Wireless communication device with leaky-wave phased array antenna

Patent metadata

Field	Value
Publication number	US-10522900-B2
Application number	US-201615291488-A
Country	US
Kind code	B2
Filing date	Oct 12, 2016
Priority date	Jan 11, 2016
Publication date	Dec 31, 2019
Grant date	Dec 31, 2019

Abstract

A wireless communication device including an antenna device is provided. The wireless a communication device includes a housing having a conductive structure, a millimeter wave (mmWave) antenna having a plurality of antenna elements, the mmWave antenna being disposed within the housing, and a leaky-wave radiator having at least one opening formed in the conductive structure of the housing. An electromagnetic field generated by the mmWave antenna may be radiated outside of the housing of the wireless communication device through the leaky-wave radiator. The wireless communication device and/or an electronic device may be diversified according to embodiments.

First claim

What is claimed is:

1. A wireless communication device, comprising:
a housing configured to include a conductive structure;
a millimeter wave (mmWave) antenna configured to include a plurality of antenna elements, the mmWave antenna configured to be disposed within the housing;
a leaky-wave radiator configured to include at least one opening formed in the conductive structure of the housing, the leaky-wave radiator configured to operate as a leaky-wave antenna structure by being coupled with an electromagnetic field generated by the mmWave antenna;
a synthetic resin body configured to be inserted into the at least one opening; and
at least one parasitic conductor configured to be formed in the synthetic resin body,
wherein a side face of the synthetic resin body is configured to be exposed to the outside of the housing, and
wherein the electromagnetic field generated by the mmWave antenna is radiated outside of the housing of the wireless communication device through the leaky-wave radiator.

2. The wireless communication device of claim 1 , wherein at least one side wall of the housing is configured to include the conductive structure.

3. The wireless communication device of claim 1 ,
wherein the at least one opening formed in the conductive structure of the housing is an elongated slot formed in at least one side wall of the housing or over two adjacent side walls of the housing, and
wherein the synthetic resin body is configured to form a beam deflector in the elongated slot.

4. The wireless communication device of claim 3 ,
wherein a radiation direction of the electromagnetic field is based on selectively feeding power to the plurality of antenna elements, and
wherein the at least one opening formed in the conductive structure of the housing is configured to form an electromagnetic coupling with the plurality of antenna elements of the mmWave antenna.

5. The wireless communication device of claim 1 , wherein the parasitic conductor is configured to include a conductive pattern formed in the synthetic resin body or at least one conductive element received in the synthetic resin body.

6. The wireless communication device of claim 1 ,
wherein the wireless communication device is configured to operate in at least one beamforming mode of an array mode using an array of the antenna elements, a leaky-wave mode using the leaky-wave radiator, and a mixed mode implementing a combination of the array mode and the leaky-wave mode.

7. The wireless communication device of claim 1 , wherein the leaky-wave radiator is further configured to include an array of a plurality of openings formed in the conductive structure of the housing.

8. The wireless communication device of claim 1 , further comprising:
a first planar conductor configured to be disposed adjacent to the conductive structure of the housing; and
a second planar conductor configured to be disposed facing the first planar conductor and adjacent the conductive structure of the housing,
wherein the plurality of antenna elements is configured to be arranged facing an inner surface of a side wall of the housing and between the first planar conductor and the second planar conductor.

9. The wireless communication device of claim 8 , wherein at least one of the first planar conductor and the second planar conductor is at least partially surrounded by the side wall of the housing.

10. The wireless communication device of claim 8 , further comprising:
a circuit board configured to be disposed between the first planar conductor and the second planar conductor,
wherein the plurality of antenna elements is formed on the circuit board.

11. The wireless communication device of claim 8 , further comprising:
a circuit board,
wherein the first planar conductor and the second planar conductor are formed on two different layers of the circuit board, respectively, and
wherein the plurality of antenna elements is formed on the circuit board adjacent to the conductive structure of the housing.

12. The wireless communication device of claim 11 , further comprising:
a third planar conductor formed on the circuit board, the third planar conductor connecting the first planar conductor with the second planar conductor,
wherein the first planar conductor, the second planar conductor, and the third planar conductor are configured to form a waveguide at least partially surrounding an array of the plurality of antenna elements.

13. The wireless communication device of claim 11 , wherein the circuit board is formed of any one of a printed circuit board (PCB) and a low temperature co-fired ceramic (LTCC) board.

14. The wireless communication device of claim 11 ,
wherein the plurality of antenna elements is formed in a portion of the circuit board positioned adjacent to an edge of the circuit board, and
wherein the portion of the circuit board positioned adjacent to the edge of the circuit board is configured to function as a dielectric transformer matching the plurality of antenna elements.

15. An electronic device, comprising:
a housing configured to include a conductive structure, the conductive structure having at least one opening;
a circuit board configured to include at least a portion disposed adjacent to the conductive structure in the housing;
a plurality of antenna elements configured to be disposed on the circuit board;
a synthetic resin body configured to be inserted into the at least one opening; and
at least one parasitic conductor configured to be formed in the synthetic resin body,
wherein a side face of the synthetic resin body is configured to be exposed to the outside of the housing,
wherein the plurality of antenna elements corresponds to the at least one opening in the conductive structure of the housing,
wherein the at least one opening in the conductive structure of the housing is configured to operate as a leaky-wave antenna structure by being coupled with electromagnetic field generated by the plurality of antenna elements, and
wherein an electromagnetic field generated by the plurality of antenna elements is radiated outside of the housing through the at least one opening in the conductive structure of the housing.

16. The electronic device of claim 15 ,
wherein the conductive structure is configured to include a plurality of the openings, and
wherein the plurality of openings included in the conductive structure forms a leaky-wave radiator to radiate the electromagnetic field outside of the housing.

17. The electronic device of claim 15 ,
wherein the synthetic resin body is configured to form a beam deflector.

18. The electronic device of claim 15 , wherein the at least one opening is configured to include an acoustic hole.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Khripkov Alexander Nikolaevich
• Evtyushkin Gennadiy Alexandrovich
• LUKYANOV Anton Sergeevich
• Hong Won-Bin

Classifications

• H01Q1/243 Primary

  with built-in antennas · CPC title

• H01Q13/22 Primary

  Longitudinal slot in boundary wall of waveguide or transmission line {(H01Q13/203 takes precedence)} · CPC title

• H01Q1/42

  Housings not intimately mechanically associated with radiating elements, e.g. radome · CPC title

• H01Q1/50

  Structural association of antennas with earthing switches, lead-in devices or lightning protectors · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title