Real time material and velocity control in a molding system

US11623378B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11623378-B2
Application numberUS-202117314544-A
CountryUS
Kind codeB2
Filing dateMay 7, 2021
Priority dateJun 29, 2017
Publication dateApr 11, 2023
Grant dateApr 11, 2023

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A system includes a cavity, an injection nozzle configured to inject material into the cavity, and a plurality of sensors at sensor locations. Each of the plurality of sensors is configured to measure parameters at one of the sensor locations. The system lacks a strain gauge. The system further includes a controller configured to control a flow rate of the injection of material into the cavity. The controller is configured to receive the measured parameters and compare the received information to predetermined curves. The controller is configured to control the flow rate when the measured parameters deviate from the predetermined curves.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of compensating for a leak in an injection molding device having a cavity and a driving mechanism configured to inject injection material into the cavity, the driving mechanism comprising at least one of a press or a reciprocating screw, the method comprising: providing a plurality of sensors at sensor locations, wherein each of the plurality of sensors is configured to sense and calculate a pressure, volume, and temperature of the injection material at the sensor locations; calculating a weight and a mass of the injection material inside of the cavity during an injection process as a function of information received from the plurality of sensors; adjusting a speed of the driving mechanism according to the calculated weight and mass of the injection material; determining when the cavity has been filled by the injection material based on the calculated weight and mass of the injection material; and stopping the driving mechanism upon determining that the cavity has been filled. 2. The method of claim 1 , wherein the plurality of sensors lack a strain gauge. 3. The method of claim 1 , wherein the injection molding device includes a check ring and the leak occurs about the check ring. 4. The method of claim 1 , further comprising calculating the weight and the mass of the injection material inside of the cavity during an injection process as a function of a Filling Index. 5. The method of claim 1 , wherein the controller is configured to generate a leak alert when at least one of the calculated weight and mass differs from an expected weight and mass by more than a predetermined threshold.

Assignees

Inventors

Classifications

  • the setting or resetting of moulding conditions, e.g. before starting a cycle · CPC title

  • using rheological models of the material in the mould, e.g. finite elements method · CPC title

  • Detecting defective moulding conditions (B29C45/84 takes precedence) · CPC title

  • Velocity · CPC title

  • Temperature · CPC title

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Frequently asked questions

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What does patent US11623378B2 cover?
A system includes a cavity, an injection nozzle configured to inject material into the cavity, and a plurality of sensors at sensor locations. Each of the plurality of sensors is configured to measure parameters at one of the sensor locations. The system lacks a strain gauge. The system further includes a controller configured to control a flow rate of the injection of material into the cavity.…
Who is the assignee on this patent?
Imflux Inc
What technology area does this patent fall under?
Primary CPC classification B29C45/77. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 11 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).