Semiconductor Devices and Methods of Manufacture Thereof
US-2015255581-A1 · Sep 10, 2015 · US
US11610773B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11610773-B2 |
| Application number | US-202016830420-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 26, 2020 |
| Priority date | Nov 17, 2017 |
| Publication date | Mar 21, 2023 |
| Grant date | Mar 21, 2023 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Embodiments described herein relate to a high pressure processing system with a condenser and methods for utilizing the same. The processing system includes a process chamber, a boiler, a condenser, and one or more heat exchangers. The boiler generates a fluid, such as a vapor or supercritical fluid, and delivers the fluid to the process chamber where a substrate is processed. After processing the substrate, the system is depressurized and the fluid is delivered to the condenser where the fluid is condensed.
Opening claim text (preview).
What is claimed is: 1. A substrate process method, comprising: heating a boiler in fluid communication with a process chamber, a condenser, and a fluid collection unit; closing a boiler valve disposed on a conduit connecting the boiler and the process chamber; opening valves disposed on conduits connecting the fluid collection unit and the process chamber; positioning a substrate in the process chamber; heating the process chamber; closing the valves disposed on conduits connecting the fluid collection unit and the process chamber; opening the boiler valve to enable fluid flow between the boiler and the process chamber; flowing a heated fluid from the boiler to the process chamber; processing the substrate with the heated fluid; opening valves disposed on conduits connecting the condenser and the process chamber process to enable fluid flow between the process chamber and the condenser; and depressurizing the process chamber by flowing the heated fluid from the process chamber to the condenser. 2. The method of claim 1 , wherein the conduits connecting the fluid collection unit and the process chamber, and conduits connecting an exhaust and the process chamber, are heated. 3. The method of claim 1 , wherein conduits connecting a fluid source and the process chamber are heated. 4. The method of claim 1 , wherein the boiler is in fluid communication with a water source. 5. The method of claim 4 , further comprising: heating conduits connecting the fluid collection unit and the condenser to a temperature of between about 30° C. and about 100° C. 6. The method of claim 1 , wherein the boiler is in fluid communication with an NH 3 source. 7. The method of claim 1 , further comprising: detecting an amount of condensed fluid in the condenser; determining when the amount of condensed fluid is above a predetermined threshold; and delivering the condensed fluid to the fluid collection unit. 8. The method of claim 4 , wherein the fluid is water vapor. 9. The method of claim 4 , further comprising: heating conduits connecting the fluid collection unit and the condenser to a temperature of between about 275° C. and about 300° C. 10. The method of claim 4 , wherein the process chamber is heated to a temperature of between about 450° C. and about 500° C. 11. The method of claim 5 , wherein the fluid is supercritical CO 2 . 12. The method of claim 5 , further comprising: heating conduits connecting the process chamber to fluid sources, the conduits connecting the process chamber and the condenser, and conduits connecting the process chamber to heat exchangers, to a temperature of between about 30° C. and about 100° C.; and pressurizing the boiler. 13. The method of claim 5 , further comprising: pressurizing the process chamber to between about 80 bar and about 100 bar; and heating the process chamber to about 100° C. 14. The method of claim 5 , wherein opening valves disposed on conduits connecting the process chamber to a heat exchanger reduces a temperature of the fluid. 15. The method of claim 5 , wherein the condenser is maintained at a temperature of between about 8° C. and about 10° C. 16. The method of claim 6 , wherein the fluid is supercritical NH 3 . 17. The method of claim 9 , wherein the process chamber is pressurized to between about 40 bar and about 50 bar.
Related publications grouped by family.
Answers are generated from the same data shown on this page.