Resin composition

Patent metadata

Field	Value
Publication number	US-11643545-B2
Application number	US-202016937158-A
Country	US
Kind code	B2
Filing date	Jul 23, 2020
Priority date	Jul 30, 2019
Publication date	May 9, 2023
Grant date	May 9, 2023

Abstract

A resin composition includes (A) a polyolefin epoxy resin, (B) an epoxy resin having a condensed polycyclic aromatic hydrocarbon, (C) a nitrogen-containing novolak resin, and (D) an inorganic filler, in which an epoxy equivalent of the (A) component is 200 g/eq. or more, a nitrogen content in the (C) component is 13% by mass or more and/or the (C) component has a cresol novolak structure, and a content of the (D) component is 60% by mass or more on the basis of 100% by mass of non-volatile components in the resin composition.

First claim

What is claimed is:

1. A resin composition, comprising:
(A) at least one polybutadiene epoxy resin;
(B) at least one epoxy resin having one or more naphthalene rings and two or more epoxy groups in one molecule;
(C) at least one triazine-containing novolak resin having a cresol novolak structure; and
(D) at least one silica, wherein
an epoxy equivalent of said (A) at least one polybutadiene epoxy resin is 200 g/eq. or more and 250 g/eq. or less,
a nitrogen content in said (C) at least one triazine-containing novolak resin having a cresol novolak structure is 16% by mass or more and 22% by mass or less,
a content of said (A) at least one polybutadiene epoxy resin is 1.5% by mass or more and 10% by mass or less based on 100% by mass of non-volatile components in said resin composition,
a content of said (B) at least one epoxy resin having one or more naphthalene rings and two or more epoxy groups in one molecule is 5% by mass or more and 20% by mass or less based on 100% by mass of non-volatile components in said resin composition,
a content of said (C) at least one triazine-containing novolak resin having a cresol novolak structure is 0.5% by mass or more and 10% by mass or less based on 100% by mass of non-volatile components in said resin composition, and
a content of said (D) at least one silica is 60% by mass or more and 90% by mass or less based on 100% by mass of non-volatile components in said resin composition.

2. The resin composition according to claim 1 , wherein a number-average molecular weight (Mn) of said (A) at least one polybutadiene epoxy resin is 4,000 or less.

3. The resin composition according to claim 1 , wherein an epoxy equivalent of said (B) at least one epoxy resin having one or more naphthalene rings and two or more epoxy groups in one molecule is 130 g/eq. to 400 g/eq.

4. The resin composition according to claim 1 , wherein a mass ratio of said (A) at least one polybutadiene epoxy resin to said (B) at least one epoxy resin having one or more naphthalene rings and two or more epoxy groups in one molecule (content of (A) content of (B)) is 0.1 or more and 0.5 or less.

5. The resin composition according to claim 1 , wherein a hydroxy equivalent of said (C) at least one triazine-containing novolak resin having a cresol novolak structure is 130 g/eq. or more.

6. The resin composition according to claim 1 , wherein said (D) at least one silica is present in an amount of 70% by mass or more and 90% by mass or less based on 100% by mass of non-volatile components in said resin composition.

7. The resin composition according to claim 1 , further comprising:
(E) at least one curing agent as a component other than said (C) at least one triazine-containing novolak resin having a cresol novolak structure.

8. The resin composition according to claim 7 , wherein said (E) at least one curing agent comprises an active ester curing agent.

9. A cured product of the resin composition according to claim 1 .

10. A sheet lamination material, comprising the resin composition according to claim 1 .

11. A resin sheet, comprising:
(1) a support; and
(2) a layer of the resin composition according to claim 1 and formed on said support.

12. A printed wiring board, comprising an insulating layer comprising a cured product of the resin composition according to claim 1 .

13. A semiconductor device, comprising the printed wiring board according to claim 12 .

Assignees

• Ajinomoto Kk

Inventors

• Kawai Kenji
• Ooishi Ryohei

Classifications

• C08K3/36

  Silica · CPC title

• C09D7/70

  characterised by shape, e.g. fibres, flakes or microspheres · CPC title

• H05K1/0326

  containing O · CPC title

• C08G59/245

  aromatic · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title