Vacuumizing device and vacuumizing method for bonding substrate

Patent metadata

Field	Value
Publication number	US-11664228-B2
Application number	US-201816627693-A
Country	US
Kind code	B2
Filing date	Jun 19, 2018
Priority date	Jun 30, 2017
Publication date	May 30, 2023
Grant date	May 30, 2023

Abstract

A vacuumizing device includes a vacuum chamber, a bonding fixture and a vacuumizing system. The bonding fixture is disposed in the vacuum chamber and includes a substrate table provided with a plurality of grooves for retention of the substrate by suction. The vacuumizing system is disposed in communication with both the vacuum chamber and grooves. During vacuumizing by the vacuumizing system, a vacuum value in the grooves is smaller than or equal to a vacuum value in the vacuum chamber. In the vacuumizing device and methods, the vacuumizing system is used to vacuumize the grooves in the substrate table and the vacuum chamber so that the vacuum value in the grooves is always smaller than or equal to that in the vacuum chamber. As a result, the substrates are firmly retained on the substrate table without warping, thereby improving the quality of substrate bonding.

First claim

What is claimed is:

1. A vacuumizing device, used for providing a vacuum environment for bonding of a substrate, the vacuumizing device comprising a vacuum chamber, a bonding fixture and a vacuumizing system,
wherein the bonding fixture is disposed in the vacuum chamber, the bonding fixture comprising a substrate table provided with a plurality of grooves, which are able to be vacuumized so that the substrate is retained by suction on the substrate table,
wherein the vacuumizing system is configured for vacuumizing of both the vacuum chamber and the plurality of grooves, so that the substrate does not warp during the vacuumizing by the vacuumizing system,
wherein the vacuumizing system comprises a first vacuumizing circuit for vacuumizing the vacuum chamber and a second vacuumizing circuit for vacuumizing the plurality of grooves, the first vacuumizing circuit in communication with the vacuum chamber, the second vacuumizing circuit in communication with the plurality of grooves,
wherein the second vacuumizing circuit comprises a third vacuum pump and a second pressure sensor, the second pressure sensor configured for monitoring the second vacuumizing circuit, the first vacuumizing circuit connected to the second vacuumizing circuit to compensate for working efficiency of the second vacuumizing circuit.

2. The vacuumizing device of claim 1 , wherein during the vacuumizing by the vacuumizing system, a vacuum value in the plurality of grooves is configured to be smaller than or equal to a vacuum value in the vacuum chamber.

3. The vacuumizing device of claim 1 , wherein the first vacuumizing circuit comprises a first pressure sensor, a primary vacuum pipe and a secondary vacuum pipe, the primary vacuum pipe connected in parallel to the secondary vacuum pipe, the first pressure sensor configured to monitor the first vacuumizing circuit and/or the second vacuumizing circuit, the primary vacuum pipe configured for gas-flow evacuation of the vacuum chamber, the secondary vacuum pipe configured for molecular-flow evacuation of the vacuum chamber.

4. The vacuumizing device of claim 3 , wherein the primary vacuum pipe is provided with a first vacuum pump, wherein the primary vacuum pipe has a first end in communication with the vacuum chamber and a second end in communication with the first vacuum pump.

5. The vacuumizing device of claim 4 , wherein the secondary vacuum pipe is provided with a second vacuum pump, the secondary vacuum pipe disposed in series with or in parallel to the first vacuum pump.

6. The vacuumizing device of claim 5 , wherein the second vacuum pump is a molecular pump.

7. The vacuumizing device of claim 4 , wherein the first vacuum pump is a dry pump.

8. The vacuumizing device of claim 3 , wherein the first vacuumizing circuit further comprises a first valve for controlling opening or closing of the primary vacuum pipe and/or the secondary vacuum pipe.

9. The vacuumizing device of claim 1 , wherein the second vacuumizing circuit further comprises a second valve for controlling opening or closing of the second vacuumizing circuit.

10. The vacuumizing device of claim 1 , wherein the third vacuum pump is an air pump.

11. The vacuumizing device of claim 1 , wherein the second vacuumizing circuit further comprises a third valve for controlling connection or disconnection between the first vacuumizing circuit and the second vacuumizing circuit.

Assignees

• Shanghai Micro Electronics Equipment Group Co Ltd

Inventors

• Yu Yuangen
• Huo Zhijun
• Zhao Bin
• Fu Hui
• Wang Xingxing

Classifications

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/0451

  Apparatus for manufacturing or treating in a plurality of work-stations · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title