Base film and pressure-sensitive adhesive sheet provided therewith

Patent metadata

Field	Value
Publication number	US-9559073-B2
Application number	US-201214005574-A
Country	US
Kind code	B2
Filing date	Mar 22, 2012
Priority date	Mar 22, 2011
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground.
[Solution] This base film for a pressure-sensitive adhesive sheet bonded to a semiconductor wafer comprises: (A) a layer obtained by using energy rays to cure a formulation containing a urethane (meth)acrylate oligomer and a thiol-group-containing compound; and (B) a layer comprising a thermoplastic resin.

First claim

The invention claimed is:

1. A pressure sensitive adhesive sheet to be adhered on a semiconductor wafer, comprising:
a pressure sensitive adhesive layer on a base film,
said base film comprising (A) a layer of a cured product in which a composition including a urethane (meth)acrylate oligomer, a thiol group containing compound, and an energy ray curable monomer is cured by an energy ray irradiation before adhering the pressure sensitive adhesive sheet to the semiconductor wafer, and (B) a thermoplastic resin layer,
wherein a content of the thiol group containing compound of said composition is 2 to 100 mmol with respect to 100 g of urethane (meth)acrylate oligomer.

2. The pressure sensitive adhesive sheet as set forth in claim 1 , wherein a content of the thiol group containing compound of said composition is 4 to 85 mmol with respect to 100 g of urethane (meth)acrylate oligomer.

3. The pressure sensitive adhesive sheet as set forth in claim 1 , wherein a compressive stress of the pressure sensitive adhesive sheet at 23° C. is 0.05 to 7 MPa.

4. The pressure sensitive adhesive sheet as set forth in claim 1 , wherein said layer (A) is formed on the thermoplastic resin layer (B).

5. The pressure sensitive adhesive sheet as set forth in claim 1 , wherein the thermoplastic resin layer (B) comprises a plurality of layers.

6. The pressure sensitive adhesive sheet as set forth in claim 1 , wherein the thiol group containing compound is selected from the group consisting of nonyl mercaptan, 1-dodecanthiol, 1,2-ethanedithiol, 1,3-propanedithiol, triazinethiol, triazinedithiol, triazinetrithiol, 1,2,3-propanetrithiol, tetraethyleneglycol-bis(3-mercaptopropionate), trimethylolpropanetris(3-mercaptopropionate), tris[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, 1,4-bis(3-mercaptobutryloxy) butane, pentaerythritol tetrakis(3-mercaptobutylate), and 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione.

7. The pressure sensitive adhesive sheet as set forth in claim 1 , wherein the thermoplastic resin layer (B) comprises a thermoplastic resin selected from the group consisting of polyethyleneterephthalate, polyimide, polyetheretherketone, polyvinylchloride, polyvinylidenechloride, polyamide, polyurethane, an acrylic resin, a fluorine resin, a cellulose resin, and a polycarbonate resin.

8. The pressure sensitive adhesive sheet as set forth in claim 1 , wherein the thermoplastic resin layer (B) comprises a thermoplastic resin selected from the group consisting of polyimide, polyetheretherketone, polyamide, polyurethane, a fluorine resin, a cellulose resin, and a polycarbonate resin.

9. The pressure sensitive adhesive sheet as set forth in claim 1 , wherein the energy ray curable monomer comprises a (meth)acrylate having an alicylic structure.

10. The pressure sensitive adhesive sheet as set forth in claim 1 , wherein the energy ray curable monomer comprises a (meth)acrylate having an aromatic structure.

11. The pressure sensitive adhesive sheet as set forth in claim 1 , wherein the energy ray curable monomer comprises a (meth)acrylate having a heterocyclic structure.

Assignees

• Tamura Kazuyuki
• Akutsu Takashi
• Eto Yuki
• Hukuzaki Tomohide
• Lintec Corp
• Arakawa Chem Ind

Inventors

• Tamura Kazuyuki
• Akutsu Takashi
• Eto Yuki
• Hukuzaki Tomohide

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P72/7404

  the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer · CPC title

• H10W72/30 Primary

  Die-attach connectors · CPC title