Fully implanted, wireless, flexible CMOS surface recording device

US11607538B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11607538-B2
Application numberUS-201816604348-A
CountryUS
Kind codeB2
Filing dateApr 10, 2018
Priority dateApr 10, 2017
Publication dateMar 21, 2023
Grant dateMar 21, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A fully implanted integrated, wireless, flexible CMOS chip for long-term recording and stimulation of the brain in vivo and methods of manufacturing thereof are provided. The chip is an entire biocompatible system and can include the dense surface electrode array, the underlying CMOS integrated circuit architecture, integrated wireless powering and telemetry. Furthermore, miniaturization through manufacturing, permits implantation of the chip under the skull and other regions of interest with no wires or connections. Furthermore, these devices and systems can operate under a dual modality such as to be able to record and stimulate the surface of the brain and/or tissue in which they have been implanted.

First claim

Opening claim text (preview).

The invention claimed is: 1. An implantable neural recording and stimulation device comprising: a flexible and thinned complementary metal-oxide-semiconductor (CMOS) chip configured to be positioned on a pial surface of a brain; and an array of electrodes integrated into the CMOS chip configured to at least one of record or stimulate one or more analog signals from each of the electrodes. 2. The device of claim 1 , further comprising power harvesting circuitry configured to power the CMOS chip. 3. The device of claim 1 , further comprising a microcontroller coupled to the electrodes and configured to control the recording or stimulating of the one or more analog signals. 4. The device of claim 1 , further comprising one or more analog-to-digital (ADC) converters coupled to the array of electrodes and configured to digitize the one or more analog signals. 5. The device of claim 1 , further comprising: a multiplexer configured to combine the one or more analog signals into a single analog signal; and an analog to digital converter (ADC) coupled to the multiplexer and configured to digitize the single analog signal. 6. The device of claim 5 , wherein the ADC is a Successive-Approximation-Register (SAR) ADC. 7. The device of claim 5 , further comprising one or more amplifiers coupled to the electrodes and the multiplexer. 8. The device of claim 1 , further comprising a first set of antennas integrated into the CMOS chip and configured to receive power. 9. The device of claim 8 , further comprising a second set of antennas integrated into the CMOS chip and configured to receive and transmit one or more digital signals. 10. The device of claim 9 , wherein the first set of antennas and the second set of antennas operate at least two decades apart in frequency to reduce interference. 11. The device of claim 1 , wherein the CMOS chip is configured to have a thickness of 10 μm or less. 12. The device of claim 1 , wherein the electrodes are deposited with a HfO2 composition. 13. The device of claim 1 , further comprising an antialiasing filter coupled to the electrodes. 14. The device of claim 1 , wherein a back side of the device is passivated with parylene, silicon dioxide, or both. 15. A system for neural recording and stimulation, comprising: an implantable neural recording and stimulation device comprising: a flexible and thinned complementary metal-oxide-semiconductor (CMOS) chip configured to be positioned on a pial surface of a brain; and an array of electrodes integrated into the CMOS chip configured to at least one of record or stimulate one or more analog signals from each of the electrodes; external relay circuitry communicatively coupled to the implantable neural recording and stimulation device and configured to wirelessly power and transmit one or more signals from the implantable neural recording and stimulation device; and a hardware processor communicatively coupled to the external relay circuitry and configured to process the transmitted one or more signals. 16. The system of claim 15 , wherein the external relay circuitry comprises a transceiver configured to transmit one or more signals from the implantable neural recording and stimulation device. 17. The system of claim 15 , wherein the external relay circuitry further comprises a controller configured to control the implantable neural recording and stimulation device. 18. The system of claim 17 , wherein the controller is configured to select an operation mode for one or more blocks of electrodes contained in the array of electrodes. 19. The system of claim 18 , wherein the selected operation mode is a stimulation mode and wherein the controller generates one or more commands for patterned stimulation using the one or more blocks of electrodes. 20. The system of claim 18 , wherein the selected operation mode is a sensing mode using the one or more blocks of electrodes. 21. The system of claim 15 , wherein the hardware processor is configured to detect one or more multi-neuronal events and compute a set of associated parameters. 22. The system of claim 21 , wherein the hardware processor is further configured to generate clusters of the set of parameters and identify the one or more detected multi-neuronal events.

Assignees

Inventors

Classifications

  • A61N1/0534Primary

    Electrodes for deep brain stimulation · CPC title

  • from an external energy source · CPC title

  • A61B5/0031Primary

    Implanted circuitry · CPC title

  • in a matrix array · CPC title

  • Changing the program; Upgrading firmware · CPC title

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Frequently asked questions

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What does patent US11607538B2 cover?
A fully implanted integrated, wireless, flexible CMOS chip for long-term recording and stimulation of the brain in vivo and methods of manufacturing thereof are provided. The chip is an entire biocompatible system and can include the dense surface electrode array, the underlying CMOS integrated circuit architecture, integrated wireless powering and telemetry. Furthermore, miniaturization throug…
Who is the assignee on this patent?
Univ Columbia
What technology area does this patent fall under?
Primary CPC classification A61N1/0534. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Mar 21 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).