Camera module having a soldering portion coupling a driving device and a circuit board

Patent metadata

Field	Value
Publication number	US-11671690-B2
Application number	US-202217653985-A
Country	US
Kind code	B2
Filing date	Mar 8, 2022
Priority date	Nov 6, 2015
Publication date	Jun 6, 2023
Grant date	Jun 6, 2023

Abstract

A camera module of an embodiment may comprise: a first holder in which a filter is mounted; a lens barrel that is provided to be vertically movable in a first direction with respect to the first holder; a lens operating device that comprises a terminal and moves the lens barrel in the first direction; a first circuit board that is disposed under the first holder and on which an image sensor is mounted; a soldering portion for electrically connecting the terminal of the lens operating device to the first circuit board; and a coupling reinforcement portion that is disposed to face the soldering portion and couples the lens operating device and the first circuit board.

First claim

The invention claimed is:

1. A camera module, comprising:
a first circuit board comprising a first terminal;
an image sensor disposed on the first circuit board;
a lens moving device comprising a lens barrel disposed on the image sensor and a second circuit board comprising a second terminal;
a soldering portion connecting the first terminal of the first circuit board and the second terminal of the second circuit board; and
a coupling reinforcement portion coupling the lens moving device and the first circuit board;
wherein the coupling reinforcement portion and the soldering portion are located opposite to each other with the lens moving device interposed therebetween.

2. The camera module of claim 1 , comprising a filter disposed between the lens barrel and the image sensor.

3. The camera module of claim 1 , wherein the first circuit board is electrically connected to the second circuit board through the soldering portion.

4. The camera module of claim 1 , wherein a lower surface of the coupling reinforcement portion is coupled to an upper surface of the first circuit board.

5. The camera module of claim 1 , comprising a flexible circuit board disposed on an upper surface of the first circuit board, and wherein the flexible circuit board is electrically connected to the first circuit board.

6. The camera module of claim 5 , wherein a lower surface of the coupling reinforcement portion is coupled to an upper surface of the flexible circuit board.

7. The camera module of claim 6 , comprising an insulating layer disposed on the upper surface of the flexible circuit board.

8. The camera module of claim 7 , wherein the coupling reinforcement portion is coupled to the insulating layer.

9. The camera module of claim 8 , wherein the coupling reinforcement portion comprises an upper end that is located higher than an upper surface of the insulating layer.

10. The camera module of claim 1 , wherein a longitudinal direction of the coupling reinforcement portion is in parallel with a longitudinal direction of the soldering portion.

11. The camera module of claim 1 , wherein the coupling reinforcement portion comprises a first portion, and wherein a width of the first portion of the coupling reinforcement portion decreases with increasing distance from the first circuit board.

12. The camera module of claim 11 , wherein the coupling reinforcement portion comprises a second portion disposed under the first portion of the coupling reinforcement portion.

13. The camera module of claim 7 , wherein the coupling reinforcement portion comprises:
a first portion, wherein a width of the first portion of the coupling reinforcement portion decreases with increasing distance from the first circuit board; and
a second portion disposed under the first portion of the coupling reinforcement portion, wherein the second portion is coupled to the flexible circuit board and the insulating layer.

14. The camera module of claim 6 , wherein a height of the coupling reinforcement portion is greater than a height of the insulating layer with respect to the upper surface of the flexible circuit board.

15. The camera module of claim 1 , wherein the lens moving device comprises:
a housing;
a bobbin disposed in the housing and coupled to the lens barrel;
a coil and a magnet configured to move the lens barrel in a direction parallel to an optical axis of the lens barrel; and
a base disposed under the bobbin.

16. The camera module of claim 1 , wherein the second terminal of the second circuit board is disposed on a first side surface of the base, and
wherein at least one part of the coupling reinforcement portion is coupled to a second side surface of the base, and the second side surface of the base is opposite to the first side surface of the base.

17. The camera module of claim 1 , wherein the coupling reinforcement portion is made of an epoxy or a thermosetting adhesive.

18. A camera module, comprising:
a first circuit board comprising a first terminal;
an image sensor disposed on the first circuit board;
a lens moving device comprising a lens barrel disposed on the image sensor, a bobbin coupled to the lens barrel and configured to move in a first direction, a second circuit board comprising a second terminal, and a base disposed under the second circuit board;
a soldering portion connecting the first terminal of the first circuit board and the second terminal of the second circuit board; and
a coupling reinforcement portion coupling the base and the first circuit board;
wherein the coupling reinforcement portion and the soldering portion are located opposite to each other with the base interposed therebetween.

19. The camera module of claim 1 , wherein the second terminal of the second circuit board is disposed on a first side surface of the base, and
wherein at least one part of the coupling reinforcement portion is coupled to a second side surface of the base, and the second side surface of the base is opposite to the first side surface of the base.

20. A mobile device comprising the camera module according to claim 1 .

Assignees

• Lg Innotek Co Ltd

Inventors

• Chung jong ho
• Lee Sung Il

Classifications

• G02B7/08 Primary

  adapted to co-operate with a remote control mechanism · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• G03B5/00

  Adjustment of optical system relative to image or object surface other than for focusing · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• H05K2201/0175

  Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor · CPC title