Hybrid integration of microLED interconnects with ICs

Patent metadata

Field	Value
Publication number	US-11677472-B2
Application number	US-202117461586-A
Country	US
Kind code	B2
Filing date	Aug 30, 2021
Priority date	Aug 28, 2020
Publication date	Jun 13, 2023
Grant date	Jun 13, 2023

Abstract

For optical communications between semiconductor ICs, optical transceiver assembly subsystems may be integrated with a processor. The optical transceiver assembly subsystems may be monolithically integrated with processor ICs or they may be provided in separate optical transceiver ICs coupled to or attached to the processor ICs.

First claim

What is claimed is:

1. A device including optical communication components, comprising:
a processor integrated circuit;
an optical transceiver subsystem with elements in or attached to an optical transceiver integrated circuit, the optical transceiver integrated circuit electrically coupled to the processor integrated circuit, the optical transceiver subsystem including a plurality of transmitters and receivers;
with each of the transmitters including transmitter circuitry in the optical transceiver integrated circuit and a microLED, bonded to a top surface of the optical transceiver integrated circuit, electrically connected to the transmitter circuitry;
with each of the receivers including receiver circuitry in the optical transceiver integrated circuit and a photodetector, in or bonded to the top surface of the optical transceiver integrated circuit, electrically connected to the receiver circuitry; and
the optical transceiver integrated circuit including vias coupling the transmitter circuitry and the receiver circuitry to pads on a bottom surface of the optical transceiver integrated circuit, the optical transceiver integrated circuit being coupled to the processor integrated circuit at least in part by the pads.

2. The device of claim 1 , wherein the pads are coupled to an interconnect layer of the processor integrated circuit.

3. The device of claim 1 , wherein the pads are coupled to an interconnect layer of an interposer to which both the processor integrated circuit and the optical transceiver integrated circuit are mounted.

4. The device of claim 1 , wherein the pads are coupled to a package substrate to which both the processor integrated circuit and the optical transceiver integrated circuit are mounted.

5. The device of claim 1 , wherein the processor integrated circuit and the optical transceiver integrated circuit are both mounted to opposing surfaces of an interposer.

6. The device of claim 1 , wherein the optical transceiver integrated circuit is mounted over a hole in an interposer.

7. The device of claim 1 , wherein the photodetectors are monolithically integrated in the receiver circuitry.

8. The device of claim 1 , wherein coupling optics are coupled to the optical transceiver integrated circuit.

9. The device of claim 8 , wherein the coupling optics include a turning mirror.

10. The device of claim 1 , further comprising:
a further processor integrated circuit;
a further optical transceiver subsystem with elements in or attached to a further optical transceiver integrated circuit, the further optical transceiver integrated circuit coupled to the further processor integrated circuit, the further optical transceiver subsystem including a plurality of further transmitters and further receivers;
with each of the further transmitters including further transmitter circuitry in the further optical transceiver integrated circuit and a further microLED, bonded to a top surface of the further optical transceiver integrated circuit, electrically connected to the further transmit circuitry;
with each of the further receivers including further receiver circuitry in the further optical transceiver integrated circuit and a further photodetector, in or bonded to a top surface of the further optical transceiver integrated circuit, electrically connected to the further receiver circuitry;
the further optical transceiver integrated circuit including vias connecting the further transmitter circuitry and the receiver further circuitry to pads on a bottom surface of the further optical transceiver integrated circuit, the further optical transceiver integrated circuit being coupled to the further processor integrated circuit at least in part by the pads; and
an optical propagation medium coupling the optical transceiver integrated circuit and the further optical transceiver integrated circuit.

11. The device of claim 10 , wherein the optical propagation medium comprises a multicore fiber.

Assignees

• Kalman Robert
• Pezeshki Bardia
• Tselikov Alexander
• Danesh Cameron
• Avicenatech Corp

Inventors

• Kalman Robert
• Pezeshki Bardia
• Tselikov Alexander
• Danesh Cameron

Classifications

• G02B6/4246 Primary

  Bidirectionally operating package structures · CPC title

• G02B6/4232

  using the surface tension of fluid solder to align the elements, e.g. solder bump techniques (flip-chip mounting techniques in assembly of semiconductor devices H10W72/072) · CPC title

• G02B6/428

  containing printed circuit boards [PCB] · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H04B10/25

  Arrangements specific to fibre transmission · CPC title