Negative type photosensitive composition curable at low temperature

Patent metadata

Field	Value
Publication number	US-11630390-B2
Application number	US-201715999429-A
Country	US
Kind code	B2
Filing date	Jan 20, 2017
Priority date	Feb 19, 2016
Publication date	Apr 18, 2023
Grant date	Apr 18, 2023

Abstract

To provide a negative type photosensitive composition curable at a low temperature and capable of forming a cured film excellent in transparency, in chemical resistance and in environmental durability, and also to provide a pattern-formation method employing the composition. [Means] The present invention provides a negative type photosensitive composition comprising: an alkali-soluble resin, a compound having two or more (meth)acryloyloxy groups, a polysiloxane, a polymerization initiator, and a solvent. The alkali-soluble resin is a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit.

First claim

The invention claimed is:

1. A negative type photosensitive composition comprising:
an alkali-soluble resin which is a polymer comprising a carboxyl-containing polymerization unit, a hydroxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit,
a compound having two or more (meth)acryloyloxy groups,
a polysiloxane,
a polymerization initiator, and
a solvent and
wherein said hydroxyl-containing polymerization unit is selected from the group consisting of polyethylene glycol derivative; a polypropylene glycol derivative; an oxyalkylene-modified monomer and glycerol (meth)acrylate.

2. The composition according to claim 1 , wherein said carboxyl-containing polymerization unit is derived from an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, or a mixture thereof.

3. The composition according to claim 1 , wherein said alkoxysilyl-containing polymerization unit is derived from a monomer represented by the following formula (I):
X—(CH 2 ) a —Si(OR) b (CH 3 ) 3-b

in which
X is vinyl, styryl, or (meth)acryloyloxy group,
R is methyl or ethyl group,
a is an integer of 0 to 3, and
b is an integer of 1 to 3.

4. The composition according to claim 1 , wherein said alkali-soluble resin has a weight average molecular weight of 3000 to 50000.

5. The composition according to claim 1 , wherein said polysiloxane has a weight average molecular weight of 1200 to 5000.

6. The composition according to claim 1 , wherein said compound having two or more (meth)acryloyloxy groups is contained in an amount of 3 to 50 weight parts based on 100 weight parts in total of said alkali-soluble resin and said polysiloxane.

7. The composition according to claim 1 , wherein said polymerization initiator is a photo-radical generator.

8. A cured film-producing method, comprising the steps of:
coating a substrate with the composition according to claim 1 , to form a coating film, exposing the coating film to light, and then
developing the exposed coating film.

9. The cured film-producing method according to claim 8 , which further comprises the step of heating to cure the coating film at a temperature of 70 to 360° C. after developing.

10. A cured film formed from the composition according to claim 1 .

11. A device comprising the cured film according to claim 10 .

12. The composition according to claim 1 , wherein said alkali-soluble resin, the content of said hydroxyl-containing polymerization unit in the polymer is 3 wt % or more and 40 wt % or less.

13. The composition according to claim 1 , wherein said hydroxyl-containing polymerization unit is selected from the group consisting of diethylene glycol (meth)acrylate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, poly(ethylene glycol-polypropylene glycol) mono(meth)acrylate, poly(ethylene glycol-tetramethylene glycol) mono(meth)acrylate, or poly(polypropylene glycol-tetramethylene glycol) mono(meth)acrylate and glycerol (meth)acrylate.

14. The composition according to claim 12 , wherein said hydroxyl-containing polymerization unit is selected from the group consisting of diethylene glycol (meth)acrylate, polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, poly(ethylene glycol-polypropylene glycol) mono(meth)acrylate, poly(ethylene glycol-tetramethylene glycol) mono(meth)acrylate, or poly(polypropylene glycol-tetramethylene glycol) mono(meth)acrylate and glycerol (meth)acrylate.

15. The composition according to claim 1 , wherein the polysiloxane has a dissolution rate in a 2.38% tetramethylammonium hydroxide (TMAH) aqueous solution is 50 to 5000 Å/second for a thickness of 0.1 to 10 μm.

Assignees

• Az Electronic Mat Luxembourg Sarl
• Merck Patent Gmbh

Inventors

• Misumi Motoki
• Yokoyama Daishi
• Taniguchi Katsuto
• Kuzawa Masahiro

Classifications

• G03F7/0757 Primary

  Macromolecular compounds containing Si-O, Si-C or Si-N bonds (G03F7/0752 takes precedence) · CPC title

• G03F7/0045

  with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title

• G03F7/0382

  the macromolecular compound being present in a chemically amplified negative photoresist composition · CPC title

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

• G03F7/40

  Treatment after imagewise removal, e.g. baking · CPC title