Plasma erosion resistant rare-earth oxide based thin film coatings

Patent metadata

Field	Value
Publication number	US-11680308-B2
Application number	US-202117339248-A
Country	US
Kind code	B2
Filing date	Jun 4, 2021
Priority date	Jun 20, 2013
Publication date	Jun 20, 2023
Grant date	Jun 20, 2023

Abstract

A chamber component for a process chamber comprises a ceramic body and one or more protective layer on at least one surface of the ceramic body, wherein the one or more protective layer comprises Y3Al5O12 having a dielectric constant of 9.76+/−up to 30% and a hermiticity of 4.4E-10 cm3/s+/−up to 30%.

First claim

What is claimed is:

1. A chamber component for a process chamber, comprising:
a ceramic body; and
one or more protective layers on at least one surface of the ceramic body, wherein the one or more protective layers comprises Y 3 Al 5 O 12 having a dielectric constant of 9.76+/−up to 30% and a hermiticity of 4.4E-10 cm 3 /s+/−up to 30%.

2. The chamber component of claim 1 , wherein the chamber component is a chamber lid.

3. The chamber component of claim 1 , wherein the ceramic body comprises Al 2 O 3 .

4. The chamber component of claim 1 , wherein the one or more protective layers has an erosion rate of about 1 nm/hr+/−up to 30% when exposed to a CH 4 /Cl 2 plasma chemistry.

5. The chamber component of claim 1 , wherein the one or more protective layers further has at least one of a hardness of 8.5 GPa+/−up to 30%, a volume resistivity of 11.3E16 Ω·cm+/−up to 30%, or a thermal conductivity of 20.1 W/m·K+/−up to 30%.

6. The chamber component of claim 1 , wherein the one or more protective layers has a porosity of less than 1%.

7. The chamber component of claim 1 , wherein the one or more protective layers comprises 30-40 mol % Y 2 O 3 and 60-70 mol % Al 2 O 3 .

8. The chamber component of claim 1 , wherein the one or more protective layers comprises a bulk sintered ceramic that has been bonded to the ceramic body.

9. The chamber component of claim 8 , wherein the one or more protective layers comprises a thin ceramic wafer having a thickness of 200 microns+/−30%.

10. The chamber component of claim 1 , wherein the one or more protective layers comprises a thick film protective layer.

11. The chamber component of claim 10 , wherein the one or more protective layers has a thickness of about 50 microns to about 200 microns.

12. The chamber component of claim 1 , wherein the one or more protective layers comprises a thin film protective layer.

13. The chamber component of claim 12 , wherein the one or more protective layers has a thickness of below about 20 microns.

14. The chamber component of claim 1 , wherein the one or more protective layers comprises a stack of a plurality of protective layers.

15. The chamber component of claim 1 , wherein the one or more protective layers comprises a sintered ceramic.

16. The chamber component of claim 1 , wherein the one or more protective layers comprises a thick film protective layer and a thin film protective layer over the thick film protective layer.

17. The chamber component of claim 1 , wherein the process chamber is a plasma etch process chamber.

18. The chamber component of claim 17 , wherein the one or more protective layers comprises a plasma resistant layer, and wherein an external surface of the plasma resistant layer is to be exposed to a plasma.

19. A process chamber comprising:
a chamber body;
a substrate support within the chamber body; and
a lid over the chamber body, the lid comprising:
a ceramic body comprising Al 2 O 3 ; and
a protective layer on at least one surface of the ceramic body, wherein the protective layer comprises Y 3 Al 5 O 12 having a dielectric constant of 9.76+/−up to 30% and a hermiticity of 4.4E-10 cm 3 /s+/−up to 30%.

20. The process chamber of claim 19 , wherein the protective layer has a porosity of less than 1% and comprises 30-40 mol % Y 2 O 3 and 60-70 mol % Al 2 O 3 .

Assignees

• Applied Materials Inc

Inventors

• Sun Jennifer Y
• Kanungo Biraja P
• Firouzdor Vahid
• Cho Tom

Classifications

• C23C14/08 Primary

  Oxides (C23C14/10 takes precedence) · CPC title

• H01J37/32477

  characterised by the means for protecting vessels or internal parts, e.g. coatings · CPC title

• Y10T428/24975

  No layer or component greater than 5 mils thick · CPC title

• Y10T428/24355

  Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] · CPC title

• C23C14/22

  characterised by the process of coating · CPC title