Electrical apparatus having tin whisker sensing and prevention

Patent metadata

Field	Value
Publication number	US-11619665-B2
Application number	US-202016736192-A
Country	US
Kind code	B2
Filing date	Jan 7, 2020
Priority date	Jan 7, 2020
Publication date	Apr 4, 2023
Grant date	Apr 4, 2023

Abstract

An electrical apparatus that includes: an electronic substrate having a plurality of pads for connecting to an electronic component placed on the electronic substrate; a shield placed on a surface of the electronic substrate, the shield having a plurality of openings with the plurality of openings aligned over the plurality of pads and at least a portion of each of the plurality of openings being conductive; connection means to connect the conductive portions of each of the plurality of openings to a fault detect and error handling circuit; and the fault detect and error handling circuit to detect a short circuit between at least one of the conductive portions and the pad aligned with the opening containing the at least one of the conductive portions.

First claim

What is claimed is:

1. An electrical apparatus comprising:
an electronic substrate having a plurality of pads for connecting to an electronic component placed on the electronic substrate;
a shield placed on a surface of the electronic substrate, the shield having a plurality of openings with the plurality of openings aligned over the plurality of pads and at least a portion of each of the plurality of openings being conductive, the shield forming a barrier between adjacent pads of the plurality of pads;
connection means to connect the conductive portions of each of the plurality of openings to a fault detect and error handling circuit; and
the fault detect and error handling circuit to detect a short circuit between at least one of the conductive portions and the pad aligned with the opening containing the at least one of the conductive portions.

2. The electrical apparatus of claim 1 wherein the shield comprising a body having the plurality of openings, the body being nonconductive and further comprising a metal coating over the body of the shield.

3. The electrical apparatus of claim 2 wherein the connection means comprising conductive wiring between the conductive portions and the metal coating and conductive wiring between the metal coating and the fault detect and error handling circuit.

4. The electrical apparatus of claim 1 wherein the shield comprising a body having the plurality of openings, the body comprising a conductive material.

5. The electrical apparatus of claim 4 wherein the connection means comprising the body and conductive wiring between the body and the fault detect and error handling circuit.

6. The electrical apparatus of claim 1 further comprising an electronic component interposed between the electronic substrate and the shield, the electronic component having conductive leads joining the electronic component to the pads on the electronic substrate and arranged such that there is one conductive lead joined to one pad in each of the openings of the shield.

7. The electrical apparatus of claim 6 wherein the short circuit detected by the fault detection and error handling circuit is a tin whisker from the lead within the opening in contact with the conductive portion in the opening.

8. The electrical apparatus of claim 7 wherein the shield having a wall between each of the openings that acts as a mechanical barrier to the tin whisker making physical contact with an adjacent conductive lead or pad.

9. The electrical apparatus of claim 6 wherein the shield fully covers the electronic component and the conductive leads.

10. An electrical apparatus comprising:
an electronic substrate having a plurality of pads for connecting to an electronic component placed on the electronic substrate;
the electronic component placed on the electronic substrate, the electronic component having a plurality of conductive leads joined to the plurality of pads on the electronic substrate;
a shield placed on a surface of the electronic substrate and covering the electronic component, the shield having a plurality of openings with the plurality of openings aligned over the plurality of conductive leads joined to the plurality of pads such that there is one conductive lead joined to one pad in each of the openings of the shield and at least a portion of each of the plurality of openings being conductive, the shield forming a barrier between adjacent pads of the plurality of pads;
connection means to connect the conductive portions of each of the plurality of openings to a fault detect and error handling circuit; and
the fault detect and error handling circuit to detect a tin whisker from the one of the plurality of conductive leads contained within the one of the openings in contact with the conductive portion in the one of the openings.

11. The electrical apparatus of claim 10 wherein the shield comprising a body having the plurality of openings, the body being nonconductive and further comprising a metal coating over the body of the shield.

12. The electrical apparatus of claim 11 wherein the connection means comprising conductive wiring between the conductive portions and the metal coating and conductive wiring between the metal coating and the fault detect and error handling circuit.

13. The electrical apparatus of claim 10 wherein the shield comprising a body having the plurality of openings, the body comprising a conductive material.

14. The electrical apparatus of claim 13 wherein the connection means comprising the body and conductive wiring between the body and the fault detect and error handling circuit.

15. The electrical apparatus of claim 10 wherein the shield having a wall between each of the openings that acts as a mechanical barrier to the tin whisker making physical contact with an adjacent conductive lead or pad.

16. The electrical apparatus of claim 10 wherein the shield fully covers the electronic component and the conductive leads.

17. A method of detecting a tin whisker in an electronic apparatus comprising an electronic component having a plurality of soldered conductive leads that are joined to corresponding pads on an electronic substrate, the method comprising:
enclosing the soldered conductive leads with a shield placed on a surface of the electronic substrate and covering the electronic component, the shield having a plurality of openings with the plurality of openings aligned over the plurality of conductive leads joined to the plurality of pads such that there is one conductive lead joined to one pad in each of the openings of the shield and at least a portion of each of the plurality of openings being conductive, the shield forming a barrier between adjacent pads of the plurality of pads;
sensing a tin whisker contacting one of the conductive portions, the contacting causing the generation of an electrical signal;
communicating the electrical signal to a fault detect and error handling circuit which indicates the tin whisker contacting one of the conductive portions in the shield; and
generating an alert by the fault detect and error handling circuit that a risk of tin whisker growth is present.

18. The method of claim 17 wherein the shield comprising a body having the plurality of openings, the body being nonconductive and further comprising a metal coating over the body of the shield.

19. The method of claim 17 wherein the shield comprising a body having the plurality of openings, the body comprising a conductive material.

20. The method of claim 17 further comprising registering in a computer register the tin whisker contacting one of the conductive portions in the shield.

Assignees

• IBM

Inventors

• Judd Jeffrey N
• Doyle Matthew
• Kelly Matthew S
• Newshutz Henry M
• Tofil Timothy J
• Jeanson Mark J

Classifications

• G01R31/2812 Primary

  Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance (of connections G01R31/66) · CPC title

• H05K2201/0769

  Anti metal-migration, e.g. avoiding tin whisker growth · CPC title

• H05K2201/10371

  Shields or metal cases · CPC title

• H05K3/3421

  Leaded components · CPC title

• H05K2201/10689

  Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL] · CPC title