Apparatus and method for treating substrate

Patent metadata

Field	Value
Publication number	US-9975151-B2
Application number	US-201514749010-A
Country	US
Kind code	B2
Filing date	Jun 24, 2015
Priority date	Jul 8, 2014
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

Embodiments of the inventive concepts provide an apparatus and a method for treating a substrate. The apparatus includes a substrate support unit supporting the substrate, and a liquid supply unit supplying a treatment solution to the substrate supported by the substrate support unit. The liquid supply unit includes a nozzle discharging the treatment solution to the substrate, a liquid supply line supplying the treatment solution to the nozzle, a mixing member installed on the liquid supply line, a mixing space formed within the mixing member, and a gas supply line connected to the mixing member to supply a gas into the mixing space. The mixing member includes a body within which the mixing space is formed, and an inflow port combined with the body such that the gas supplied through the inflow port is mixed with the treatment solution in the mixing space to form nano-sized bubbles.

First claim

What is claimed is:

1. A method for treating a substrate, the method comprising:
supplying a treatment solution into a mixing member at a first flow rate;
supplying a gas into the mixing member at a second flow rate such that the gas is mixed with the treatment solution to form the treatment solution including bubbles;
measuring, by a controller, the first flow rate and the second flow rate;
controlling, by the controller, at least one of the first flow rate or the second flow rate such that the treatment solution includes a plurality of bubbles having nanometer-sized diameters in response to a result of the measuring; and
supplying the treatment solution including the bubbles to the substrate to treat the substrate based on the result of the measuring.

2. The method of claim 1 , wherein the controlling comprises:
adjusting the second flow rate to be greater than the first flow rate.

3. The method of claim 2 , wherein the supplying supplies the treatment solution including the bubbles to the substrate in response to the result of the measuring indicating that the diameters of the bubbles are equal to or smaller than a size.

4. The method of claim 3 , wherein the size is about 1 micrometer.

5. The method of claim 2 , wherein
the first flow rate corresponds to a first pressure,
the second flow rate corresponds to a second pressure, and
the adjusting comprises adjusting at least one of the first flow rate and the second flow rate such that a difference between the first pressure and the second pressure is 100 kpa or less.

6. The method of claim 1 , wherein the supplying supplies the treatment solution including the bubbles to the substrate in response to the result of the measuring indicating that diameters of the bubbles are equal to or smaller than a size.

7. The method of claim 6 , wherein the size is about 1 micrometer.

8. The method of claim 1 , further comprising:
exhausting the treatment solution including the bubbles in response to the results of the measuring indicating that the diameters of the bubbles are greater than a size so that the treatment solution including the bubbles is not provided to the substrate.

9. The method of claim 8 , wherein the size is about 1 micrometer.

10. The method of claim 1 , wherein the supplying includes,
opening a supply valve and closing an exhaust valve in response to the results of the measuring indicating that the diameters of the bubbles are equal to or smaller than a threshold size to provide the treatment solution including the bubbles to the substrate, and,
opening the exhaust valve and closing the supply valve in response to the results of the measuring indicating that the diameters of the bubbles are greater than the threshold size to not provide the treatment solution including the bubbles to the substrate.

11. The method of claim 1 , wherein the measuring, by the controller determines whether the bubbles have nano-sized diameters based on a difference between the first flow rate and the second flow rate.

12. The method of claim 1 , wherein the supplying includes controlling, by the controller, opening and closing of a supply valve and an exhaust valve based on whether a difference between the first flow rate and the second flow rate is within a value range, the supply valve being a valve configured to supply the treatment solution including the bubble to the substrate, the exhaust valve being a valve configure to collect the treatment solution including the bubble to not supply the treatment solution including the bubbles to the substrate.

Assignees

• Semes Co Ltd

Inventors

• Kim Tae Keun
• Kwon Oh Jin
• Choi Ki Hoon

Classifications

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P70/00

  Cleaning of wafers, substrates or parts of devices · CPC title

• H10P72/0404 Primary

  for general liquid treatment, e.g. etching followed by cleaning · CPC title

• B08B3/10 Primary

  with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration · CPC title