Hermetically sealed electronic device using solder bonding
US-9205505-B2 · Dec 8, 2015 · US
US2020144535A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2020144535-A1 |
| Application number | US-201916670467-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 31, 2019 |
| Priority date | Nov 1, 2018 |
| Publication date | May 7, 2020 |
| Grant date | — |
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An electroluminescence display device having a through-hole in a display area is discussed. The electroluminescence display device can include a substrate, a through-hole, an inner dam, and a hole-trench. The substrate includes a display area where a plurality of pixels for displaying images are arranged, and a non-display area surrounding the display area. The through-hole is arranged inside the display area. The inner dam surrounds the through-hole. The hole-trench surrounds the inner dam, and is formed as the substrate is partially recessed as much as a certain thickness.
Opening claim text (preview).
What is claimed is: 1 . An electroluminescence display device comprising: a substrate having a display area and a non-display area surrounding the display area, the display area having a plurality of pixels for displaying images; a through-hole arranged inside the display area; an inner dam surrounding the through-hole; and a hole-trench surrounding the inner dam, and formed as the substrate is partially recessed as much as a certain thickness. 2 . The electroluminescence display device of claim 1 , wherein the display area includes: a light emitting diode configured to provide image information; and a driving element configured to drive the light emitting diode, and wherein the through-hole is formed by removing the substrate, the light emitting diode and the driving element. 3 . The electroluminescence display device of claim 2 , wherein the hole-trench includes: a bottom surface defined at a position more recessed at a certain depth than an upper surface of the substrate; an upper surface defined on the upper surface of the substrate; and a sidewall for connecting the bottom surface of the hole-trench with the upper surface of the hole-trench, and wherein a light emitting layer of the light emitting diode is arranged on the bottom surface of the hole-trench and the upper surface of the hole-trench, except for the sidewall of the hole-trench. 4 . The electroluminescence display device of claim 1 , wherein the hole-trench has a well shape recessed by removing the substrate with approximately 20% of thickness at least and approximately 70% of thickness at most. 5 . The electroluminescence display device of claim 1 , wherein the hole-trench is arranged between the inner dam and adjacent pixels arranged to be close to the inner dam among the pixels. 6 . The electroluminescence display device of claim 1 , wherein the hole-trench has a closed curve shape corresponding to a shape of the through-hole. 7 . The electroluminescence display device of claim 1 , wherein the hole-trench has any one of a polygonal shape, a circular shape and an oval shape, which surrounds the through-hole. 8 . The electroluminescence display device of claim 1 , wherein the hole-trench has a width narrower than a width of the inner dam. 9 . The electroluminescence display device of claim 1 , wherein the inner dam includes: a first inner dam adjacent to the through-hole; and a second inner dam surrounding the first inner dam. 10 . The electroluminescence display device of claim 9 , wherein the hole-trench is arranged between the first inner dam and the second inner dam. 11 . The electroluminescence display device of claim 1 , further comprising: a thin film transistor layer formed on the substrate; a planarization layer covering the thin film transistor layer; an anode electrode connected with a thin film transistor arranged in the thin film transistor layer and arranged on the planarization layer; and a bank defining a light emitting area in the anode electrode, wherein the hole-trench passes through the bank, the planarization layer and the thin film transistor layer, and is formed by removing the substrate as much as a certain thickness. 12 . The electroluminescence display device of claim 11 , wherein the inner dam further includes a spacer arranged on the planarization layer and the bank, the spacer surrounding the through-hole. 13 . The electroluminescence display device of claim 11 , further comprising: an outer dam arranged in the non-display area, surrounding the display area; a light emitting layer covering the pixels, the inner dam and the hole-trench on the substrate between the outer dam and the through-hole; a cathode electrode arranged on the light emitting layer; and an encapsulation layer covering the cathode electrode. 14 . The electroluminescence display device of claim 13 , wherein the light emitting layer is exposed from a sidewall of the through-hole. 15 . The electroluminescence display device of claim 14 , wherein the encapsulation layer includes: a first inorganic encapsulation layer; an organic encapsulation layer arranged on the first inorganic encapsulation layer; and a second inorganic encapsulation layer arranged on an upper surface of the organic encapsulation layer.
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Encapsulations · CPC title
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