Hot melt adhesive for polyolefin films

US11655400B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11655400-B2
Application numberUS-201715493758-A
CountryUS
Kind codeB2
Filing dateApr 21, 2017
Priority dateOct 23, 2014
Publication dateMay 23, 2023
Grant dateMay 23, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A hot-melt adhesive composition is disclosed. The hot melt adhesive comprises a) 25 to 95 wt %, preferably 50 to 85 wt % of at least one polyolefin-based polymer; b) 1 to 75 wt %, preferably 1 to 40 wt % of at least one tackifying resin; c) 0 to 15 wt % of at least one plasticizer; and d) 0 to 30 wt % of at least one additive and/or adjuvant selected from among stabilizers, adhesion promoters, fillers or pigments, waxes, and/or other polymers or combinations thereof, characterized in that the at least one polyolefin-based polymer is a mixture of: a1) at least one first polyolefin-based polymer with a molecular weight M n of <10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer, and a2) at least one second polyolefin-based polymer with a molecular weight M n of >10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer. The adhesive is particularly useful for gluing polyolefin films, woven fabrics, or nonwoven fabrics. Also, methods for manufacturing packaging and fabric with the hot-melt adhesive above are disclosed.

First claim

Opening claim text (preview).

The invention claimed is: 1. A hot-melt adhesive consisting of: a) 25 to 95 wt % of a mixture of atactic polyolefin-based polymers of a1) 20 to 80 wt %, based on the mixture of polyolefin-based polymer, of a first atactic poly-α-olefin, which is an (i) ethylene/α-olefin with propene, 1-butene, 1-hexene, or 1-octene comonomer; or (ii) propylene/α-olefin with ethylene, 1-butene, 1-hexene, or 1-octene comonomer; having a molecular weight M n of <10,000 g/mol and a first glass transition temperature, and a2) 20 to 80 wt %, based on the mixture of polyolefin-based polymer, of a second atactic poly-α-olefin, which is an (i) ethylene/α-olefin with propene, 1-butene, 1-hexene, or 1-octene comonomer; or (ii) propylene/α-olefin with ethylene, 1-butene, 1-hexene, or 1-octene comonomer; having a molecular weight M n of >10,000 g/mol and a second glass transition temperature; b) 1 to 75 wt % of at least one tackifying resin; c) 0 to 15 wt % of at least one poly(iso)butylene having a molecular weight M w of less than 5,000 g/mol and free of naphthenic oils; and d) 0 to 30 wt % of at least one additive and/or adjuvant selected from stabilizers, adhesion promoters, fillers or pigments, waxes, or combinations thereof wherein the hot-melt adhesive has a viscosity range of 5,000 to 11,300 mPas, measured at 160° C. with a Brookfield CAP, spindle 27 and wherein the hot-melt adhesive has a softening point of 70-87.9° C. as measured in accordance with ASTM E 28. 2. The hot-melt adhesive as set forth in claim 1 , wherein, the tackifying resin is a natural resin based on colophony resin or tall oil resin. 3. The hot-melt adhesive as set forth in claim 1 , wherein, the tackifying resin is a fully or partially hydrated hydrocarbon resin, which is a cycloaliphatic resin, an aromatically modified resin, a polyterpene, a terpene phenolic resin, a 1,3-pentadiene resin, a cyclopentadiene resin, a 2-methyl-2-butene copolymer, or a derivative thereof. 4. The hot-melt adhesive as set forth in claim 1 , wherein, in that the at least one additive and/or the adjuvant is a stabilizer.

Assignees

Inventors

Classifications

  • Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title

  • Paper; Textile fabrics · CPC title

  • Heat-activated · CPC title

  • Woven fabric · CPC title

  • Hot-melt adhesive · CPC title

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What does patent US11655400B2 cover?
A hot-melt adhesive composition is disclosed. The hot melt adhesive comprises a) 25 to 95 wt %, preferably 50 to 85 wt % of at least one polyolefin-based polymer; b) 1 to 75 wt %, preferably 1 to 40 wt % of at least one tackifying resin; c) 0 to 15 wt % of at least one plasticizer; and d) 0 to 30 wt % of at least one additive and/or adjuvant selected from among stabilizers, adhesion …
Who is the assignee on this patent?
Henkel Ag & Co Kgaa
What technology area does this patent fall under?
Primary CPC classification C09J123/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue May 23 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).