Piezoelectric resonator device and system-in-package module including the same

Patent metadata

Field	Value
Publication number	US-11637544-B2
Application number	US-201716339714-A
Country	US
Kind code	B2
Filing date	Nov 21, 2017
Priority date	Nov 24, 2016
Publication date	Apr 25, 2023
Grant date	Apr 25, 2023

Abstract

A crystal oscillator (101) includes: a piezoelectric resonator plate (2) on which a first excitation electrode and a second excitation electrode are formed; a first sealing member (3) covering the first excitation electrode of the piezoelectric resonator plate (2); a second sealing member (4) covering the second excitation electrode of the piezoelectric resonator plate (2); and an internal space (13) formed by bonding the first sealing member (3) to the piezoelectric resonator plate (2) and by bonding the second sealing member (4) to the piezoelectric resonator plate (2), so as to hermetically seal a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate (2). An electrode pattern (371) including a mounting pad for wire bonding is formed on an outer surface (first main surface (311)) of the first sealing member (3).

First claim

The invention claimed is:

1. A piezoelectric resonator device, comprising:
a piezoelectric resonator plate including a first excitation electrode formed on a first main surface of a substrate, and a second excitation electrode formed on a second main surface of the substrate, the second excitation electrode making a pair with the first excitation electrode;
a first sealing member covering the first excitation electrode of the piezoelectric resonator plate;
a second sealing member covering the second excitation electrode of the piezoelectric resonator plate; and
an internal space formed by bonding the first sealing member to the piezoelectric resonator plate and by bonding the second sealing member to the piezoelectric resonator plate, the internal space hermetically sealing a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate, wherein
a mounting pad for wire bonding is formed on an outer surface of the first sealing member, and
a shield electrode is formed on an outer surface of the second sealing member.

2. The piezoelectric resonator device according to claim 1 , wherein
the mounting pad for wire bonding is disposed so as not to be superimposed on the first excitation electrode and the second excitation electrode.

3. The piezoelectric resonator device according to claim 1 , wherein
an IC chip is mounted on the outer surface of the first sealing member.

4. The piezoelectric resonator device according to claim 3 , wherein
a groove is formed so as to surround the mounting pad for wire bonding.

5. A SiP module comprising the piezoelectric resonator device according to claim 1 .

6. A piezoelectric resonator device, comprising:
a piezoelectric resonator plate including a first excitation electrode formed on a first main surface of a substrate, and a second excitation electrode formed on a second main surface of the substrate, the second excitation electrode making a pair with the first excitation electrode;
a first sealing member covering the first excitation electrode of the piezoelectric resonator plate;
a second sealing member covering the second excitation electrode of the piezoelectric resonator plate; and
an internal space formed by bonding the first sealing member to the piezoelectric resonator plate and by bonding the second sealing member to the piezoelectric resonator plate, the internal space hermetically sealing a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate, wherein
a mounting pad for wire bonding is formed on an outer surface of the first sealing member,
an IC chip is mounted on the outer surface of the first sealing member, and
a terminal on which the IC chip is mounted is formed on the outer surface of the first sealing member so as not to be superimposed on the first excitation electrode and the second excitation electrode.

7. A piezoelectric resonator device, comprising:
a piezoelectric resonator plate including a first excitation electrode formed on a first main surface of a substrate, and a second excitation electrode formed on a second main surface of the substrate, the second excitation electrode making a pair with the first excitation electrode;
a first sealing member covering the first excitation electrode of the piezoelectric resonator plate;
a second sealing member covering the second excitation electrode of the piezoelectric resonator plate; and
an internal space formed by bonding the first sealing member to the piezoelectric resonator plate and by bonding the second sealing member to the piezoelectric resonator plate, the internal space hermetically sealing a vibrating part including the first excitation electrode and the second excitation electrode of the piezoelectric resonator plate, wherein
a mounting pad for wire bonding is formed on an outer surface of the first sealing member, and
the mounting pad for wire bonding is disposed so as to face a frame body surrounding the internal space.

Assignees

• Daishinku Corp

Inventors

• Kojo Takuya

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W76/12

  characterised by their shape · CPC title

• H10W72/387

  Flow barriers · CPC title

• H03H9/0595 Primary

  the holder support and resonator being formed in one body · CPC title

• H03H9/178

  of a laminated structure of multiple piezoelectric layers with inner electrodes · CPC title