Radio-frequency module and communication device

Patent metadata

Field	Value
Publication number	US-11611367-B2
Application number	US-202117313002-A
Country	US
Kind code	B2
Filing date	May 6, 2021
Priority date	Jun 10, 2020
Publication date	Mar 21, 2023
Grant date	Mar 21, 2023

Abstract

A radio-frequency module includes a mount board, an antenna terminal and a ground terminal, a low-noise amplifier, a first inductor, and a second inductor. The mount board has a first principal surface and a second principal surface on opposite sides of the mount board from one another. The low-noise amplifier includes a transistor configured to amplify a signal. The first inductor is disposed on one of the first principal surface and the second principal surface of the mount board. The first inductor is connected to the antenna terminal. The second inductor is disposed on the other of the first principal surface and the second principal surface of the mount board. The second inductor is connected between the transistor and the ground terminal.

First claim

What is claimed is:

1. A radio-frequency module comprising:
a mount board having a first principal surface and a second principal surface on opposite sides of the mount board from one another;
an antenna terminal and a ground terminal disposed on the mount board;
a low-noise amplifier disposed on the mount board and including a transistor configured to amplify a signal;
a first inductor disposed on one of the first principal surface and the second principal surface of the mount board and connected to the antenna terminal; and
a second inductor disposed on the other of the first principal surface and the second principal surface of the mount board and connected between the transistor and the ground terminal.

2. The radio-frequency module according to claim 1 , wherein
the antenna terminal and the ground terminal are disposed on the second principal surface of the mount board,
the first inductor is disposed on the first principal surface of the mount board, and
the second inductor is disposed on the second principal surface of the mount board.

3. The radio-frequency module according to claim 2 , wherein a footprint of the first inductor does not overlap a footprint of the second inductor in plan view in a direction of thickness of the mount board.

4. The radio-frequency module according to claim 3 , further comprising:
a reception filter connected to the antenna terminal, with a matching circuit including the first inductor interposed therebetween; and
an input matching circuit connected between the reception filter and an input terminal of the low-noise amplifier,
wherein the input matching circuit includes
a third inductor connected in series to the low-noise amplifier, and
a fourth inductor connected between a ground and a node in a signal path between the reception filter and the third inductor,
the third inductor and the fourth inductor are disposed on the first principal surface of the mount board, and
at least part of a footprint of the third inductor overlaps the footprint of the second inductor in plan view in the direction of thickness of the mount board.

5. The radio-frequency module according to claim 4 , wherein the third inductor and the fourth inductor are adjacent in plan view in the direction of thickness of the mount board.

6. The radio-frequency module according to claim 5 , further comprising a package containing the third inductor and the fourth inductor.

7. The radio-frequency module according to claim 6 , further comprising an integrated circuit chip including the low-noise amplifier and the second inductor.

8. The radio-frequency module according to claim 5 , further comprising an integrated circuit chip including the low-noise amplifier and the second inductor.

9. The radio-frequency module according to claim 5 , further comprising:
a power amplifier disposed on the first principal surface of the mount board,
wherein a footprint of the power amplifier does not overlap a footprint of the low-noise amplifier in plan view in a direction of thickness of the mount board.

10. The radio-frequency module according to claim 4 , further comprising a package containing the third inductor and the fourth inductor.

11. The radio-frequency module according to claim 10 , further comprising an integrated circuit chip including the low-noise amplifier and the second inductor.

12. The radio-frequency module according to claim 4 , further comprising an integrated circuit chip including the low-noise amplifier and the second inductor.

13. The radio-frequency module according to claim 4 , further comprising:
a power amplifier disposed on the first principal surface of the mount board,
wherein a footprint of the power amplifier does not overlap a footprint of the low-noise amplifier in plan view in a direction of thickness of the mount board.

14. The radio-frequency module according to claim 3 , further comprising an integrated circuit chip including the low-noise amplifier and the second inductor.

15. The radio-frequency module according to claim 3 , further comprising:
a power amplifier disposed on the first principal surface of the mount board,
wherein a footprint of the power amplifier does not overlap a footprint of the low-noise amplifier in plan view in a direction of thickness of the mount board.

16. The radio-frequency module according to claim 2 , further comprising an integrated circuit chip including the low-noise amplifier and the second inductor.

17. The radio-frequency module according to claim 2 , further comprising:
a power amplifier disposed on the first principal surface of the mount board,
wherein a footprint of the power amplifier does not overlap a footprint of the low-noise amplifier in plan view in a direction of thickness of the mount board.

18. The radio-frequency module according to claim 1 , further comprising an integrated circuit chip including the low-noise amplifier and the second inductor.

19. The radio-frequency module according to claim 1 , further comprising:
a power amplifier disposed on the first principal surface of the mount board,
wherein a footprint of the power amplifier does not overlap a footprint of the low-noise amplifier in plan view in a direction of thickness of the mount board.

20. A communication device comprising:
a radio-frequency module; and
a signal processing circuit connected to the radio-frequency module and configured to process a radio-frequency signal, wherein the radio-frequency module includes
a mount board having a first principal surface and a second principal surface on opposite sides of the mount board from one another,
an antenna terminal and a ground terminal disposed on the mount board,
a low-noise amplifier disposed on the mount board and including a transistor configured to amplify a signal,
a first inductor disposed on one of the first principal surface and the second principal surface of the mount board and connected to the antenna terminal, and
a second inductor disposed on the other of the first principal surface and the second principal surface of the mount board and connected between the transistor and the ground terminal.

Assignees

• Murata Manufacturing Co

Inventors

• Miyazaki Daisuke
• Akagi Hidemori

Classifications

• H03F2200/222

  A circuit being added at the input of an amplifier to adapt the input impedance of the amplifier · CPC title

• H03F3/195

  in integrated circuits · CPC title

• H03F1/56

  Modifications of input or output impedances, not otherwise provided for · CPC title

• H03F2203/7209

  the gated amplifier being switched from a first band to a second band · CPC title

• H03F2200/294

  the amplifier being a low noise amplifier [LNA] · CPC title