Ceramic electronic component

Patent metadata

Field	Value
Publication number	US-11647581-B2
Application number	US-202016903694-A
Country	US
Kind code	B2
Filing date	Jun 17, 2020
Priority date	May 16, 2016
Publication date	May 9, 2023
Grant date	May 9, 2023

Abstract

A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body, a peripheral section of the surface electrode having an opening therein; and a covering ceramic layer covering the peripheral section of the surface electrode and the opening therein.

First claim

The invention claimed is:

1. A ceramic electronic component comprising:
an electronic component body including a superficial base ceramic layer;
a surface electrode on a surface of the electronic component body, the surface electrode including:
a first sintered layer on the superficial base ceramic layer,
a second sintered layer on the first sintered layer, and
a plating layer on the second sintered layer and located in a central section of the surface electrode,
the first sintered layer and the second sintered layer defining a peripheral section of the surface electrode and having an opening therein that extends through the first sintered layer and the second sintered layer; and

a covering ceramic layer covering the peripheral section of the surface electrode and the opening therein and not covering the plating layer, wherein
the opening in the peripheral section is filled with a ceramic component contained in the superficial base ceramic layer or a glass component contained in the superficial base ceramic layer.

2. The ceramic electronic component according to claim 1 , wherein the opening is a hole or a slit.

3. The ceramic electronic component according to claim 1 , wherein the first sintered layer contains a metal oxide containing at least one metal element selected from Al, Zr, Ti, Si, and Mg.

4. The ceramic electronic component according to claim 3 , wherein the second sintered layer contains the metal oxide in an amount smaller than that contained in the first sintered layer.

Assignees

• Murata Manufacturing Co

Inventors

• Takemori Yuki

Classifications

• H05K2201/0969

  Apertured conductors · CPC title

• H05K2201/0347

  Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias · CPC title

• Y10T428/24273

  including aperture · CPC title

• B32B9/005

  comprising one layer of ceramic material, e.g. porcelain, ceramic tile (layered products with at least two ceramic layers composed mainly of ceramic B32B18/00) · CPC title

• H05K1/113

  Via provided in pad; Pad over filled via · CPC title