Contact area design for solder bonding
US-2016190082-A1 · Jun 30, 2016 · US
Ceramic electronic component
US11641712B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11641712-B2 |
| Application number | US-202016903699-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 17, 2020 |
| Priority date | May 16, 2016 |
| Publication date | May 2, 2023 |
| Grant date | May 2, 2023 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body; and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has a thin portion located on a central side of the surface electrode and which is thinner than a central section of the surface electrode, and a width of the thin portion is 20% or more of a width of the peripheral section of the surface electrode that is covered by the covering ceramic layer.
First claim
Opening claim text (preview).
The invention claimed is: 1. A ceramic electronic component comprising: an electronic component body including a superficial base ceramic layer; a surface electrode on a surface of the electronic component body, wherein the surface electrode includes a first sintered layer on the superficial base ceramic layer, and a second sintered layer on the first sintered layer; and a covering ceramic layer covering a respective peripheral section of the first sintered layer and the second sintered layer of the surface electrode, wherein each of the respective peripheral section of the first sintered layer and the second sintered layer of the surface electrode that is covered by the covering ceramic layer has a thin portion, wherein the thin portion of each of the first sintered layer and the second sintered layer is thinner than a respective central section of the first sintered layer and the second sintered layer of the surface electrode, and wherein a width of the thin portion is 20% to 90% of a width of the respective peripheral section of the first sintered layer and the second sintered layer of the surface electrode that is covered by the covering ceramic layer. 2. The ceramic electronic component according to claim 1 , wherein the width of the thin portion of each of the first sintered layer and the second sintered layer is 15 μm or more. 3. The ceramic electronic component according to claim 1 , wherein a total combined thickness of the thin portion of each of the first sintered layer and the second sintered layer is 10 μm or less. 4. The ceramic electronic component according to claim 1 , wherein the first sintered layer contains a metal oxide containing at least one metal element selected from Al, Zr, Ti, Si, and Mg. 5. The ceramic electronic component according to claim 4 , wherein the second sintered layer contains the metal oxide in an amount smaller than that contained in the first sintered layer. 6. The ceramic electronic component according to claim 4 , wherein the plating layer is not covered by the covering ceramic layer.
Assignees
Inventors
Classifications
having aperture or cut · CPC title
Varying width along a single conductor; Conductors or pads having different widths · CPC title
including aperture · CPC title
- H05K1/0306Primary
Inorganic insulating substrates, e.g. ceramic, glass · CPC title
Via provided in pad; Pad over filled via · CPC title
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Frequently asked questions
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- What does patent US11641712B2 cover?
- A ceramic electronic component that includes an electronic component body having a superficial base ceramic layer; a surface electrode on a surface of the electronic component body; and a covering ceramic layer covering a peripheral section of the surface electrode. The peripheral section of the surface electrode that is covered by the covering ceramic layer has a thin portion located on a cent…
- Who is the assignee on this patent?
- Murata Manufacturing Co
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0306. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 02 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).