Camera module having a soldering portion coupling a driving device and a circuit board

Patent metadata

Field	Value
Publication number	US-10958813-B2
Application number	US-201916531661-A
Country	US
Kind code	B2
Filing date	Aug 5, 2019
Priority date	Nov 6, 2015
Publication date	Mar 23, 2021
Grant date	Mar 23, 2021

Abstract

A camera module of an embodiment may comprise: a first holder in which a filter is mounted; a lens barrel that is provided to be vertically movable in a first direction with respect to the first holder; a lens operating device that comprises a terminal and moves the lens barrel in the first direction; a first circuit board that is disposed under the first holder and on which an image sensor is mounted; a soldering portion for electrically connecting the terminal of the lens operating device to the first circuit board; and a coupling reinforcement portion that is disposed to face the soldering portion and couples the lens operating device and the first circuit board.

First claim

The invention claimed is:

1. A camera module, comprising:
a first circuit board comprising a first terminal;
an image sensor disposed on the first circuit board;
a filter disposed on the image sensor;
a lens barrel disposed on the filter;
a lens moving device configured to move the lens barrel in a first direction and comprising a second circuit board comprising a second terminal;
a soldering portion disposed on one side of the lens moving device and connecting the first terminal of the first circuit board and the second terminal of the second circuit board; and
a coupling reinforcement portion disposed on another side of the lens moving device and coupling the lens moving device and the first circuit board,
wherein the coupling reinforcement portion and the soldering portion are disposed on opposite sides with respect to an optical axis of the lens moving device.

2. The camera module of claim 1 , wherein the first circuit board is electrically connected to the second circuit board through the soldering portion.

3. The camera module of claim 1 , wherein a lower surface of the coupling reinforcement portion is coupled to an upper surface of the first circuit board.

4. The camera module of claim 1 , comprising a flexible circuit board disposed on an upper surface of the first circuit board, and wherein the flexible circuit board is electrically connected to the first circuit board.

5. The camera module of claim 4 , wherein a lower surface of the coupling reinforcement portion is coupled to an upper surface of the flexible circuit board.

6. The camera module of claim 5 , comprising an insulating layer disposed on the upper surface of the flexible circuit board.

7. The camera module of claim 6 , wherein the coupling reinforcement portion is coupled to the insulating layer.

8. The camera module of claim 7 , wherein the coupling reinforcement portion comprises an upper end that is located higher than an upper surface of the insulating layer.

9. The camera module of claim 1 , wherein a longitudinal direction of the coupling reinforcement portion is in parallel with a longitudinal direction of the soldering portion, and
wherein the longitudinal direction of the coupling reinforcement portion is perpendicular to the first direction.

10. The camera module of claim 7 , wherein the coupling reinforcement portion comprises a first portion, wherein a width of the first portion of the coupling reinforcement portion decreases with increasing distance from the first circuit board.

11. The camera module of claim 10 , wherein the coupling reinforcement portion comprises a second portion disposed under the first portion of the coupling reinforcement portion, and the second portion is coupled to the flexible circuit board and the insulating layer.

12. The camera module of claim 10 , wherein the first portion comprises a first region and a second region, wherein the second region is disposed on the first region, and
wherein each of the first and second regions has a width decreasing with increasing distance from the first circuit board.

13. The camera module of claim 5 , wherein a height of the coupling reinforcement portion is greater than a height of the insulating layer with respect to the upper surface of the flexible circuit board.

14. The camera module of claim 1 , wherein the lens moving device comprises:
a housing;
a bobbin disposed in the housing and coupled to the lens barrel;
a coil disposed on the bobbin;
a magnet disposed on the housing and facing the coil;
an elastic member coupled to the bobbin and the housing; and
a base disposed under the bobbin.

15. The camera module of claim 14 , wherein the second terminal of the second circuit board is disposed on a first side surface of the base, and
wherein at least one part of the coupling reinforcement portion is coupled to a second side surface of the base, and the second side surface of the base is opposite to the first side surface of the base.

16. The camera module of claim 3 , wherein a width of the lower surface of the coupling reinforcement portion is 0.3 mm˜1 mm, and
wherein a height of the lower surface of the coupling reinforcement portion with respect to the upper surface of the first circuit board is 0.5 mm˜1.5 mm.

17. The camera module of claim 5 , wherein a width of the lower surface of the coupling reinforcement portion is 0.3 mm˜1 mm, and
wherein a height of the lower surface of the coupling reinforcement portion with respect to the upper surface of the flexible circuit board is 0.5 mm˜1.5 mm.

18. The camera module of claim 1 , wherein the coupling reinforcement portion is made of an epoxy or a thermosetting adhesive.

19. A camera module, comprising:
a first circuit board comprising a first terminal;
an image sensor disposed on the first circuit board;
a filter disposed on the image sensor;
a lens barrel disposed on the filter;
a lens moving device configured to move the lens barrel in a first direction and comprising a second circuit board comprising a second terminal;
a soldering portion disposed on one side of the lens moving device and connecting the first terminal of the first circuit board and the second terminal of the second circuit board;
a flexible circuit board disposed on an upper surface of the first circuit board and electrically connected to the first circuit board; and
a coupling reinforcement portion disposed on an upper surface of the flexible circuit board and coupling the lens moving device,
wherein the soldering portion is disposed at one side of the lens moving device, and the coupling reinforcement portion is disposed at another side of the lens moving device, and the another side is opposite to the one side of the lens moving device.

20. A camera module, comprising:
a first circuit board comprising a first terminal;
an image sensor disposed on the first circuit board;
a filter disposed on the image sensor;
a base disposed on the first circuit board;
a housing disposed on the base;
a bobbin disposed in the housing;
a lens barrel coupled to the bobbin;
a coil disposed on the bobbin;
a magnet disposed on the housing and facing the coil;
an elastic member coupled to the bobbin and the housing;
a second circuit board comprising a second terminal;
a soldering portion connecting the first terminal of the first circuit board and the second terminal of the second circuit board;
a flexible circuit board disposed on an upper surface of the first circuit board and electrically connected to the first circuit board; and
a coupling reinforcement portion disposed on the upper surface of the flexible circuit board and coupling a lens moving device,
wherein the soldering portion is disposed at one side of the lens moving device, and the coupling reinforcement portion is disposed at another side of the lens moving device, and the another side is opposite to the one side of the lens moving device.

Assignees

• Lg Innotek Co Ltd

Inventors

• Chung jong ho
• Lee Sung Il

Classifications

• G02B7/08 Primary

  adapted to co-operate with a remote control mechanism · CPC title

• H04N23/55 Primary

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K2201/10151

  Sensor · CPC title