Etching composition for thin film containing silver, method for forming pattern and method for manufacturing a display device using the same

Patent metadata

Field	Value
Publication number	US-11639470-B2
Application number	US-202117388712-A
Country	US
Kind code	B2
Filing date	Jul 29, 2021
Priority date	Dec 28, 2020
Publication date	May 2, 2023
Grant date	May 2, 2023

Abstract

An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.

First claim

What is claimed is:

1. An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water, the etching composition comprising:
1 wt % to 13 wt % of the inorganic acid compound,
0.1 wt % to 7 wt % of the sulfonic acid compound,
30 wt % to 55 wt % of the organic acid compound,
1 wt % to 17 wt % of the nitrate,
0.01 wt % to 0.09 wt % of the metal oxidizing agent,
0.1 wt % to 7 wt % of the amino acid compound, and
a remainder of the etching composition being water.

2. The etching composition of claim 1 , wherein the sulfonic acid compound comprises at least one selected from the group consisting of methanesulfonic acid, ethanesulfonic acid, p-toluenesulfonic acid, benzenesulfonic acid, amino methylsulfonic acid, and sulfamic acid.

3. The etching composition of claim 1 , wherein the organic acid compound comprises at least one selected from the group consisting of acetic acid, citric acid, glycolic acid malonic acid, lactic acid, tartaric acid, butanoic acid, formic acid, gluconic acid, oxalic acid, pentanoic acid, sulfobenzoic acid, sulfosuccinic acid, sulfophthalic acid, salicylic acid, sulfosalicylic acid, benzoic acid, glyceric acid, succinic acid, malic acid, isocitric acid, propenoic acid, iminodiacetic acid and ethylenediaminetetraacetic acid.

4. The etching composition of claim 1 , wherein the nitrate comprises at least one selected from the group consisting of sodium nitrate, potassium nitrate, ammonium nitrate, calcium nitrate, magnesium nitrate, and aluminum nitrate.

5. The etching composition of claim 1 , wherein the metal oxidizing agent comprises at least one selected from the group consisting of ferric nitrate, ferric sulfate, copper, and copper sulfate.

6. The etching composition as claimed in claim 1 , wherein the amino acid compound comprises at least one selected from the group consisting of glycine, alanine, valine, leucine, isoleucine, serine, threonine, aspartic acid, cysteine, and methionine.

7. The etching composition of claim 1 , wherein the inorganic acid compound comprises nitric acid.

8. An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water, wherein:
the inorganic acid compound comprises nitric acid,
the sulfonic acid compound comprises methanesulfonic acid,
the organic acid compound comprises citric acid and acetic acid,
the nitrate comprises calcium nitrate and ammonium nitrate,
the metal oxidizing agent comprises ferric nitrate, and
the amino acid compound comprises glycine.

9. The etching composition of claim 8 , wherein the etching composition does not include ammonium bisulfate.

10. The etching composition of claim 8 , wherein the etching composition does not include phosphoric acid.

Assignees

• Samsung Display Co Ltd

Inventors

• Park Jonghee
• Kim Hyoung Sik
• Kwon O Byoung
• Nam Gi-Yong
• Min Kyungchan
• Lee Suck Jun
• Kim Youngmin
• Kim Jinhyung
• Lee Donghun
• Lim Kyu-Hun
• Jang Dongmin

Classifications

• H10K59/12

  Active-matrix OLED [AMOLED] displays · CPC title

• C23F1/44

  Compositions for etching metallic material from a metallic material substrate of different composition · CPC title

• C09K13/06 Primary

  with organic material · CPC title

• H10K59/1201

  Manufacture or treatment · CPC title

• H10K59/131

  Interconnections, e.g. wiring lines or terminals · CPC title