Methods and apparatus for cleaning substrates

Patent metadata

Field	Value
Publication number	US-11638937-B2
Application number	US-202117378096-A
Country	US
Kind code	B2
Filing date	Jul 16, 2021
Priority date	Sep 19, 2016
Publication date	May 2, 2023
Grant date	May 2, 2023

Abstract

A method for effectively cleaning vias (20034), trenches (20036) or recessed areas on a substrate (20010) using an ultra/mega sonic device (1003, 3003, 16062, 17072), comprising: applying liquid (1032) into a space between a substrate (20010) and an ultra/mega sonic device (1003, 3003, 16062, 17072); setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside vias (20034), trenches (20036) or recessed areas on the substrate (20010) increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside the vias (20034), trenches (20036) or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate (20010) being cleaned.

First claim

What is claimed is:

1. An apparatus for cleaning a semiconductor wafer comprising features of patterned structures, the apparatus comprising:
a wafer holder configured to hold the semiconductor wafer;
an inlet configured to apply liquid on the semiconductor wafer;
a transducer configured to deliver acoustic energy to the liquid;
a power supply of the transducer; and
a controller for the power supply comprising a timer, the controller being configured to control the transducer based on the timer to:
deliver acoustic energy to the liquid at a first frequency value and a first power level value for a predetermined first time period, wherein sizes of bubbles inside the features increase during the first time period, and
deliver acoustic energy to the liquid at a second frequency value and a second power level value for a predetermined second time period, wherein sizes of bubbles inside the features decrease during the second time period,
wherein the controller is configured to alternately apply the first and second time periods one after another for a predetermined number of cycles, and wherein the first time period and the second time period are determined based on a ration (R) of total bubble volume (V B ) to volume (V VTR ) inside vias, trenches, or recessed areas on the semiconductor wafer.

2. The apparatus of claim 1 , wherein the wafer holder comprises a rotating chuck.

3. The apparatus of claim 1 , wherein the wafer holder comprises a cassette submerged in a cleaning tank.

4. The apparatus of claim 1 , wherein the inlet comprises a nozzle.

5. The apparatus of claim 1 , wherein the transducer is connected to the inlet and imparts acoustic energy to the liquid flowing through the inlet.

6. The apparatus of claim 1 , wherein the first time period is determined as a time period that achieves the highest number of cleaned features.

7. The apparatus of claim 1 , wherein the second time period is determined as a time period that achieves the highest number of cleaned features.

8. The apparatus of claim 1 , wherein the first time period ends prior to at least one of the features being blocked by the bubbles.

9. The apparatus of claim 1 , wherein the first time period ends after at least one of the features being blocked by the bubbles.

10. The apparatus of claim 1 , wherein the second power level value is lower than the first power level value.

11. The apparatus of claim 10 , wherein the second power level value is zero.

12. The apparatus of claim 1 , wherein the second frequency value is higher than the first frequency value.

13. The apparatus of claim 1 , wherein acoustic energy in the second time period is in antiphase to acoustic energy in the first time period.

14. The apparatus of claim 1 , wherein the first frequency value is equal to the second frequency value, while the first power level value is higher than the second power level value.

15. The apparatus of claim 1 , wherein the first frequency value is higher than the second frequency value, while the first power level value is higher than the second power level value.

16. The apparatus of claim 1 , wherein the first frequency value is lower than the second frequency value, while the first power level value is equal to the second power level value.

17. The apparatus of claim 1 , wherein the first frequency value is lower than the second frequency value, while the first power level value is higher than the second power level value.

18. The apparatus of claim 1 , wherein the first frequency value is lower than the second frequency value, while the first power level value is lower than the second power level value.

19. The apparatus of claim 1 , wherein the first power level value rises during the first time period.

20. The apparatus of claim 1 , wherein the first power level value falls during the first time period.

21. The apparatus of claim 1 , wherein the first power level value both rises and falls during the first time period.

22. The apparatus of claim 1 , wherein the first frequency value changes from a higher value to a lower value during the first time period.

23. The apparatus of claim 1 , wherein the first frequency value changes from a lower value to a higher value during the first time period.

24. The apparatus of claim 1 , wherein the first frequency value changes from a lower value to a higher value and then back to the lower value during the first time period.

25. The apparatus of claim 1 , wherein the first frequency value changes from a higher value to a lower value and then back to the higher value during the first time period.

26. The apparatus of claim 1 , wherein the first frequency value is set as f 1 first, f 3 later and fa at last during the first time period, where f 4 is smaller than f 3 , and f 3 is smaller than f 1 .

27. The apparatus of claim 1 , wherein the first frequency value is set as f 4 first, f 3 later and f 1 at last during the first time period, where f 4 is smaller than f 3 , and f 3 is smaller than f 1 .

28. The apparatus of claim 1 , wherein the first frequency value is set as f 1 first, f 4 later and f 3 at last during the first time period, where f 4 is smaller than f 3 , and f 3 is smaller than f 1 .

29. The apparatus of claim 1 , wherein the first frequency value is set as f 3 first, f 4 later and f 1 at last during the first time period, where f 4 is smaller than f 3 , and f 3 is smaller than f 1 .

30. The apparatus of claim 1 , wherein the first frequency value is set as f 3 first, f 1 later and f 4 at last during the first time period, where f 4 is smaller than f 3 , and f 3 is smaller than f 1 .

31. The apparatus of claim 1 , wherein the first frequency value is set as f 4 first, f 1 later and f 3 at last during the first time period, where f 4 is smaller than f 3 , and f 3 is smaller than f 1 .

32. The apparatus of claim 1 , wherein the second frequency value is zero and the second power level value remains a constant positive value during the second time period.

33. The apparatus of claim 1 , wherein the second frequency value is zero and the second power level value remains a constant negative value during the second time period.

34. The apparatus of claim 1 , wherein the features comprise vias or trenches having depth to width ratios of at least 3.

35. The apparatus of claim 1 , wherein a device manufacturing node of the semiconductor wafer is no more than 16 nanometers.

36. The apparatus of claim 1 , wherein the wafer holder is further configured to rotate the wafer with respect to the transducer as acoustic energy is delivered.

37. The apparatus of claim 1 , wherein the second time period ends after a ratio of total bubble volume inside the features falls much lower than a cavitation saturation point.

38. The apparatus of claim 1 , wherein the first time period ends before a ratio of total bubble volume inside the features reaches a cavitation saturation point.

39. The apparatus of claim 1 , wherein the first time period ends when a ratio of total bubble volume inside the features reaches a cavitation saturation point.

40. The apparatus of claim 1 , wherein a duration of the

Assignees

• Acm Research Shanghai Inc
• Acm Res Inc

Inventors

• Wang Hui
• Wang Xi
• Chen Fuping
• Chen Fufa
• Wang Jian
• Zhang Xiaoyan
• Jin Yinuo
• Jia Zhaowei
• Wang Jun
• Li Xuejun

Classifications

• H10P72/0416

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P70/234

  the processing being the formation of vias or contact holes · CPC title

• B08B3/12 Primary

  by sonic or ultrasonic vibrations · CPC title

• B06B2201/71

  Cleaning in a tank · CPC title

• B06B1/0269

  for generating multiple frequencies · CPC title