Polishing pad conditioning apparatus

Patent metadata

Field	Value
Publication number	US-11648644-B2
Application number	US-201916517849-A
Country	US
Kind code	B2
Filing date	Jul 22, 2019
Priority date	Jan 2, 2019
Publication date	May 16, 2023
Grant date	May 16, 2023

Abstract

A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit disposed at the distal end portion of the pivot arm. The head unit includes: a rotary motor provided in the internal space of the housing, the rotary motor including a rotary shaft; a foreign material blocking member connected to the rotary shaft; a disk holder connected to the rotary shaft; and a conditioning disk coupled to the disk holder. The foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member.

First claim

What is claimed is:

1. A polishing pad conditioning apparatus, comprising:
an apparatus body;
a pivot arm provided on the apparatus body and comprising a housing having an internal space and provided at a distal end portion of the pivot arm; and
a head unit disposed at the distal end portion of the pivot arm,
wherein the head unit comprises:
a rotary motor provided in the internal space of the housing, the rotary motor comprising a rotary shaft;
a foreign material blocking member connected to the rotary shaft;
a disk holder connected to the rotary shaft; and
a conditioning disk coupled to the disk holder, and

wherein the foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member.

2. The polishing pad conditioning apparatus of claim 1 , wherein the fluid flow groove has a spiral shape.

3. The polishing pad conditioning apparatus of claim 2 , wherein a first width of the fluid flow groove at a first end portion of the outer surface of the foreign material blocking member is smaller than a second width of the fluid flow groove at a second end portion opposite to the first end portion of the outer surface in an axial direction of the foreign material blocking member.

4. The polishing pad conditioning apparatus of claim 2 , wherein a first depth of the fluid flow groove at a first end portion of the outer surface of the foreign material blocking member is less than a second depth of the fluid flow groove at a second end portion opposite to the first end portion of the outer surface in an axial direction of of the foreign material blocking member.

5. The polishing pad conditioning apparatus of claim 1 , wherein the fluid flow groove has a linear shape.

6. The polishing pad conditioning apparatus of claim 5 , wherein the fluid flow groove extends in an axial direction and comprises a plurality of fluid flow grooves, and
wherein the plurality of fluid flow grooves are spaced apart from one another in a circumferential direction of the foreign material blocking member.

7. The polishing pad conditioning apparatus of claim 1 , wherein the head unit further includes a deformation member disposed between the foreign material blocking member and the disk holder in an axial direction of the deformation member.

8. The polishing pad conditioning apparatus of claim 7 , wherein the deformation member includes a deformation groove for permitting deformation of the deformation member in response to an external force being applied to an outer surface of the deformation member.

9. The polishing pad conditioning apparatus of claim 8 , wherein the deformation groove comprises:
a first deformation groove extending in an axial direction of the deformation member, and
a second deformation groove extending from the first deformation groove.

10. The polishing pad conditioning apparatus of claim 9 , wherein the first deformation groove extends perpendicularly from the second deformation groove.

11. The polishing pad conditioning apparatus of claim 10 , wherein the deformation member comprises elastic material.

12. The polishing pad conditioning apparatus of claim 1 , wherein the housing further includes a fluid flow path configured to guide fluid an area between an inner surface of the housing and the outer surface of the foreign material blocking member.

13. The polishing pad conditioning apparatus of claim 12 , wherein the fluid being supplied through the fluid flow path comprises at least one of air, an inert gas, or water.

14. The polishing pad conditioning apparatus of claim 13 , wherein the pivot arm further comprises a fluid flow tube provided in the pivot arm; and
wherein the fluid flow path is connected to the fluid flow tube.

15. A polishing pad conditioning apparatus, comprising:
an apparatus body;
a pivot arm extending from the apparatus body and including a housing having an internal space and provided at a first end portion of the pivot arm; and
a head unit disposed at the first end portion of the pivot arm,
wherein the head unit comprises:
a rotary motor provided in the internal space of the housing and comprising a rotary shaft;
a deformation member connected to the rotary shaft of the rotary motor;
a disk holder connected at a first portion of the deformation member along an axial direction of the deformation member; and
a conditioning disk coupled to the disk holder, and

wherein the deformation member includes a deformation groove for reducing deformation stress induced by an external force to the conditioning disk
wherein the deformation groove comprises:
a first deformation groove extending in an axial direction; and
a second deformation groove extending perpendicularly from the first deformation groove,
wherein the housing includes a fluid flow path configured to guide fluid to an area between an inner surface of the housing and an outer surface of a foreign material blocking member.

16. The polishing pad conditioning apparatus of claim 15 , wherein the deformation member comprises elastic material.

17. The polishing pad conditioning apparatus of claim 15 , wherein the pivot arm further comprises a fluid flow tube provided in the pivot arm; and
wherein the fluid flow path is connected to the fluid flow tube of the pivot arm.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Eun Seok
• Koo Ja Eung
• Kim Kuen Byul
• Na Jeong Min
• Ryu Chang Gil
• Song Hyeon Dong
• Jang Young Seok
• Hong Jin Suk

Classifications

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• B24B37/34

  Accessories · CPC title

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• B24B21/18

  Accessories · CPC title

• B24D13/145

  having a brush-like working surface · CPC title