Bone conduction microphone

US11665494B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11665494-B2
Application numberUS-202117542524-A
CountryUS
Kind codeB2
Filing dateDec 6, 2021
Priority dateMay 19, 2021
Publication dateMay 30, 2023
Grant dateMay 30, 2023

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

One of the main objects of the present invention is to provide a bone conduction microphone with simplified structure and easier manufacturing process. To achieve the above-mentioned objects, the present invention provides a bone conduction microphone, including: a housing; a circuit board opposite to the housing; and a vibration assembly locating between the housing and the circuit board. The vibration assembly includes a vibration membrane made of high temperature resistant dustproof breathable material, a weight fixed to the vibration membrane, and a first cavity formed between the vibration membrane and the circuit board. The bone conduction microphone further includes a pressure assembly locating between the vibration assembly and the circuit board for detecting a pressure change generated in the first cavity and converting the pressure change into an electrical signal.

First claim

Opening claim text (preview).

What is claimed is: 1. A bone conduction microphone, including: a housing; a circuit board opposite to the housing; a vibration assembly locating between the housing and the circuit board, including a vibration membrane made of high temperature resistant dustproof breathable material, a weight fixed to the vibration membrane, and a first cavity formed between the vibration membrane and the circuit board; a pressure assembly locating between the vibration assembly and the circuit board for detecting a pressure change generated in the first cavity and converting the pressure change into an electrical signal; a bracket connecting the vibration membrane to the circuit board; wherein, the housing includes a main part and an extension part extending from the main part toward the pressure assembly; the vibration membrane locates between the extension part and the bracket; the circuit board, the bracket and the vibration membrane enclose for forming the first cavity; the main part, the extension part and the vibration membrane enclose for forming a second cavity which is acoustically connected to the first cavity through the vibration membrane. 2. The bone conduction microphone as described in claim 1 further including a gasket locating between the vibration membrane and the bracket, and/or locating between the vibration membrane and the extension part. 3. The bone conduction microphone as described in claim 1 , wherein the weight locates on a side of the vibration membrane away from the pressure assembly, and/or the weight locates on a side of the vibration membrane facing the pressure assembly. 4. The bone conduction microphone as described in claim 1 , wherein the vibration membrane is made of dust-proof and breathable materials resistant to temperatures greater than 200° C. 5. The bone conduction microphone as described in claim 1 further including least one vent hole in the housing. 6. The bone conduction microphone as described in claim 5 , wherein the housing includes a sealer for sealing the vent hole. 7. A bone conduction microphone, including: a housing; a circuit board opposite to the housing; a vibration assembly locating between the housing and the circuit board, including a vibration membrane made of high temperature resistant dustproof breathable material, a weight fixed to the vibration membrane, and a first cavity formed between the vibration membrane and the circuit board; a pressure assembly locating between the vibration assembly and the circuit board for detecting a pressure change generated in the first cavity and converting the pressure change into an electrical signal; a gasket; wherein the housing includes a first side facing the pressure assembly; the gasket locates between the first side surface and the vibration membrane; the housing, the gasket and the vibration membrane enclose for forming a second cavity; the first cavity and the second cavity are acoustically connected through the vibration membrane. 8. The bone conduction microphone as described in claim 7 , wherein the weight locates on a side of the vibration membrane away from the pressure assembly, and/or the weight locates on a side of the vibration membrane facing the pressure assembly. 9. The bone conduction microphone as described in claim 7 , wherein the vibration membrane is made of dust-proof and breathable materials resistant to temperatures greater than 200° C. 10. The bone conduction microphone as described in claim 7 further including least one vent hole in the housing. 11. The bone conduction microphone as described in claim 10 , wherein the housing includes a sealer for sealing the vent hole. 12. A bone conduction microphone, including: a housing; a circuit board opposite to the housing; a vibration assembly locating between the housing and the circuit board, including a vibration membrane made of high temperature resistant dustproof breathable material, a weight fixed to the vibration membrane, and a first cavity formed between the vibration membrane and the circuit board; a pressure assembly locating between the vibration assembly and the circuit board for detecting a pressure change generated in the first cavity and converting the pressure change into an electrical signal; a gasket; wherein the housing includes a main part and an extension part extending from the main part toward the pressure assembly and connect to the circuit board; the main part, the extension part and the circuit board enclose for forming a second cavity; the vibration membrane, the circuit board and the gasket enclose for forming the first cavity, and the first cavity and the second cavity are acoustically connected through the vibration membrane. 13. The bone conduction microphone as described in claim 12 , wherein the gasket is made of elastic material or soft material. 14. The bone conduction microphone as described in claim 12 , wherein the weight locates on a side of the vibration membrane away from the pressure assembly, and/or the weight locates on a side of the vibration membrane facing the pressure assembly. 15. The bone conduction microphone as described in claim 12 , wherein the vibration membrane is made of dust-proof and breathable materials resistant to temperatures greater than 200° C. 16. The bone conduction microphone as described in claim 12 further including least one vent hole in the housing. 17. The bone conduction microphone as described in claim 16 , wherein the housing includes a sealer for sealing the vent hole.

Assignees

Inventors

Classifications

  • H04R1/46Primary

    Special adaptations for use as contact microphones, e.g. on musical instrument, on stethoscope (throat mountings H04R1/14) · CPC title

  • H04R31/006Primary

    Interconnection of transducer parts (of diaphragm and outer suspension by moulding H04R31/003) · CPC title

  • Hearing devices using bone conduction transducers · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11665494B2 cover?
One of the main objects of the present invention is to provide a bone conduction microphone with simplified structure and easier manufacturing process. To achieve the above-mentioned objects, the present invention provides a bone conduction microphone, including: a housing; a circuit board opposite to the housing; and a vibration assembly locating between the housing and the circuit board. The …
Who is the assignee on this patent?
Aac Acoustic Tech Shenzhen Co Ltd
What technology area does this patent fall under?
Primary CPC classification H04R1/46. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 30 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).