Bioresorbable silicon electronics for transient implants
US-10925543-B2 · Feb 23, 2021 · US
US11638816B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11638816-B2 |
| Application number | US-202117230645-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 14, 2021 |
| Priority date | Jun 27, 2016 |
| Publication date | May 2, 2023 |
| Grant date | May 2, 2023 |
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A nerve cuff electrode device comprising a cuff body having a smart memory polymer layer with a rigid configuration at room temperature and a softened configuration at about 37° C. The smart memory polymer layer has a trained curved region with a radius of curvature of about 3000 microns or less. A plurality of thin film electrodes located on the smart memory polymer layer. The thin film electrodes include discrete titanium nitride electrode sites that are located in the trained curved region. An exposed surface of each of the discrete titanium nitride electrode sites has a charge injection capacity of about 0.1 mC/cm2 or greater. Methods or manufacturing and using the device are also disclosed.
Opening claim text (preview).
What is claimed is: 1. A nerve cuff electrode device, comprising: a cuff body having a smart memory polymer layer with a rigid configuration at room temperature and a softened configuration at 37° C., wherein: the smart memory polymer layer has a trained curved region with a radius of curvature of 3000 microns or less; and a plurality of thin film electrodes located on the smart memory polymer layer, wherein: the thin film electrodes include discrete titanium nitride electrode sites that are located in the trained curved region wherein the discrete titanium nitride electrode sites are formed by depositing a titanium nitride layer on the thin film electrodes including magnetron sputtering for 15 to 75 minutes and patterning the titanium nitride layer to form the discrete titanium nitride electrode sites having a thickness in a range from 5 nm to 200 nm, and an exposed surface of each of the discrete titanium nitride electrode sites has a charge injection capacity of 0.1 mC/cm 2 or greater. 2. The device of claim 1 , wherein the rigid configuration at room temperature has a storage modulus value in a range from 800 to 2500 MPa and the softened configuration has a storage modulus value in a range from 1 to 75 MPa. 3. The device of claim 1 , wherein the radius of curvature of the trained curved region equals 1000 microns or less. 4. The device of claim 1 , wherein the exposed surface of each of the discrete titanium nitride electrode sites has a charge injection capacity of 2 mC/cm 2 or greater. 5. The device of claim 1 , wherein each of the discrete titanium nitride electrode sites have a geometric surface area of 22 mm 2 or less. 6. The device of claim 1 , wherein each of the discrete titanium nitride electrode sites are located in the trained curved region of the smart memory polymer layer. 7. The device of claim 1 , wherein an electrochemical surface area of each of the discrete titanium nitride electrode sites are at least 100 percent greater than a geometric surface area of each of the discrete titanium nitride electrode sites. 8. The device of claim 1 , wherein the discrete titanium nitride electrode sites have a surface roughness of 5 nanometers. 9. The device of claim 1 , wherein the thin film electrodes include a gold layer and the discrete titanium nitride electrode sites are located on portions of the gold layer. 10. The device of claim 1 , the cuff body further includes a parlyene layer covering the smart memory polymer layer and the thin film electrodes except for the exposed discrete titanium nitride electrode sites and exposed contact pads of the thin film electrodes. 11. The device of claim 1 , wherein the thin film electrodes are located within a range of 4 to 8 microns of a mechanical neutral plane of the cuff body. 12. The device of claim 1 , wherein the magnetron sputtering includes an O 2 concentration in a range from 1×10 −6 to 20 percent such that the titanium nitride layer is a titanium oxynitride layer and the discrete titanium nitride electrode sites are discrete titanium oxynitride sites. 13. The device of claim 1 , wherein the discrete titanium nitride electrode sites having a thickness in a range from 5 nm to 20 nm.
specially for flexible printed circuits, e.g. using folded portions · CPC title
Cuff electrodes · CPC title
Manufacturing circuit on or in base · CPC title
Working of insulating substrates or insulating layers · CPC title
Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof · CPC title
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