Solid state switching device including nested control electronics

Patent metadata

Field	Value
Publication number	US-11652091-B2
Application number	US-202016906799-A
Country	US
Kind code	B2
Filing date	Jun 19, 2020
Priority date	Jun 19, 2020
Publication date	May 16, 2023
Grant date	May 16, 2023

Abstract

A solid state switching device, such as a solid state circuit breaker, includes at least one heat sink, a control electronics printed circuit board (PCB), and power electronics. The power electronics are useful to regulate the flow of current from one terminal of the solid state switching device to another terminal. The power electronics can include one or more solid state devices such as FETs, Thyristors, Thyristors+SiC JFET in parallel, IGBTs, and IGCTs. The control PCB can include a variety of circuit elements useful to perform the function of a gate driver useful to activate the solid state device of the power electronics. The heat sink includes one or more signal vias formed therethrough to permit nesting of the control PCB within the heat sink.

First claim

What is claimed is:

1. An apparatus, comprising:
a solid state current interrupting device having a first power terminal and a second power terminal, the solid state current interrupting device comprising:
a power electronics module having at least one solid-state component configured to regulate flow of current between the first power terminal and second power terminal;
a heat sink positioned in thermal contact with the power electronics module such that heat generated from the power electronics module is dissipated through the heat sink, the heat sink having a signal via formed in the heat sink and which extends from a first side of the heat sink to a second side of the heat sink; and
at least one control electronics printed circuit board configured to provide a control signal to the at least one solid-state component of the power electronics module,

wherein the power electronics module is located on the first side of the heat sink,
wherein the at least one control electronics printed circuit board is located on the second side of the heat sink, and
wherein a signal carrying conductive lead is positioned in the signal via and is electrically connected to the at least one control electronics printed circuit board on one end and the power electronics on an opposing end of the signal carrying conductive lead.

2. The apparatus of claim 1 , wherein the at least one solid-state component is a gate driven component configured to halt current.

3. The apparatus of claim 2 , wherein the at least one solid-state component comprises a FET, thyristor, an IGBT, and an RB-IGCT, and
wherein the solid-state current interrupting device comprises a solid state circuit breaker.

4. The apparatus of claim 1 , wherein the at least one control electronics printed circuit board includes a top surface and a bottom surface, the bottom surface of the at least one control electronics printed circuit board offset from the heat sink such that transmission of thermal energy is discouraged from the heat sink to the at least one control electronics printed circuit board.

5. The apparatus of claim 1 , wherein a thermal insulator is disposed between the at least one control electronics printed circuit board and the heat sink.

6. The apparatus of claim 1 , wherein the signal carrying conductive lead positioned in the signal via at least one of one of a pin or a terminal.

7. The apparatus of claim 6 , wherein the signal carrying conductive lead is isolated from the heat sink by an electric insulator.

8. The apparatus of claim 6 , wherein the signal carrying conductive lead is configured to structurally support the at least one control electronics printed circuit board such that the offset formed from the heat sink is maintained through the signal carrying conductive lead.

9. An apparatus, comprising:
a solid state current interrupting device having a first power terminal and a second power terminal, the solid state current interrupting device comprising:
a power electronics module having at least one solid-state component configured to regulate flow of current between the first power terminal and second power terminal;
a heat sink positioned in thermal contact with the power electronics module such that heat generated from the power electronics module is dissipated through the heat sink, the heat sink having a signal via formed in the heat sink and which extends from a first side of the heat sink to a second side of the heat sink; and
at least one control electronics printed circuit board configured to provide a control signal to the at least one solid-state component of the power electronics module,

wherein the power electronics module is located on the first side of the heat sink,
wherein the at least one controller electronics printed circuit board is located on the second side of the heat sink,
wherein a signal carrying conductive lead is positioned in the signal via and is electrically connected to the at least one control electronics printed circuit board on one end and the power electronics on an opposing end of the signal carrying conductive lead,
wherein the heat sink includes a plurality of heat sink fins that extend from a base of the heat sink,
wherein the heat sink includes a heat sink fin on a first lateral side of a heat sink, and the heat sink includes a second heat sink fin on an opposing second lateral side of the heat sink, and
wherein the control electronics printed circuit board is positioned between the first heat sink fin and a second heat sink fin.

10. The apparatus of claim 9 , wherein the at least one control electronics printed circuit board comprises a plurality of control electronics printed circuit boards, and
wherein each control electronics printed circuit board of the plurality of control electronics printed circuit boards is arranged between neighboring heat sink fins of the plurality of heat sink fins.

Assignees

• Abb Schweiz Ag

Inventors

• Salvatore Giovanni
• Kicin Slavo

Classifications

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H05K7/209 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence) · CPC title

• H01H9/52

  Cooling of switch parts (cooling of contacts H01H1/62) · CPC title

• H01H71/00 Primary

  Details of the protective switches or relays covered by groups H01H73/00 - H01H83/00 · CPC title