Microelectromechanical microphone

Patent metadata

Field	Value
Publication number	US-10225635-B2
Application number	US-201615143207-A
Country	US
Kind code	B2
Filing date	Apr 29, 2016
Priority date	Jun 30, 2015
Publication date	Mar 5, 2019
Grant date	Mar 5, 2019

Abstract

A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.

First claim

The invention claimed is:

1. A microelectromechanical microphone comprising:
a substrate;
a base coupled to the substrate;
a sensor chip bonded to the substrate and integrating a microelectromechanical acoustic transducer; and
a control chip bonded to the substrate and operatively coupled to the sensor chip, the sensor chip having a first portion that is overlying and bonded to the control chip, the sensor chip having a second portion that is overlying and bonded to the base, wherein the base has a first thickness and the control chip has a second thickness that is substantially the same thickness as the first thickness.

2. The microelectromechanical microphone according to claim 1 , wherein the control chip has a first face, wherein the first portion of the sensor chip is bonded to the first face of the control chip, wherein the acoustic transducer includes a transduction member acoustically communicating with a sound port in the substrate.

3. The microelectromechanical microphone according to claim 1 , comprising an adhesive layer that is partially on the base and partially on a first face of the control chip along a perimeter of the sensor chip, the sensor chip being bonded to the base and to the control chip through the adhesive layer.

4. The microelectromechanical microphone according to claim 1 , wherein the base extends around a sound port.

5. The microelectromechanical microphone according to claim 1 , wherein the substrate includes a core of a rigid dielectric material, and a metal layer on a face of the core, the sensor chip and the control chip being bonded to the metal layer.

6. The microphone according to claim 5 , wherein the control chip is fixed to the core of the substrate and has a face substantially flush with an assembly surface of the base.

7. The microelectromechanical microphone according to claim 5 , wherein:
the metal layer of the substrate defines a supporting portion;
a solder mask is fixed to the supporting portion; and
the solder mask and the supporting portion of the metal layer form the base.

8. The microelectromechanical microphone according to claim 7 , comprising a housing that houses the control chip, the housing being defined on one side by the core of the substrate.

9. The microelectromechanical microphone according to claim 8 , wherein the housing is adjacent to the base.

10. The microelectromechanical microphone according to claim 5 , wherein the base is arranged adjacent to a sound port and has a first thickness, the control chip having a second thickness that is substantially equal to the first thickness.

11. The microelectromechanical microphone according to claim 2 , wherein the transduction member is centered around the sound port.

12. The microelectromechanical microphone according to claim 2 , wherein the transduction member includes a membrane of semiconductor material over a cavity in a body of the sensor chip, the cavity being delimited on one side by the transduction member and being open on an opposite side.

13. A microelectromechanical microphone comprising:
a supporting substrate having a first face, a second face, and a through opening extending from the first face to the second face;
a sensor chip bonded to the first face of the supporting substrate and integrating a microelectromechanical electroacoustic transducer; and
a control chip in the through opening of the supporting substrate and operatively coupled to the sensor chip, the sensor chip being at least partially arranged on top of and bonded to the control chip, wherein the control chip has a face that is coplanar with the second face of the supporting substrate.

14. The microelectromechanical microphone according to claim 13 , comprising a fixing structure in the through opening and laterally surrounding the control chip, wherein the control chip is coupled to the supporting substrate by the fixing structure.

15. A microelectromechanical microphone comprising:
a substrate having an inner surface and an outer surface;
a sensor chip having a first face and second face, the first face of the sensor chip coupled to the inner surface of the substrate, the second face of the sensor chip integrating a MEMS electroacoustic transducer;
a control chip coupled to the substrate and operatively coupled to the sensor chip;
a bonding ring surrounding the sensor chip and the control chip;
a cap coupled to the substrate by the bonding ring and forming an acoustic chamber with the substrate, the control chip and the sensor chip located in the acoustic chamber; and
a barrier between the bonding ring and the sensor chip, the barrier being spaced from the bonding ring by a first distance and defining a first trench between the bonding ring and the barrier, the barrier being spaced from the sensor chip by a second distance and defining a second trench between the sensor chip and the barrier.

16. The microelectromechanical microphone according to claim 15 , wherein the sensor chip is shaped to have one or more rounded corners or chamfered corners.

17. The microelectromechanical microphone according to claim 15 , wherein the barrier has a height that is between 15 μm and 25 μm.

18. A microelectromechanical microphone comprising:
a supporting substrate having a first face, a second face, and a through opening extending from the first face to the second face;
a sensor chip bonded to the first face of the supporting substrate and integrating a microelectromechanical electroacoustic transducer; and
a control chip in the through opening of the supporting substrate and operatively coupled to the sensor chip, the sensor chip being at least partially arranged on top of and bonded to the control chip, wherein the control chip has a recess, wherein an edge of the sensor chip is located in the recess of the control chip.

19. The microelectromechanical microphone according to claim 18 , wherein the control chip has a first thickness and the supporting substrate has a second thickness, the second thickness being substantially equal to or greater than the first thickness.

20. A microelectromechanical microphone comprising:
a supporting substrate having a first face, a second face, and a through opening extending from the first face to the second face;
a sensor chip bonded to the first face of the supporting substrate and integrating a microelectromechanical electroacoustic transducer; and
a control chip in the through opening of the supporting substrate and operatively coupled to the sensor chip, the sensor chip being at least partially arranged on top of and bonded to the control chip, wherein the control chip has a first thickness and the supporting substrate has a second thickness, wherein the first thickness is equal to or greater than the second thickness.

21. The microelectromechanical microphone according to claim 20 , wherein the control chip is coupled to the supporting substrate by a molding material.

22. The microelectromechanical microphone according to claim 20 , wherein the sensor chip is arranged on top of and bonded to one side of the control chip.

23. The microelectromechanical microphone according to claim 20 , wherein opposing surfaces of the control chip extend beyond the first and second faces of the supporting substrate.

Assignees

• St Microelectronics Srl
• Stmicroelectronics Malta Ltd

Inventors

• Brioschi Roberto
• Gritti Alex
• Formosa Kevin
• Barbara Paul Anthony

Classifications

• H04R19/005 Primary

  using semiconductor materials · CPC title

• B81B7/0061

  suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound · CPC title

• H04R2499/11

  Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's · CPC title

• H04R31/00

  Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} · CPC title

• H04R1/04 Primary

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title