Resistor with upper surface heat dissipation
US-10438729-B2 · Oct 8, 2019 · US
Chip component
US11657932B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11657932-B2 |
| Application number | US-202217752200-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 24, 2022 |
| Priority date | Jun 10, 2021 |
| Publication date | May 23, 2023 |
| Grant date | May 23, 2023 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A chip resistor including: a rectangular parallelepiped insulating substrate; a strip-shaped resistor; a pair of front electrodes formed on a front surface of the resistor at both ends in the longitudinal direction; an insulating protective layer; and a pair of end face electrodes formed at both ends of the insulating substrate in the longitudinal direction, each of which is connected to each end face of the resistor, corresponding one of the front electrodes, and protective film; and a pair of external electrodes, wherein a cross-sectional shape of each of the front electrodes is almost a triangle in which a side of the end face has a maximum height, and a shape of an end face of each of the end face electrodes is almost a square.
First claim
Opening claim text (preview).
The invention claimed is: 1. A chip component comprising: a rectangular parallelepiped insulating substrate; a strip-shaped conductive film formed on a main surface of the insulating substrate along a longitudinal direction; a pair of electrodes formed on a surface of the conductive film at both ends in the longitudinal direction; an insulating protective layer that entirely covers the main surface of the insulating substrate including the conductive film and the pair of electrodes; and a pair of cap-shaped end face electrodes formed at both ends of the insulating substrate in the longitudinal direction, and each of which is connected to an end face of the conductive film, an end face of corresponding one of the pair of electrodes, and an end face of the protective film, wherein a cross-sectional shape of each of the pair of electrodes is almost a triangle in which a side of the end face has a maximum height, and a shape of an end face of each of the pair of end face electrodes is almost a square. 2. The chip component according to claim 1 , wherein the conductive film is a resistor, and the protective layer is formed of a glass coating layer that covers the resistor and a resin coating layer that covers the glass coating layer. 3. The chip component according to claim 1 , wherein a film thickness of the glass coating layer is less than a maximum height dimension of the pair of electrodes. 4. The chip component according to claim 1 , wherein the pair of electrodes is connected to corresponding one of the pair of end face electrodes via three faces of each of the pair of electrodes including an end face in the longitudinal direction of the insulating substrate and both side faces adjacent to the end face. 5. The chip component according to claim 2 , wherein the pair of electrodes is connected to corresponding one of the pair of end face electrodes via three faces of each of the pair of electrodes including an end face in the longitudinal direction of the insulating substrate and both side faces adjacent to the end face. 6. The chip component according to claim 3 , wherein the pair of electrodes is connected to corresponding one of the pair of end face electrodes via three faces of each of the pair of electrodes including an end face in the longitudinal direction of the insulating substrate and both side faces adjacent to the end face.
Assignees
Inventors
Classifications
- H01C1/14Primary
Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title
- H01C7/003Primary
Thick film resistors · CPC title
Surface mountable, e.g. chip trimmer potentiometer · CPC title
adapted for manufacturing resistor chips · CPC title
- H01C1/028Primary
the resistive element being embedded in insulation with outer enclosing sheath · CPC title
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Frequently asked questions
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- What does patent US11657932B2 cover?
- A chip resistor including: a rectangular parallelepiped insulating substrate; a strip-shaped resistor; a pair of front electrodes formed on a front surface of the resistor at both ends in the longitudinal direction; an insulating protective layer; and a pair of end face electrodes formed at both ends of the insulating substrate in the longitudinal direction, each of which is connected to each e…
- Who is the assignee on this patent?
- Koa Corp
- What technology area does this patent fall under?
- Primary CPC classification H01C1/14. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 23 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).