Mobile terminal

Patent metadata

Field	Value
Publication number	US-11606453-B2
Application number	US-202117538108-A
Country	US
Kind code	B2
Filing date	Nov 30, 2021
Priority date	Sep 29, 2017
Publication date	Mar 14, 2023
Grant date	Mar 14, 2023

Abstract

The present disclosure discloses a mobile terminal, including a case forming a portion of an appearance; a circuit board disposed inside the case; a flexible printed circuit board electrically connected to the circuit board; a first connector mounted on the circuit board; a second connector mounted on the flexible printed circuit board and fastened to the first connector; and a first antenna having array elements mounted on the flexible printed circuit board, wherein the first antenna is disposed to face a side surface of the case to radiate beam-formed wireless signals through the side surface adjacent to one side of the circuit board.

First claim

What is claimed is:

1. A mobile terminal having a front surface, a rear surface, and side surfaces, comprising:
a window disposed at a front side of the mobile terminal;
a case forming an appearance of the side surfaces of the mobile terminal;
a rear cover disposed at a rear side of the mobile terminal;
a circuit board including an integrated circuit;
a first antenna module comprising:
a first antenna substrate; and

a first array antenna disposed on one side of the first antenna substrate and configured to transceive first beam-formed wireless signals using a plurality of antenna elements disposed on the first antenna substrate;
an interposer disposed between the circuit board and the first antenna module,
wherein the first antenna module is electrically coupled with the circuit board by the interposer,
wherein the integrated circuit is disposed between the circuit board and the first antenna substrate,
wherein the first array antenna is disposed to face the rear cover and configured to transceive the first beam-formed wireless signals through the rear cover, and
wherein the first array antenna is configured to operate in a 5G communication system using a mmWave band.

2. The mobile terminal of claim 1 ,
wherein the case comprises a side metal portion and a rear metal portion,
wherein the rear metal portion has a first opening, and
wherein the side metal portion has a second opening.

3. The mobile terminal of claim 2 ,
wherein the first array antenna is disposed to face the first opening for transceiving the first beam-formed wireless signals.

4. The mobile terminal of claim 2 , further comprising a second array antenna module;
wherein the second array antenna module comprises a second array antenna and a second antenna substrate,
wherein the second array antenna is configured to transceive second beam-formed wireless signals, and
wherein the second array antenna is disposed to face the second opening for transceiving the second beam-formed wireless signals.

5. The mobile terminal of claim 4 ,
wherein the first antenna substrate and the second antenna substrate form one piece.

6. The mobile terminal of claim 1 ,
further comprising another antenna formed in the metal portion of the case configured to operate in a 4G communication system.

7. A mobile terminal comprising:
a window disposed at a front side of the mobile terminal;
a case having side surfaces and a rear surface,
the rear surface having a first metal portion,
the first metal portion having a first opening;
a rear cover disposed at a rear side of the mobile terminal;
a circuit board including an integrated circuit;
a first antenna module comprising:
a first antenna substrate; and
a first array antenna disposed on one side of the first antenna substrate and configured to transceive first beam-formed wireless signals using a plurality of first antenna elements disposed on the first antenna substrate;

an interposer disposed between the circuit board and the first antenna substrate,
wherein the first antenna module is electrically coupled with the circuit board by the interposer,
wherein the integrated circuit is disposed between the circuit board and the first antenna substrate,
wherein the first array antenna is disposed to face the first opening and configured to transceive the first beam-formed wireless signals through the first opening, and
wherein the first array antenna is configured to operate in a 5G communication system using a mmWave band.

8. The mobile terminal of claim 7 ,
wherein the side surface of the case comprises a second metal portion, and
wherein the second metal portion has a second opening.

9. The mobile terminal of claim 8 , further comprising a second array antenna module;
wherein the second array antenna module comprises a second array antenna and a second antenna substrate,
wherein the second array antenna is configured to transceive second beam-formed wireless signals, and
wherein the second array antenna is disposed to face the second opening for transceiving the second beam-formed wireless signals.

10. The mobile terminal of claim 9 ,
wherein the first antenna substrate and the second antenna substrate form one piece.

11. The mobile terminal of claim 7 , further comprising another antenna formed in the metal portion of the case configured to operate in a 4G communication system.

Assignees

• Lg Electronics Inc

Inventors

• Lee Jaewon
• Ryu Seungwoo
• Lee Joohee
• Jung Junyoung
• Kim Jaewan
• Park Sangjo

Classifications

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q1/243

  with built-in antennas · CPC title

• H04B1/38

  Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving · CPC title

• H04M1/0274

  for an electrical connector module · CPC title

• H01Q1/40

  Radiating elements coated with or embedded in protective material · CPC title