Power electronics unit

Patent metadata

Field	Value
Publication number	US-11659699-B2
Application number	US-201917259156-A
Country	US
Kind code	B2
Filing date	May 24, 2019
Priority date	Jul 11, 2018
Publication date	May 23, 2023
Grant date	May 23, 2023

Abstract

A power electronics unit may include a circuit board and a cooling device. The circuit board may include at least one electronic component which, in a heat transfer region, is disposed flat against an electronics side of the circuit board. The cooling device may include at least one impingement jet chamber through which a cooling fluid is flowable from an inlet to an outlet. The cooling device may further include at least one nozzle plate having at least one flow nozzle. The at least one nozzle plate may be arranged in and divide the at least one impingement jet chamber into an inlet chamber and an outlet chamber, which may be fluidically connected to one another via the at least one flow nozzle. The at least one flow nozzle may accelerate and conduct the cooling fluid towards the heat transfer region of the at least one electronic component.

First claim

The invention claimed is:

1. A power electronics unit, comprising:
at least one circuit board including at least one electronic component which, in a heat transfer region, is disposed flat against an electronics side of the at least one circuit board in a heat-transferring manner;
a cooling device including at least one impingement jet chamber through which a cooling fluid is flowable from an inlet to an outlet;
the at least one impingement jet chamber heat-transferringly connected to the at least one circuit board on a cooling side disposed opposite the electronics side such that a power dissipation provided by the at least one electronic component is transferable, in the heat transfer region, to the cooling fluid in the at least one impingement jet chamber;
the cooling device further including at least one nozzle plate having at least one flow nozzle, the at least one nozzle plate arranged in and dividing the at least one impingement jet chamber into at least one inlet-side inlet chamber and at least one outlet-side outlet chamber, the at least one inlet chamber and the at least one outlet chamber fluidically connected to one another via the at least one flow nozzle;
wherein the at least one flow nozzle is arranged spaced apart from the heat transfer region of the at least one electronic component such that the at least one flow nozzle accelerates and conducts the cooling fluid flowing in through the inlet towards the heat transfer region of the at least one electronic component;
wherein the at least one outlet chamber is fluidically connected to the outlet via at least one draining passage, which on one side is delimited by at least one cover plate disposed against and coupled to the at least one nozzle plate and on the other side by the at least one nozzle plate; and
wherein the at least one draining passage is fluidically connected to the at least one outlet chamber via an outlet opening disposed in the at least one nozzle plate, which through the at least one nozzle plate fluidically connects the at least one draining passage with the at least one outlet chamber.

2. The power electronics unit according to claim 1 , wherein at least one side of the at least one impingement jet chamber is delimited towards an outside by the at least one circuit board.

3. The power electronics unit according to claim 1 , wherein:
the at least one flow nozzle is defined by a nozzle orifice and a nozzle wall surrounding the nozzle orifice; and
the nozzle wall projects from the at least one nozzle plate into the at least one outlet chamber such that the cooling fluid flowing in through the inlet is conducted towards the heat transfer region of the at least one electronic component.

4. The power electronics unit according to claim 1 , wherein:
the at least one nozzle plate is arranged in the at least one impingement jet chamber parallel to and spaced apart from the at least one circuit board; and
the at least one flow nozzle is directed at the heat transfer region at a jet angle of 30° to 150°.

5. The power electronics unit according to claim 4 , wherein the jet angle is 80° to 100°.

6. The power electronics unit according to claim 1 , wherein the at least one inlet chamber has a first flow cross section and the at least one outlet chamber has a second flow cross section, and wherein at least one of:
the first flow cross section of the at least one inlet chamber decreases in a direction away from the inlet and the second flow cross section of the at least one outlet chamber increases in a direction towards the outlet; and
the first flow cross section of the at least one inlet chamber and the second flow cross section of the at least one outlet chamber are constant.

7. The power electronics unit according to claim 1 , wherein:
the at least one inlet chamber is defined by an inflow passage which fluidically connects the inlet and the at least one flow nozzle with one another; and
the at least one inflow passage is delimited on one side by the at least one nozzle plate and on the other side by at least one cover plate disposed against and coupled to the at least one nozzle plate.

8. The power electronics unit according to claim 7 , wherein the at least one inflow passage is formed in at least one of the at least one nozzle plate and the at least one cover plate.

9. The power electronics unit according to claim 7 , wherein the at least one inflow passage and the at least one draining passage are arranged parallel to one another.

10. The power electronics unit according to claim 1 , wherein:
the at least one flow nozzle includes at least two flow nozzles disposed adjacent to one another; and
the outlet opening is arranged between the at least two flow nozzles such that the cooling fluid is flowable through the at least two flow nozzles into the at least one outlet chamber and, in a region between the at least two flow nozzles, is flowable out of the at least one outlet chamber through the outlet opening.

11. The power electronics unit according to claim 1 , wherein the at least one inlet chamber is connected to the inlet via at least one inlet opening disposed in at least one side plate, which through the at least one side plate connects the at least one inlet chamber with the inlet.

12. The power electronics unit according to claim 1 , wherein:
the at least one flow nozzle includes a plurality of flow nozzles arranged next to one another and which form at least one flow region on the at least one nozzle plate; and
the at least one flow region of the at least one nozzle plate is disposed opposite and spaced apart from the heat transfer region.

13. The power electronics unit according to claim 1 , wherein the at least one draining passage is formed in at least one of the at least one nozzle plate and the at least one cover plate.

14. A power electronics unit, comprising: at least one circuit board having an electronics side and a cooling side disposed opposite one another; at least one electronic component disposed, in a heat transfer region, flat against the electronics side of the at least one circuit board in a heat-transferring manner; a cooling device including at least one impingement jet chamber through which a cooling fluid is flowable from an inlet to an outlet; the at least one impingement jet chamber heat-transferringly connected to the cooling side of the at least one circuit board such that a power dissipation provided by the at least one electronic component is transferable in the heat transfer region to the cooling fluid in the at least one impingement jet chamber; the cooling device further including at least one nozzle plate having at least one flow nozzle, the at least one nozzle plate arranged in and dividing the at least one impingement jet chamber into at least one inlet-side inlet chamber and at least one outlet-side outlet chamber, the at least one inlet chamber and the at least one outlet chamber fluidically connected to one another via the at least one flow nozzle; wherein the at least one nozzle plate is arranged in the at least one impingement jet chamber parallel to and spaced apart from the at least one circuit board; and wherein the at least one flow nozzle is arranged spaced apart from the heat transfer region of the at least one electronic component such that the at least one flow nozzle accelerates and conducts the cooling fluid flowing in through the inlet towards the heat transfer region of the at least one electronic component wherein the at least one outlet chamber is fluidically connected to the outlet via at least one draining passage, which on one side is delimited by at least one cover plate disposed agains

Assignees

• Mahle Int Gmbh

Inventors

• Egger Sebastian
• Ganz Matthias
• Horvat Janko
• Kull Niklas
• Sever Peter

Classifications

• H10W40/475

  using jet impingement (H10W40/776 takes precedence) · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H05K7/20345

  Sprayers; Atomizers · CPC title