Method for encapsulating openings in display area, encapsulation structure of openings in display area and display panel

Patent metadata

Field	Value
Publication number	US-11647646-B2
Application number	US-201916765270-A
Country	US
Kind code	B2
Filing date	Dec 19, 2019
Priority date	Jan 8, 2019
Publication date	May 9, 2023
Grant date	May 9, 2023

Abstract

A method for encapsulating openings in a display area includes: forming an intermediate layer having an isolation hole and an assembly via on a substrate, the isolation hole dividing the intermediate layer into separate display portion and isolation portion and the assembly via being spaced apart from the isolation hole by the isolation portion; forming a groove on a side of the isolation portion facing the display portion and/or on a side of the isolation portion away from the display portion; forming a light emitting layer including a first light emitting portion, a second light emitting portion, a third light emitting portion, and a fourth light emitting portion, wherein the third light emitting portion is separate from at least one of the second light emitting portion and the fourth light emitting portion; and forming an encapsulation layer that covers the light emitting layer and the isolation portion, and is filled in a groove.

First claim

What is claimed is:

1. A method for encapsulating openings in a display area, comprising:
forming an intermediate layer having an isolation hole and an assembly via on a substrate, the isolation hole dividing the intermediate layer into a display portion and an isolation portion separated from each other, and the assembly via being spaced apart from the isolation hole by the isolation portion, wherein the isolation portion is adapted for isolation and encapsulation rather than display and comprises a plurality of inorganic layers, a metal layer, and an organic layer stacked in a direction perpendicular to the substrate, the metal layer being located between adjacent inorganic layers, the organic layer being located on top of the plurality of inorganic layers, an orthographic projection of the assembly via on the substrate is within an orthographic projection of the isolation hole on the substrate, and a bottom of the isolation hole, a bottom of the assembly via, and a bottom of the isolation portion are disposed on a same level;
forming a groove on at least one of: a side of the isolation portion facing the display portion and a side of the isolation portion away from the display portion, wherein an opening direction of the groove is perpendicular to an opening direction of the isolation hole, and an orthographic projection of the groove on the substrate is within an orthographic projection of the isolation portion on the substrate;
forming a light emitting layer on a side of the intermediate layer away from the substrate, the light emitting layer being divided into a plurality of disconnected portions by at least one of the isolation hole and the assembly via, wherein the light emitting layer comprises at least a third light emitting portion which is a top layer of the isolation portion, and a fourth light emitting portion formed on the substrate and located in the assembly via; and
forming an encapsulation layer, the encapsulation layer covering the light emitting layer and the isolation portion and being filled in the groove.

2. The method for encapsulating openings in the display area according to claim 1 , wherein:
the light emitting layer further comprises a first light emitting portion formed on the display portion, and a second light emitting portion formed on the substrate and located in the isolation hole; and
the third light emitting portion is separate from at least one of the second light emitting portion and the fourth light emitting portion.

3. The method for encapsulating openings in the display area according to claim 1 , wherein forming the groove on at least one of the side of the isolation portion facing the display portion and the side of the isolation portion away from the display portion comprises:
etching at least one of a side on the inorganic layer of the isolation portion facing the display portion and a side on the inorganic layer of the isolation portion away from the display portion using an inorganic etching solution to form the groove.

4. The method for encapsulating openings in the display area according to claim 3 , wherein the inorganic etching solution is hydrofluoric acid.

5. The method for encapsulating openings in the display area according to claim 1 , wherein, before forming the groove on at least one of the side of the isolation portion facing the display portion and the side of the isolation portion away from the display portion, the method further comprises forming a protective layer on the display portion.

6. The method for encapsulating openings in the display area according to claim 5 , wherein the protective layer is made of a photoresist.

7. The method for encapsulating openings in the display area according to claim 1 , wherein forming the groove on at least one of the side of the isolation portion facing the display portion and the side of the isolation portion away from the display portion specifically comprises forming a groove on both the side of the isolation portion facing the display portion and the side of the isolation portion away from the display portion.

8. The method for encapsulating openings in the display area according to claim 2 , wherein forming the light emitting layer comprises:
evaporating a luminescent material on the isolation portion, the display portion, and an area on the substrate except for the isolation portion and the display portion, so that the luminescent material is discontinuously distributed due to the groove provided in the isolation portion to form the first light emitting portion, the second light emitting portion, the third light emitting portion, and the fourth light emitting portion.

9. An encapsulation structure of openings in a display area, comprising:
a substrate;
an intermediate layer located on the substrate, the intermediate layer having an isolation hole and an assembly via, the isolation hole dividing the intermediate layer into display portion and isolation portion separated from each other, and the assembly via being spaced apart from the isolation hole by the isolation portion, wherein the isolation portion is adapted for isolation and encapsulation rather than display and comprises a plurality of inorganic layers, a metal layer, and an organic layer stacked in a direction perpendicular to the substrate, the metal layer being located between adjacent inorganic layers, the organic layer being located on top of the plurality of inorganic layers, an orthographic projection of the assembly via on the substrate is within an orthographic projection of the isolation hole on the substrate, and a bottom of the isolation hole, a bottom of the assembly via, and a bottom of the isolation portion are disposed on a same level;
a groove formed on a side of the isolation portion facing the display portion and/or on a side of the isolation portion away from the display portion, wherein an opening direction of the groove is perpendicular to an opening direction of the isolation hole, and an orthographic projection of the groove on the substrate is within an orthographic projection of the isolation portion on the substrate;
a light emitting layer on a side of the intermediate layer away from the substrate, and disconnected at at least one of the isolation hole and the assembly via, wherein the light emitting layer comprises at least a third light emitting portion which is a top layer of the isolation portion, and a fourth light emitting portion formed on the substrate and located in the assembly via; and
an encapsulation layer covering the light emitting layer and the isolation portion and being filled in the groove.

10. The encapsulation structure of openings in the display area according to claim 9 , wherein the light emitting layer comprises a first light emitting portion, a second light emitting portion, the third light emitting portion and the fourth light emitting portion that are separate from one another, the first light emitting portion being located on a side of the display portion away from the substrate, and the second light emitting portion being formed on the substrate and located in the isolation hole.

11. The encapsulation structure of openings in the display area according to claim 9 , further comprising a protective layer on the display portion.

12. The encapsulation structure of openings in the display area according to claim 11 , wherein the protective layer is made of photoresist.

13. The encapsulation structure of openings in the display area according to claim 9 , wherein the metal layer comprises molybdenum.

14. A display panel comprising an encapsulation structure for encapsulating openings in a display area, the encapsulation st

Assignees

• Chengdu Boe Optoelect Tech Co
• Boe Technology Group Co Ltd

Inventors

• Ji Yufei
• Yang Dong
• Xu Jiahao
• Wang Jianglin
• Lu Dongliang
• Song Liang
• Cheng Hao

Classifications

• H10K59/65

  OLEDs integrated with inorganic image sensors · CPC title

• H10K50/844 Primary

  Encapsulations · CPC title

• H10K59/873 Primary

  Encapsulations · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title