Dummy fill structures

Patent metadata

Field	Value
Publication number	US-11610839-B2
Application number	US-201916666808-A
Country	US
Kind code	B2
Filing date	Oct 29, 2019
Priority date	Oct 29, 2019
Publication date	Mar 21, 2023
Grant date	Mar 21, 2023

Abstract

The present disclosure relates to semiconductor structures and, more particularly, to dummy fill structures and methods of manufacture. The structure includes: a passive device formed in interlevel dielectric material; and a plurality of metal dummy fill structures composed of at least one main branch and two extending legs from at least one side of the main branch, the at least two extending legs being positioned and structured to suppress eddy currents of the passive device.

First claim

What is claimed:

1. A structure, comprising:
a passive device formed in interlevel dielectric material; and
a plurality of metal dummy fill structures composed of at least one main branch and two extending legs from at least one side of the main branch, the at least two extending legs being positioned and structured to suppress eddy currents of the passive device, the plurality of metal dummy fill structures provided at least at a same level and underneath of the passive device within the interlevel dielectric material.

2. The structure of claim 1 , wherein the plurality of metal dummy fill structures are provided within an inductor-forming region of the passive device.

3. The structure of claim 1 , wherein the plurality of metal dummy fill structures are provided below and within an inductor-forming region of the passive device.

4. The structure of claim 1 , wherein the passive device is an inductor.

5. The structure of claim 1 , wherein the plurality of metal dummy fill structures are configured in an “E” shape.

6. The structure of claim 1 , wherein the plurality of metal dummy fill structures are configured in a “S” shape with each leg of the “S” shape being a straight portion parallel and/or orthogonally located with respect to one another.

7. The structure of claim 1 , wherein the at least one main branch is a vertically oriented main branch and the at least two extending legs are orthogonal from the vertically oriented main branch, extending from opposite sides of the vertically oriented main branch.

8. The structure of claim 7 , wherein the vertically oriented main branch includes ends extending beyond an upper leg and lower leg of the of least two extending legs.

9. The structure of claim 1 , wherein the at least one main branch is vertically oriented with respect to pairs of opposing legs extending from the at least one main branch.

10. The structure of claim 1 , wherein the plurality of metal dummy fill structures occupy a predetermined area of an integrated circuit under and/or within a wiring pattern of the passive device.

11. The structure of claim 1 , wherein the plurality of metal dummy fill structures comprises at least three legs extending outward from at least one side of the at least one main branch.

12. A structure comprising:
an inductor with multiple metal windings; and
a plurality of metal dummy fill structures composed of extending metal legs from a metal branch, wherein at least the extending metal legs confine and suppress eddy currents of the inductor and the plurality of metal dummy fill structures are provided below the inductor wherein the plurality of metal dummy fill structures occupy about 15% to 20% of a predetermined area of an integrated circuit under and/or within a wiring pattern of the multiple metal windings.

13. The structure of claim 12 , wherein the plurality of metal dummy fill structures are within an inductor-forming region.

14. The structure of claim 12 , wherein the plurality of metal dummy fill structures are configured in an “E” shape.

15. The structure of claim 12 , wherein the plurality of metal dummy fill structures are configured in a “S” shape with each leg of the “S” shape is a straight portion parallel and/or orthogonal with respect to one another.

16. The structure of claim 12 , wherein the plurality of metal dummy fill structures each comprise a vertically oriented main branch and a plurality of legs orthogonal from the vertically oriented main branch, the plurality of legs extending from opposite sides of the vertically oriented main branch.

17. The structure of claim 12 , wherein the plurality of metal dummy fill structures comprises at least three legs extending outward from at least one side of the at least one main branch.

18. A method, comprising:
forming a passive device formed in interlevel dielectric material; and
forming a plurality of metal dummy fill structures composed of at least one main branch and two extending legs, the at least two extending legs being positioned and structured to suppress eddy currents of the passive device, the plurality of metal dummy fill structures formed at least at a same level and underneath of the passive device within the interlevel dielectric material.

19. The structure of claim 1 , wherein, at a same level of the interlevel dielectric material, the plurality of metal dummy fill structures partially extend within a height of the interlevel dielectric material and the passive device extends from a bottom surface to a top surface the interlevel dielectric material.

Assignees

• Globalfoundries Us Inc

Inventors

• Lee Tung-Hsing
• Lin Teng-Yin
• Mont Frank W
• Gordon Edward J
• Elkadi Asmaa
• Martin Alexander
• Lee Won Suk
• Shampur Anvitha

Classifications

• H10W20/497 Primary

  Inductive arrangements or effects of, or between, wiring layers · CPC title

• H10D1/20 Primary

  Inductors · CPC title

• H01F27/2804

  Printed windings · CPC title

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H01F2027/2809

  on stacked layers · CPC title