Conductive member module, and method of manufacturing the same

US11623376B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11623376-B2
Application numberUS-202016866431-A
CountryUS
Kind codeB2
Filing dateMay 4, 2020
Priority dateNov 6, 2017
Publication dateApr 11, 2023
Grant dateApr 11, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Performed are an accommodation step of accommodating a pair of conductive members in a die, a sealing step of injecting a resin to seal the conductive members, and an extraction step of extracting a conductive member module. In the sealing step, the conductive members are sealed while a force is applied by the resin injected into the die to the individual conductive members in directions away from each other, and the individual conductive members are supported by support members disposed outside.

First claim

Opening claim text (preview).

What is claimed is: 1. A manufacturing method of a conductive member module having a pair of conductive members formed in long plate shape and facing each other, and a sealing part for sealing the pair of conductive members, the conductive members include connection terminals at both ends in a longitudinal direction, and the connection terminals at both ends of the conductive members are formed at positions opposite to each other across a center in a lateral direction perpendicular to both the longitudinal direction and a thickness direction, the method comprising: an accommodation step of accommodating the pair of conductive members in a molding die in a state of being separated from each other while sandwiching the connection terminals of the conductive members between the molding die in the thickness direction; a sealing step of injecting a fluid resin into the molding die to seal the pair of conductive members; and an extraction step of extracting the conductive member module from the molding die; wherein in the sealing step, the conductive members are sealed while the individual conductive members, to which a force is applied by the fluid resin injected into the molding die in directions away from each other, are supported by support members externally, the plurality of support members are arranged to support a plurality of locations in the longitudinal direction of the conductive members and a plurality of locations in the lateral direction of the conductive members, respectively, at positions other than the connecting terminals, and in the sealing step, a central space formed between the pair of conductive members is completely filled with the fluid resin earlier then outer spaces formed between the individual conductive members and the molding die in a facing direction. 2. The manufacturing method of a conductive member module according to claim 1 , wherein the central space has a larger width in the facing direction than that of each of the outer spaces. 3. The manufacturing method of a conductive member module according to claim 1 , wherein the support members are formed separately from the molding die. 4. The manufacturing method of a conductive member module according to claim 1 , wherein the individual conductive members are provided with through holes penetrating in the facing direction, and in the sealing step, the fluid resin flows into the through holes. 5. The manufacturing method of a conductive member module according to claim 4 , wherein in the sealing step, the pair of conductive members are sealed while through hole insertion pins are inserted into the through holes. 6. The manufacturing method of a conductive member module according to claim 5 , wherein in the sealing step, the pair of conductive members are sealed while tips of the through hole insertion pins are separated from inner surfaces of the conductive members in the facing direction. 7. A conductive member module comprising: a pair of conductive members formed in a plate shape and facing each other, a sealing part made of a resin and sealing the pair of conductive members, through holes formed in the individual conductive members and penetrating in a facing direction of the pair of conductive members, first recesses formed in a recessed shape in the sealing part and having bottoms in which outer surfaces of the conductive members in the facing direction are exposed, and second recesses formed so as to be recessed in the facing direction through the through holes from the outside to the inside of the pair of conductive members; wherein the resin constituting the sealing part is partially present between inner surfaces of the conductive members and bottom surfaces of the second recesses in the facing direction. 8. A manufacturing method of a conductive member module having a pair of conductive members formed in a long plate shape and facing each other, and a sealing part for sealing the pair of conductive members, the conductive members include connection terminals at both ends in a longitudinal direction, and the connection terminals at both ends of the conductive members are formed at positions opposite to each other across a center in a lateral direction perpendicular to both the longitudinal direction and a thickness direction, the method comprising: an accommodation step of accommodating the pair of conductive members in a molding die in a state of being separated from each other while sandwiching the connection terminals of the conductive members between the molding die in the thickness direction; a sealing step of injecting a fluid resin into the molding die to seal the pair of conductive members; and an extraction step of extracting the conductive member module from the molding die; wherein in the sealing step, the conductive members are sealed while the individual conductive members, to which a force is applied by the fluid resin injected into the molding die in directions away from each other, are supported by support members externally, the plurality of support members are arranged to support a plurality of locations in the longitudinal direction of the conductive members and a plurality of locations in the lateral direction of the conductive members, respectively, at positions other than the connecting terminals, the individual conductive members are provided with through holes penetrating in a facing direction, and in the sealing step, the fluid resin flows into the through holes, in the sealing step, the pair of conductive members are sealed while through hole insertion pins are inserted into the through holes, and in the sealing step, the pair of conductive members are sealed while tips of the through hole insertion pins are separated from inner surfaces of the conductive members in the facing direction. 9. The manufacturing method of a conductive member module according to claim 8 , wherein the support members are formed separately from the molding die.

Assignees

Inventors

Classifications

  • Package configurations · CPC title

  • H02M7/003Primary

    Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

  • Conductive material dispersed in non-conductive organic material {(organic macromolecular compounds or compositions C08)} · CPC title

  • for obtaining an insulating effect, e.g. for electrical components · CPC title

  • Positioning or centering articles in the mould · CPC title

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What does patent US11623376B2 cover?
Performed are an accommodation step of accommodating a pair of conductive members in a die, a sealing step of injecting a resin to seal the conductive members, and an extraction step of extracting a conductive member module. In the sealing step, the conductive members are sealed while a force is applied by the resin injected into the die to the individual conductive members in directions away f…
Who is the assignee on this patent?
Denso Corp
What technology area does this patent fall under?
Primary CPC classification H02M7/003. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 11 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).