Active ester resin, epoxy resin composition, cured product thereof, prepreg, circuit board, and build-up film

Patent metadata

Field	Value
Publication number	US-10059798-B2
Application number	US-201314436202-A
Country	US
Kind code	B2
Filing date	Oct 2, 2013
Priority date	Oct 17, 2012
Publication date	Aug 28, 2018
Grant date	Aug 28, 2018

Abstract

An active ester resin
having a molecular structure represented by Structural Formula (1)

where X represents a benzene ring or a naphthalene ring, each R 1 independently represents a methyl group or a hydrogen atom, k is 0 or 1, n is 1 or 2, l is 1 or 2, and m is the average of a repeating unit and from 0.25 to 1.5. The active ester resin, as a curing agent, can be combined with an epoxy resin to form at least an epoxy resin composition, a cured product, a prepreg, a circuit board and a build-up film.

First claim

The invention claimed is:

1. An active ester resin represented by Structural Formula (1) comprising a structural moiety represented by Structural Formula (i)
(place Formula (i) and continue—GM)
where each R 1 independently represents a methyl group or a hydrogen atom; Ar 1 represents a phenylene group, a naphthylene group, or a phenylene group or naphthylene group which has one to three alkyl groups each having 1 to 4 carbon atoms on its aromatic nucleus; wherein the active ester resin has a molecular structure represented by Structural Formula (1)
(place Formula (1) and continue—GM)
where X represents a benzene ring or a naphthalene ring, k is 0 or 1, n is 1 or 2, l is 1 or 2, and m is the average of a repeating unit and from 0.25 to 1.5.

2. An epoxy resin composition comprising an epoxy resin and the active ester resin according to claim 1 as a curing agent.

3. A cured product comprising an epoxy resin and the active ester resin according to claim 1 .

4. A prepreg comprising reinforcing substrate impregnated with the epoxy resin composition according to claim 2 which has been diluted with an organic solvent.

5. A circuit board comprising a plate of epoxy resin composition according to claim 2 diluted with an organic solvent and thermally molded together with copper foil under application of pressure.

6. A build-up film comprising the epoxy resin composition according to claim 2 diluted with an organic solvent, applied to a base film and dried.

Assignees

• Dainippon Ink & Chemicals

Inventors

• Arita Kazuo
• Shimono Tomohiro

Classifications

• Y10T428/24917

  including metal layer · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G63/137

  Acids or hydroxy compounds containing cycloaliphatic rings · CPC title

• C08G59/62

  Alcohols or phenols · CPC title

• H05K1/0353

  consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement · CPC title