Sealed isocyanates

Patent metadata

Field	Value
Publication number	US-11655332-B2
Application number	US-202017104034-A
Country	US
Kind code	B2
Filing date	Nov 25, 2020
Priority date	Apr 20, 2018
Publication date	May 23, 2023
Grant date	May 23, 2023

Abstract

The present disclosure relates to sealed isocyanate resin compositions. The resin compositions may be used for additive manufacturing. One embodiment of the invention includes a photopolymerizable resin for additive manufacturing, the resin comprising: a blocked isocyanate; at least one monomer or oligomer; and a multifunctional nucleophile.

First claim

What is claimed is:

1. A photopolymerizable resin for additive manufacturing comprising:
a blocked isocyanate;
about 0.01-5% by weight of a stabilized thiol; and
at least about 30% by weight of one or more acrylic monomers,
wherein the resin is configured to react by exposure to light to form a cured material,
wherein a layer of the resin about 100 μm thick is configured to form the cured material in no more than 30 seconds,
wherein the cured material has a toughness in the range of about 3-100 MJ/m 3 and a strain at break in the range of about 30-1000%.

2. The photopolymerizable resin according to claim 1 , wherein the blocked isocyanate includes at least one of a uretdione, a biuret, an allophanate, an isocyanaurate, methylene dicyclohexyl diisocyanate (MDI), or toluene diisocyanate (TDI).

3. The photopolymerizable resin according to claim 2 , wherein the uretdione is a uretdione of hexamethylene diisocyanate (HDI), a uretdione of isophorone diisocyanate (IDI), a uretdione of methylene dicyclohexyl diisocyanate (MDI), a uretdione of hydrogenated methylene dicyclohexyl diisocyanate (HMDI), or a uretdione of toluene diisocyanate (TDI).

4. The photopolymerizable resin according to claim 2 , wherein the isocyanaurate is an isocyanaurate of hexamethylene diisocyanate (HDI), an isocyanaurate of isophorone diisocyanate (IDI), an isocyanaurate of methylene dicyclohexyl diisocyanate (MDI), an isocyanaurate of hydrogenated methylene dicyclohexyl diisocyanate (HMDI), or an isocyanaurate of toluene diisocyanate (TDI).

5. The photopolymerizable resin according to claim 2 , wherein the biuret is a biuret of hexamethylene diisocyanate (HDI), a biuret of isophorone diisocyanate (IDI), a biuret of methylene dicyclohexyl diisocyanate (MDI), a biuret of hydrogenated methylene dicyclohexyl diisocyanate (HMDI), or a biuret of toluene diisocyanate (TDI).

6. The photopolymerizable resin according to claim 2 , wherein the allophanate is an allophanate of hexamethylene diisocyanate (HDI), an allophanate of isophorone diisocyanate (IDI), an allophanate of methylene dicyclohexyl diisocyanate (MDI), an allophanate of hydrogenated methylene dicyclohexyl diisocyanate (HMDI), or an allophanate of toluene diisocyanate (TDI).

7. The photopolymerizable resin according to claim 1 , wherein the blocked isocyanate includes an isocyanate and a blocking agent.

8. The photopolymerizable resin according to claim 7 , wherein the isocyanate is configured to react with the blocking agent such that isocyanate functional groups of the isocyanate are end-capped.

9. The photopolymerizable resin according to claim 7 , wherein the blocking agent includes at least one of a nucleophile, a derivative of an alcohol, a hindered amine, a caprolactam, a phenol, an oxime, or a pyrazole malonate.

10. The photopolymerizable resin according to claim 1 , wherein the cured material has a strain at break in the range of about 100-800%.

11. The photopolymerizable resin according to claim 1 , wherein a layer of the resin in the range of about 100-400 μm thick is configured to form the cured material in no more than 1 second.

12. The photopolymerizable resin according to claim 1 , wherein the layer of the resin about 100 μm thick is configured to form the cured material in no more than 20 seconds.

13. The photopolymerizable resin according to claim 1 , wherein a layer of the resin about 1000 μm thick is configured to form the cured material in no more than 30 seconds.

14. The photopolymerizable resin according to claim 1 , wherein a layer of the resin about 10 μm thick is configured to form the cured material in no more than 2 seconds.

15. The resin mixture according to claim 1 , wherein the stabilized thiol comprises a secondary thiol.

16. The resin mixture according to claim 15 , wherein the secondary thiol includes at least one of Pentaerythritol tetrakis (3-mercaptobutylate), 1,4-bis (3-mercaptobutylyloxy) butane, or 1,3,5-Tris(3-mercaptobutyloxethyl)-1,3,5-triazine.

17. The resin mixture according to claim 1 , further comprising at least one of a photoinitiator, an inhibitor, a dye, or a filler.

Assignees

• Adaptive 3D Tech
• Univ Texas

Inventors

• Lund Benjamin R
• Voit Walter

Classifications

• B33Y70/00

  Materials specially adapted for additive manufacturing · CPC title

• C08G18/3855

  having sulfur · CPC title

• C08F220/12

  of monohydric alcohols or phenols · CPC title

• C08G18/80 Primary

  Masked polyisocyanates · CPC title

• C08G18/672

  Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen · CPC title