Microelectromechanical microphone

Patent metadata

Field	Value
Publication number	US-11622183-B2
Application number	US-202117204613-A
Country	US
Kind code	B2
Filing date	Mar 17, 2021
Priority date	Jun 30, 2015
Publication date	Apr 4, 2023
Grant date	Apr 4, 2023

Abstract

A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.

First claim

The invention claimed is:

1. A microelectromechanical microphone comprising:
a supporting substrate having a first face, a second face, and a through opening extending from the first face to the second face;
a sensor chip bonded to the first face of the supporting substrate and integrating a microelectromechanical electroacoustic transducer; and
a control chip in the through opening and extending at least from the first face of the supporting substrate to at least the second face of the supporting substrate, the control chip being operatively coupled to the sensor chip, the sensor chip being at least partially arranged on a surface of the control chip,
wherein the control chip has a first thickness and the supporting substrate has a second thickness, the second thickness being less than first thickness.

2. The microelectromechanical microphone according to claim 1 , wherein the supporting substrate has a through hole between the first face and the second face, and the sensor chip including a membrane facing the through hole.

3. The microelectromechanical microphone according to claim 1 , comprising a fixing structure laterally surrounding the control chip, wherein the control chip is coupled to the supporting substrate by the fixing structure.

4. The microelectromechanical microphone according to claim 1 , wherein the sensor chip is at least partially bonded to the surface of the control chip.

5. The microelectromechanical microphone according to claim 1 , wherein the control chip extends beyond the first face of the supporting substrate.

6. The microelectromechanical microphone according to claim 5 , wherein the control chip includes a recess that receives a portion of the sensor chip.

7. The microelectromechanical microphone according to claim 6 , wherein the control chip extends beyond the second face of the supporting substrate.

8. A microelectromechanical microphone comprising:
a supporting substrate having a first face, a second face, and a through opening extending from the first face to the second face;
a control chip in the through opening, a first surface of the control chip extending beyond the first face of the supporting substrate; and
a sensor chip coupled to the first face of the supporting substrate, the sensor chip integrating a microelectromechanical electroacoustic transducer, the sensor chip being operatively coupled to the control chip and at least partially arranged on a surface of the control chip.

9. The microelectromechanical microphone according to claim 8 , wherein a second surface of the control chip extends beyond the second face of the supporting substrate.

10. The microelectromechanical microphone according to claim 8 , comprising a base coupled between the sensor chip and the supporting substrate.

11. The microelectromechanical microphone according to claim 10 , wherein a surface of the base is coplanar with the first surface of the supporting substrate.

12. The microelectromechanical microphone according to claim 8 , wherein the control chip includes a recess that receives a portion of the sensor chip.

13. A microelectromechanical microphone comprising:
a supporting substrate having a first face, a second face, and a through opening;
a control chip in the through opening and having a first surface that extends beyond the first face of the supporting substrate and a second surface that extends beyond a portion of the second face of the supporting substrate; and
a sensor chip coupled to the first face of the supporting substrate, the sensor chip integrating a microelectromechanical electroacoustic transducer, the sensor chip being operatively coupled to the control chip and a portion of the sensor chip being directly coupled to a surface of the control chip.

14. The microelectromechanical microphone according to claim 13 , wherein the through opening in the supporting substrate being a first through opening, the supporting substrate including a second through opening, wherein the sensor chip is coupled to the first face of the supporting substrate at the second through opening.

15. The microelectromechanical microphone according to claim 13 , comprising a base coupled between the sensor chip and the supporting substrate.

16. The microelectromechanical microphone according to claim 15 , wherein a surface of the base is coplanar with a surface of the supporting substrate.

17. The microelectromechanical microphone according to claim 13 , comprising a cap coupled to the supporting substrate, wherein the cap include a through opening.

18. The microelectromechanical microphone according to claim 13 , wherein the control chip includes a plurality of conductive through vias.

19. The microelectromechanical microphone according to claim 13 , wherein the control chip is fixed to walls of the supporting substrate in the through opening by polymeric material.

Assignees

• St Microelectronics Srl
• Stmicroelectronics Malta Ltd

Inventors

• Brioschi Roberto
• Barbara Paul Anthony

Classifications

• H04R1/06

  Arranging circuit leads; Relieving strain on circuit leads · CPC title

• H04R1/04 Primary

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title

• B81B7/0061

  suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound · CPC title

• H04R19/04 Primary

  Microphones (H04R19/01 takes precedence) · CPC title

• H04R19/005 Primary

  using semiconductor materials · CPC title