Micro assembler with fine angle control

Patent metadata

Field	Value
Publication number	US-11615976-B2
Application number	US-202217690485-A
Country	US
Kind code	B2
Filing date	Mar 9, 2022
Priority date	Dec 17, 2018
Publication date	Mar 28, 2023
Grant date	Mar 28, 2023

Abstract

First and second chiplets are positioned along a surface to respectively cover first and second electrodes. The first electrode is activated to cause an attraction force between the first electrode and the first chiplet. The second electrode is deactivated allowing the second chiplet to rotate on the surface. While the first electrode is activated and the second electrode is deactivated, a rotation field is applied to cause the second chiplet to be oriented at a desired orientation angle, the first chiplet being prevented from rotating by the attraction force.

First claim

The invention claimed is:

1. An apparatus, comprising:
a first and second electrodes arranged along a surface such that first and second chiplets are positioned to respectively cover the first and second electrodes;
an interface circuit operable to individually activate and deactivate the first and second electrodes;
a field generator operable to apply a rotation field that causes a rotation of the first and second chiplets on the surface; and
a processor coupled to the interface circuit and the field generator, the processor operable to:
activate the first electrode to cause an attraction force between the first electrode and the first chiplet;
deactivate the second electrode allowing the second chiplet to rotate on the surface; and
while the first electrode is activated and the second electrode is deactivated, apply the rotation field to cause the second chiplet to be oriented at a desired orientation angle, the first chiplet being prevented from rotating by the attraction force.

2. The apparatus of claim 1 , wherein the rotation field comprises a magnetic field and wherein the attraction force comprises an electrostatic field.

3. The apparatus of claim 2 , wherein the magnetic field is generated by a first pair of coils located on a first pair of opposite sides of the surface and a second pair of coils located on a second pair of opposite sides of the surface different from the first pair of opposite sides, the angle of the rotation field selectable by varying first and second currents applied to the respective first and second pairs of coils.

4. The apparatus of claim 2 , wherein the magnetic field is generated by a pair of magnets, the angle of the rotation field being selected via relative rotation between the magnets and the surface.

5. The apparatus of claim 2 , wherein the first and second chiplets comprise patterned magnetic material such that the chiplets will align with the magnetic field.

6. The apparatus of claim 2 , wherein the first and second chiplets have an anisotropic magnetic response.

7. The apparatus of claim 2 , wherein the first chiplet is positioned to cover the first electrode and a third electrode different from the first and second electrodes, wherein one of the first electrode and the third electrode is selected to be activated, the selected electrode minimizing an induced electric field that interferes with the magnetic field.

8. The apparatus of claim 1 , wherein applying the rotation field comprises time-varying the rotation field around the desired orientation angle to induce small movements in the second chiplet, the small movements overcoming stiction between the second chiplet and the surface.

9. The apparatus of claim 1 , wherein the first and second chiplets comprises 2-D material.

10. The apparatus of claim 9 , wherein the 2-D material comprises graphene.

11. The apparatus of claim 1 , wherein the surface is covered by a dielectric fluid that assists in smooth movements of the first and second chiplets on the surface.

12. A method, comprising:
positioning first and second chiplets along a surface to respectively cover first and second electrodes;
activating the first electrode to cause an attraction force between the first electrode and the first chiplet;
deactivating the second electrode allowing the second chiplet to rotate on the surface; and
while the first electrode is activated and the second electrode is deactivated, applying a rotation field to cause the second chiplet to be oriented at a desired orientation angle, the first chiplet being prevented from rotating by the attraction force.

13. The method of claim 12 , wherein the rotation field comprises a magnetic field and wherein the attraction force comprises an electrostatic field.

14. The method of claim 13 , wherein the magnetic field is generated by a first pair of coils located on a first pair of opposite sides of the surface and a second pair of coils located on a second pair of opposite sides of the surface different from the first pair of opposite sides, the angle of the rotation field selectable by varying first and second currents applied to the respective first and second pairs of coils.

15. The method of claim 13 , wherein the magnetic field is generated by a pair of magnets, the angle of the rotation field being selected via relative rotation between the magnets and the surface.

16. The method of claim 13 , wherein the first and second chiplets comprise patterned magnetic material such that the chiplets will align with the magnetic field.

17. The method of claim 13 , wherein the first and second chiplets have an anisotropic magnetic response.

18. The method of claim 13 , wherein the first chiplet is positioned to cover the first electrode and a third electrode different from the first and second electrodes, wherein one of the first electrode and the third electrode is selected to be activated, the selected electrode minimizing an induced electric field that interferes with the magnetic field.

19. The method of claim 12 , wherein applying the rotation field comprises time-varying the rotation field around the desired orientation angle to induce small movements in the second chiplet, the small movements overcoming stiction between the second chiplet and the surface.

20. The method of claim 12 , wherein the surface is covered by a dielectric fluid that assists in smooth movements of the first and second chiplets on the surface.

Assignees

• Palo Alto Res Ct Inc

Inventors

• Lu Jengping
• Chow Eugene M
• Biegelsen David K

Classifications

• H10P72/722

  Details of electrostatic chucks · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/50 Primary

  for positioning, orientation or alignment · CPC title

• B82B3/0066

  Orienting nanostructures · CPC title

• B81C99/002 Primary

  Apparatus for assembling MEMS, e.g. micromanipulators (micromanipulators per se B25J7/00) · CPC title