processing in ALD recorded in a recipe, a cycle frequency of a step of the recipe, a time of the step or an analog output.

3. The substrate processing apparatus according to claim 1 , wherein
the first modification values and the second modification value are set according to an integration frequency of film formation processing, a total time of the film formation processing, an integration value of a thickness of a film formed by the film formation processing or an integration frequency of a cycle frequency of iterative processing in ALD processing.

4. The substrate processing apparatus according to claim 1 , wherein
the first modification values and the second modification value are expressed in terms of a percentage, an increase/decrease value or the modified parameter.

5. The substrate processing apparatus according to claim 1 , further comprising
a reactor chamber for subjecting the substrate to processing, wherein
the first modification value moderates variation occurring in a processing result of the substrate after cleaning and pre-coat of the reactor chamber due to the cleaning and the pre-coat.

6. The substrate processing apparatus according to claim 1 , further comprising
a reactor chamber for subjecting the substrate to processing, wherein
the processor selects the selected first modification value based on a state of the reactor chamber just before the processing of the substrate is started.

7. The substrate processing apparatus according to claim 1 , wherein each of the plurality of first tables is organized by processing count.

8. The substrate processing apparatus according to claim 7 , wherein each subsequent first modification value corresponds with an increase in the processing count, and each subsequent first modification value is less than or equal to a previous first modification value.

9. The substrate processing apparatus according to claim 7 , wherein each subsequent second modification value corresponds with an increase in the processing count, and each subsequent second modification value is less than or equal to a previous second modification value.

10. The substrate processing apparatus according to claim 7 , wherein each subsequent first modification value and each subsequent second modification value corresponds with an increase in the processing count, and each subsequent first modification value is less than or equal to a previous first modification value and each subsequent second modification value is less than or equal to a previous second modification value.

11. The substrate processing apparatus according to claim 1 , wherein the restart occurs just after initial start of the processing of the substrate.

12. The substrate processing apparatus according to claim 1 , wherein the restart occurs after at least one wait time for replacement of the substrate with a different substrate.

13. The substrate processing apparatus according to claim 1 , wherein the restart occurs a plurality of times, including just after initial start of the processing of the substrate and after at least one wait time for replacement of the substrate of a different substrate.

Assignees

• Asm Ip Holding Bv

Inventors

• Wada Takashi
• Noguchi Satoru
• Adachi Wataru
• Muramatsu Daisuke

Classifications

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• H10P74/203 Primary

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0612

  Production flow monitoring, e.g. for increasing throughput · CPC title

• C23C16/52 Primary

  Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title