Mist generator, mist film formation method and mist film formation apparatus

Patent metadata

Field	Value
Publication number	US-11628468-B2
Application number	US-202117162609-A
Country	US
Kind code	B2
Filing date	Jan 29, 2021
Priority date	Aug 1, 2018
Publication date	Apr 18, 2023
Grant date	Apr 18, 2023

Abstract

A mist generating apparatus sprays a surface of an object (P) to be treated with a carrier gas (CGS) of mist (Mst) of a solution containing fine particles or molecules of a material substance, so that a layer of the material substance is deposited on the surface of the object (P) to be treated. The mist generating device includes a mist generator (14) for atomizing the solution to feed the carrier gas (CGS) containing the mist (Mst), and an ultraviolet irradiator (20B) for applying ultraviolet rays having a wavelength of 400 nm or lower to the mist (Mst) floating in the carrier gas (CGS) in a flow path extending from the mist generator (14) until the carrier gas (CGS) is sprayed on the surface of the object (P) to be treated.

First claim

The invention claimed is:

1. A mist deposition apparatus comprising:
a mist generating section configured to generate mist that contains fine particles or molecules of a material substance;
a mist spouting section through which the mist generated at the mist generating section flows, the mist spouting section being provided with a nozzle section through which the mist is supplied to an upper side of a substrate;
a mist recovering section to recover at least a portion of the mist; and
a first light irradiation section configured to irradiate the mist with first light
wherein the mist spouting section is provided with an opening through which droplets of the mist that has been liquefied on an inner wall of the mist spouting section is discharged from the mist spouting section into the mist recovering section, and
wherein the mist irradiated with the first light is supplied to the upper side of the substrate through the nozzle section.

2. The mist deposition apparatus according to claim 1 , further comprising:
an opposing member disposed above the substrate and having an opposing surface that opposes the surface of the substrate,
wherein the nozzle section is configured to guide the mist irradiated with the first light, to a space between the surface of the substrate and the opposing surface.

3. The mist deposition apparatus according to claim 2 , wherein the nozzle section of the mist spouting section is provided in the opposing member.

4. The mist deposition apparatus according to claim 1 , wherein the first light irradiation section irradiates the mist inside the mist spouting section, with the first light.

5. The mist deposition apparatus according to claim 4 , wherein:
at least a portion of the mist spouting section is a light-transmitting member; and
the first light irradiation section irradiates the light-transmitting member with the first light.

6. The mist deposition apparatus according to claim 1 , wherein the mist spouting section allows a carrier gas containing the mist to pass therethrough alternately from a first direction to a second direction and from the second direction to the first direction.

7. The mist deposition apparatus according to claim 6 , wherein the mist spouting section has a winding structure.

8. The mist deposition apparatus according to claim 1 , wherein the mist spouting section is provided with a thermal insulation section configured to prevent a temperature change of the mist spouting section.

9. The mist deposition apparatus according to claim 1 , wherein the mist spouting section is provided with a temperature adjusting section configured to adjust a temperature of the mist spouting section.

10. The mist deposition apparatus according to claim 1 , wherein the mist spouting section has a wall surface made of quartz and shaped as a circular pipe or a flat surface.

11. The mist deposition apparatus according to claim 1 , wherein a contact angle of the droplets of the mist relative to at least a portion of the inner wall of the mist spouting section is 90 degrees or more.

12. The mist deposition apparatus according to claim 1 , wherein the first light is light having a wavelength of 400 nm or less.

13. The mist deposition apparatus according to claim 12 , wherein the first light is light having a wavelength of 200 nm or less.

14. The mist deposition apparatus according to claim 1 , further comprising a feeding section configured to feed the substrate.

15. The mist deposition apparatus according to claim 14 , further comprising:
a second light irradiation section configured to irradiate the surface of the substrate that is fed by the feeding section and is supplied with the mist, with second light.

16. The mist deposition apparatus according to claim 15 , wherein the second light is light having a wavelength of 400 nm or less.

17. The mist deposition apparatus according to claim 16 , wherein the second light is light having a wavelength of 200 nm or less.

18. The mist deposition apparatus according to claim 15 , wherein:
the second light irradiation section includes a second light source configured to generate the second light irradiating the mist; and
the second light source is a low-pressure mercury discharge lamp that has a plurality of bright line spectra between wavelengths of 180 nm and 400 nm, an excimer discharge lamp that has a bright line spectrum at a wavelength of 172 nm, or a vacuum ultraviolet flash lamp that has xenon gas sealed therein and has a spectral distribution at a wavelength of 200 nm or less.

19. The mist deposition apparatus according to claim 15 , wherein:
the second light irradiation section includes a second light source configured to generate the second light irradiating the mist; and
the second light source is a laser light source configured to emit laser light having a wavelength of 200 nm or less.

20. The mist deposition apparatus according to claim 1 , wherein:
the first light irradiation section includes a first light source configured to generate the first light irradiating the mist; and
the first light source is a low-pressure mercury discharge lamp that has a plurality of bright line spectra between wavelengths of 180 nm and 400 nm, an excimer discharge lamp that has a bright line spectrum at a wavelength of 172 nm, or a vacuum ultraviolet flash lamp that has xenon gas sealed therein and has a spectral distribution at a wavelength of 200 nm or less.

21. The mist deposition apparatus according to claim 1 , wherein:
the first light irradiation section includes a first light source configured to generate the first light irradiating the mist; and
the first light source is a laser light source configured to emit laser light having a wavelength of 200 nm or less.

22. The mist deposition apparatus according to claim 1 , wherein the mist generating section includes:
a first container that houses a liquid containing the fine particles;
a first vibration source configured to apply, to the first container, vibration having a first frequency and generating the mist from the liquid inside the first container; and
a second vibration source configured to apply, to the liquid, vibration having a second frequency lower than the first frequency.

23. The mist deposition apparatus according to claim 1 , wherein the mist spouting section includes an inner wall surface forming an internal space where a carrier gas containing the mist is stored.

24. The mist deposition apparatus according to claim 23 , wherein the mist spouting section is provided with a droplet recovering section configured to recover droplets of the mist that has been liquefied inside the internal space.

Assignees

• Nikon Corp

Inventors

• Nishi Yasutaka

Classifications

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P14/60

  of insulating materials · CPC title

• B05C9/10

  the auxiliary operation being performed before the application (B05C9/14 takes precedence) · CPC title

• C23C16/455

  characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber · CPC title