Semiconductor Device and Method
US-2020135997-A1 · Apr 30, 2020 · US
US11652198B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11652198-B2 |
| Application number | US-202217589896-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 1, 2022 |
| Priority date | Sep 25, 2018 |
| Publication date | May 16, 2023 |
| Grant date | May 16, 2023 |
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Official abstract text for this publication.
A light-emitting device including a light-emitting module, a first wiring and a second wiring. The light-emitting module includes one or more light-emitting elements and a package covering the one or more light-emitting elements. Each of the one or more light-emitting elements has a first electrode and a second electrode. The light-emitting module has a groove structure on a lower surface side. The first wiring and the second wiring are partially or entirely present in the groove structure. At least part of the first electrode and at least part of the second electrode are exposed to an inside of the groove structure. The first wiring is electrically connected with the first electrode, and the second wiring is electrically connected with the second electrode.
Opening claim text (preview).
What is claimed is: 1. A light-emitting device comprising: a light-emitting module including one or more light-emitting elements and a package covering the one or more light-emitting elements, each of the one or more light-emitting elements having a first electrode and a second electrode, the light-emitting module having a groove structure on a lower surface side of the light-emitting module; and a first wiring and a second wiring which are partially or entirely present in the groove structure, wherein at least part of the first electrode and at least part of the second electrode are in contact with an inside of the groove structure, the first wiring is electrically connected with the first electrode, and the second wiring is electrically connected with the second electrode. 2. The light-emitting device of claim 1 , wherein the groove structure has a bottom surface which has surface unevenness. 3. The light-emitting device of claim 2 , wherein the bottom surface of the groove structure includes a set of a plurality of first grooves. 4. The light-emitting device of claim 3 , wherein the bottom surface of the groove structure is formed by the set of the plurality of first grooves, and further defines a plurality of second grooves each extending in a direction different from an extending direction of the plurality of first grooves. 5. The light-emitting device of claim 1 , wherein a surface of the first wiring and a surface of the second wiring are substantially coplanar with a lower surface of the package. 6. The light-emitting device of claim 1 , wherein part of the first electrode which is in contact with the inside the groove structure and part of the second electrode which is in contact with the inside the groove structure each have a stepped portion. 7. The light-emitting device of claim 1 , wherein the package includes a covering member covering the one or more light-emitting elements except for part of the first electrode and part of the second electrode, and a resin layer provided on a side of the covering member which is closer to a lower surface of the package, the resin layer defining an opening, the groove structure is a structure defined by the opening of the resin layer, and part of the first wiring and part of the second wiring are present inside the opening of the resin layer.
Package configurations · CPC title
batch processes · CPC title
Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title
of interconnections · CPC title
of electrodes · CPC title
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